96 results about "Wafer Product" patented technology

The invention discloses a method for detecting and positioning an anchor frame and a notch point of a good wafer product, which comprises the following steps of: cutting an input wafer image data set, and carrying out normalization processing to obtain a preprocessed image; the improved YOLOv5-Seg model is trained by adopting the preprocessed image, and the learning ability of the model is enhanced by adopting a self-adaptive data enhancement method designed by the invention in the training process; the improved YOLOv5-Seg model comprises three parts, namely, an OfficientVit-Backbone part, a Neck part and a Head part; performing target detection and mask segmentation on an input wafer image by adopting the trained model to obtain a detection frame of each good wafer product and a mask segmentation result of the detection frame; according to a mask segmentation result, fitting by adopting a least square method to obtain the center and radius of a fitting circle of each good wafer product, and positioning a notch of the wafer according to the coordinates of the contour pixel points of the wafer and the corresponding radius of the contour pixel points of the wafer; and converting the notch of the wafer from the image coordinate system to the fitting circular coordinate system, and calculating the angle of the notch of the wafer relative to the rotary table based on the converted coordinate.

The utility model discloses a wafer product edge detection device, which comprises a marble platform and a marble cantilever, four corners below the marble platform are fixedly connected with air floating pads, the middle part of one end of the marble platform is fixedly connected with the marble cantilever, and the marble cantilever is fixedly connected with the air floating pads. A wafer rotating platform is fixedly connected to the middle of the upper portion of the marble platform, a wafer body is arranged above the rotating output end of the wafer rotating platform, and positioning air cylinder sets are arranged at the quartering positions, below the wafer body, of the wafer rotating platform. According to the utility model, the wafer rotating platform and the positioning air cylinder group are arranged, three groups of air cylinders for jacking are designed at the edge of the platform and are matched with corresponding conical heads, so that glass is positioned to the center and then stably falls onto the platform for measurement, and the center of the wafer is positioned, so that large eccentricity is avoided; therefore, the visual field of the camera group can be greatly reduced.

The utility model discloses a nitrogen bin for automatically storing wafers, which belongs to the field of storage equipment, is used for solving the problem of low efficiency of manual wafer storage and taking in the prior art, and comprises a bin body, a goods shelf, a conveying line and a material taking mechanism, the bin body is provided with a closed storage cavity, and the bin body is provided with a feed port and a discharge port which are communicated with the storage cavity; the goods shelf is arranged in the storage cavity and is used for placing wafers; the conveying line is arranged in the storage cavity and connected with the feeding port and the discharging port. The material taking mechanism comprises a moving module and a mechanical arm which are arranged in the storage cavity and connected with each other, the moving module is used for driving the mechanical arm to move between the goods shelf and the conveying line, and the mechanical arm is used for grabbing the conveying line or the wafers on the goods shelf and placing the wafers on the goods shelf or the conveying line. According to the wafer automatic storage nitrogen bin, the conveying line, the moving module and the manipulator cooperate to realize automatic storage and taking functions of wafers, so that the efficiency and the accuracy of wafer product storage and taking operation are improved.

The invention belongs to the field of 3D advanced packaging, and particularly relates to a technological method for cleaning flux of a wafer product for HBM packaging. The method comprises the following steps that a wafer product to be cleaned and packaged by the HBM is placed in a soaking unit casset containing a flux cleaning agent to be soaked, and the casset is vibrated up and down during soaking; the soaked wafer product is conveyed to a high-pressure photoresist removing unit, a flux cleaning agent is sprayed at high pressure, and the wafer product does reciprocating forward and reverse rotation motion along the axis of the circle center during spraying; the wafer after high-pressure spraying cleaning is conveyed to a normal-pressure cleaning unit, IPA is sprayed on the surface of the wafer, and during spraying, the wafer product does reciprocating forward and reverse rotation motion along the axis of the circle center; and the wafer product after IPA cleaning rotates at a high speed and is matched with N2 for drying at the same time. By adopting the cleaning method disclosed by the invention, the flux in the tiny gap between the Die can be efficiently cleaned, no cleaning agent residue is generated, a high-quality packaging effect is ensured, and the cost is relatively low.

This invention relates to the field of wafer fabrication technology, and proposes a robotic arm and wafer cleaning process for testing various types of wafer products. The robotic arm includes side grippers, a middle gripper, a first power component, and a second power component. Two side grippers are provided, each with both elastic and rigid gripping portions. The middle gripper is positioned between the two side grippers and also has a rigid gripping portion. The first power component adjusts the Y-axis distance between the two side grippers and simultaneously adjusts the X-axis distance between the side grippers and the middle gripper. The second power component drives the side grippers to rotate about the Z-axis. By incorporating a first power component, this invention allows adjustment of the distance between the two side grippers, thus accommodating the gripping of wafers of different sizes and specifications, and enabling the removal of wafers from stacking containers, making it highly convenient to use. Furthermore, it facilitates adjustment of the gripping direction of the side grippers, further improving the ease of application.

The utility model discloses a main shaft debugging tool which comprises a main shaft positioning piece, and the main shaft positioning piece is provided with a first positioning part and a first peripheral surface; the table surface positioning piece is provided with a second positioning part; the positioning connecting piece can be matched with the first positioning part and the second positioning part respectively, so that the axis of the main shaft is parallel to the axis of the rotating table; the measuring assembly comprises a telescopic measuring meter hand, the measuring assembly can be detachably connected to the table top positioning piece through a first connecting structure, and the first connecting structure is configured to enable the top end of the measuring meter hand to coincide with the axis of the table top positioning piece, so that the debugging precision and operability can be improved; the precise position relation between the main shaft of the wafer thinning machine and the rotating table is ensured, the machining precision of equipment and the product quality are improved, and high-quality wafer products can be produced easily.

The utility model discloses a kind of material receiving jigs for wafer chemical plating processing, including frame, two groups of material receiving units and protection structure, two groups of material receiving units are all equipped with multiple respectively as vertical arc-shaped groove body structure and along first horizontal direction interval arrangement material receiving groove, multiple material receiving grooves in two groups of material receiving units are mirror-symmetrical along second horizontal direction and set on frame, and any two material receiving grooves cooperatively formed material receiving groove group being mirror-symmetrical;Protection structure is equipped with multiple along first horizontal direction extension protection strip, multiple protection strip is interval set on frame along second horizontal direction, to resist and press limit wafer top side clamped in material receiving groove group;Frame top side is fixed with to hang on transmission device on hook.The material receiving jig can effectively avoid wafer edge to appear plating or thin plating, wafer crack piece and chemical plating uneven etc. Unfavorable phenomenon, improve wafer product yield;Again structure is simple, reasonable, integrated and functional, easy to operate implementation.

The present invention discloses a method for stripping photoresist containing gold-tin patterns and a method for preparing a wafer chip, belonging to the field of integrated circuit manufacturing and packaging. After the wafer is patterned by photolithography to form a gold-tin alloy layer, the photoresist is removed, comprising the following steps: S8, immersing the wafer in an acetone solution, ultrasonically applying a current of 0.2A to 1A for 10 to 30 minutes, and then immersing the wafer in an isopropyl alcohol solution for 1 to 10 minutes; S9, removing the photoresist using a plasma stripper to obtain a wafer chip product. The present invention utilizes the synergistic effect of wet and dry stripping processes without damaging the properties of the gold-tin alloy to rapidly obtain a gold-tin wafer product free of photoresist residue.

The utility model discloses a wafer product anti-mixing device, which relates to the field of industrial product processing equipment, and comprises a marble platform, a wafer detection device is arranged on the marble platform, the wafer detection device comprises a tooling plate, a mounting bottom plate is arranged at the center of the tooling plate, a connecting port is arranged on the mounting bottom plate, and the connecting port is connected with the marble platform. A supporting plate is arranged on the connecting opening, and an opening matched with the connecting opening is formed in the supporting plate. In the anti-mixing device for the wafer products, the edge correction sensors are carefully arranged on the two sides of the wafer on the tool plate, the detection piece connected above the edge correction sensors and the control rod cooperatively operate through the connecting transverse plate, and the edge correction sensors can quickly and sensitively sense subtle changes, transmit signals in time and start corresponding adjusting mechanisms, so that the wafer products are prevented from being mixed. The position of the wafer is accurately corrected, detection errors caused by position deviation are greatly reduced, a solid foundation is laid for various subsequent detection procedures, and the accuracy and reliability of detection data are powerfully guaranteed.

The utility model discloses a kind of wafer product double-sided suction cups, including flange joint, the aluminium plate fixed groove is opened in the middle of one end of flange joint away from flange face, flange joint is opened with air pipe groove in the center of one end close to flange face, the inside of two air pipe grooves is all provided with air pipe joint, the inside upper portion of aluminium plate fixed groove is provided with upper aluminium plate, the inside lower portion of aluminium plate fixed groove is provided with lower aluminium plate, the separation aluminium plate is arranged between the upper aluminium plate and lower aluminium plate.The utility model is provided with upper aluminium plate, lower aluminium plate and separation aluminium plate, cooperate air path groove can be fixed under bolt, by opening air path on two aluminium plates, and using middle aluminium plate separates upper and lower air path to form suction cup air path combination, after being mounted to robot arm, can be connected vacuum pipeline by air pipe joint, two surfaces each connect a pipeline, and then can be set up PEEK suction cup on two pipelines, so that two surfaces can be adsorbed wafer product.

The invention relates to the technical field of etching machine protection, and discloses an induction type protection device for an etching machine, which comprises an equipment body, a mounting top seat arranged above a top cavity, an induction type sensor arranged at the top of the mounting top seat, and a mounting part arranged in an inner cavity of the mounting cavity, and the quick fixing component is arranged in the inner cavity of the top cavity. According to the induction type protection device for the etching machine table, the induction type sensor on the mounting top seat adopts a non-contact type induction detection principle, and physical contact and mechanical pressing actions do not exist between the sensor and a target object, so that particle scraps generated by mechanical wear are thoroughly avoided, and potential threats of such pollution to the yield of wafer products are greatly reduced; compared with the prior art, the invention has the advantages of simple structure, convenience in operation, satisfaction of the ultimate requirement on cleanliness in semiconductor manufacturing, radically overcomes the problems of metal fatigue, contact oxidation and the like caused by long-term use of the traditional mechanical switch due to no mechanical moving part, and is longer in service life and more stable in working state.

The invention discloses wafer waxing and polishing integrated equipment, and belongs to the technical field of semiconductor processing. After being grabbed by the wafer taking and transferring assembly, the wafers are sequentially operated and processed among the processing units; the porcelain plates are operated between the porcelain plate brushing assembly and the surface mounting assembly through the plate carrying assembly, and finally surface mounting is achieved at the surface mounting assembly. And the porcelain plate transferring assembly transfers the porcelain plates subjected to surface mounting to each polishing device for further polishing treatment. In other words, the wafer waxing machine and the polishing machine are integrated and linked to achieve automatic cleaning, waxing, wafer pasting, polishing and wafer discharging of the wafers and the porcelain plates, and the situation that the wafers are manually carried to be processed in all single-machine processing mechanisms in the related technology can be omitted. Therefore, the wafer polishing process efficiency is effectively improved, the wafer conveying instability of workers is reduced, a series of risks caused by possible misoperation of the workers are greatly reduced, the cleaning efficiency and the cleaning process capability of the wafers and the porcelain plates are improved, and the yield of integrated wafer products is guaranteed.

The invention discloses a method and device for carrying out background replacement on an image and a storage medium. The method comprises the steps of obtaining a standard product image and an actual product image to be subjected to background replacement; respectively extracting foreground areas of the standard product image and the actual product image to obtain a standard foreground mask pattern and an actual foreground mask pattern; solving a difference graph of the standard foreground mask graph and the actual foreground mask graph; based on the difference graph and the standard foreground mask graph, repairing the actual foreground mask graph to obtain a repaired actual foreground mask graph; and based on the restored actual foreground mask pattern, setting a background area of the actual product image as a preset background color so as to realize background replacement of the actual product image. According to the scheme of the invention, the processing speed can be improved and the cost can be reduced while the background replacement accuracy and stability are ensured, and the method is suitable for the background replacement requirements of wafer products with different sizes.

The utility model relates to the technical field of chromatic aberration detection, in particular to a wafer surface chromatic aberration detection device, which comprises a base and a mounting frame, the lower end of the mounting frame is fixedly connected with the upper end of the base, a mounting block is fixedly connected to the inner wall of the mounting frame, a positioning clamp is fixedly connected to the inner wall of the mounting frame, a sliding groove is formed in one side of the mounting block, a plurality of fixing plates are fixedly connected to the inner wall of the sliding groove, and the distance between the fixing plates is customized. And a connecting strip is inserted between the fixing plates. By arranging the positioning clamp and the limiting clamp, one side of the wafer is attached to the positioning clamp, then the connecting strip is pulled upwards, and then the connecting strip slides in the sliding groove, so that the limiting clamp is driven to move, the limiting clamp is attached to the other side of the wafer, the wafer is firmly fixed, and the wafers with different diameters can be fixed. And the accuracy of color difference detection of the wafer product is improved, so that the control on the production process and the product quality is improved.

Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

The present application relates to the field of information technology, in particular to a kind of wafer cleaning equipment multi-cavity chemical liquid intelligent circulation control method of semiconductor wafer cleaning technology, comprising: the optimized parameter calculated is sent to the control unit of corresponding cleaning cavity, the actual working flow of the cavity circulating pump and the actual working state of filter device are adjusted, the dynamic optimization of the chemical liquid circulation use process of the cavity is carried out, so that the quality of chemical liquid recovers to the process requirement range;For the cleaning process requirement of different wafer products, the threshold range of the quality parameter of chemical liquid of each cleaning cavity is established in advance, when wafer cleaning equipment switches product model, according to product model, the corresponding chemical liquid quality control threshold of each cavity is automatically matched, and the dynamic adjustment of chemical liquid circulation mode and parameter in cavity is realized.

The utility model relates to the technical field of semiconductor cleaning, in particular to an up-down spraying cleaning structure. According to the utility model, the conveying track conveys the wafer product to the cleaning station, after the positioning mechanism positions the wafer product on the conveying track, the driving assembly drives the spraying head to spray and clean the upper surface of the wafer product, and the spraying mechanism sprays and cleans the lower surface of the wafer product. According to the wafer cleaning device, the upper surface and the lower surface of a wafer product can be synchronously cleaned on line, the cleaning efficiency is greatly improved, the wafer product can be thoroughly cleaned without being overturned, and the wafer cleaning effect is optimal.

The invention discloses a wafer flatness measuring device and method, relates to the technical field of wafer flatness measuring devices, and solves the problems that the thicknesses of the edges of some large-size wafer products are different, the thin parts of the edges are inconvenient to adsorb and fix, and the thin parts of the edges of the wafers lacking of support are in a suspended state, so that the wafer flatness measuring accuracy is poor. The technical problem that the measurement result is affected due to slight tremor in the flatness measurement process is solved. Comprising an equipment rack which is internally provided with a sucker group for adsorbing and fixing a wafer; the rotary filling mechanism is mounted on the outer side of the suction cup group and is used for supporting the wafer; according to the invention, the bottom of the suspended part of the edge of the wafer product can be filled without dead angles in the horizontal direction, so that the situation that the edge of the wafer product is suspended and vibrated in the measurement process of the wafer product to influence the flatness measurement result is avoided, and the measurement stability of the wafer product is improved; and the filling thickness of the edge can be adjusted according to the edge thickness of the wafer product and the suspension distance.

The utility model relates to the technical field of semiconductor processing, and relates to a wafer spray cleaning device. Wafer products enter the cleaning chamber through the feeding port, the receiving mechanism receives the wafer products and transfers the wafer products to the rotating mechanism, the rotating mechanism drives the wafer products to rotate, the upper surfaces of the wafers are cleaned in a spraying mode through the cleaning device, the upper surfaces of the wafers can be evenly cleaned, and the wafer cleaning efficiency is improved. The cleaning effect is improved.

The invention provides a wafer detection method and a related device, and the method comprises the steps: obtaining an optical signal representing the shape of the edge of a wafer; and according to the change of the light intensity or the light sensing area of the light signal at each position of the wafer edge, determining the position of a wafer gap or a broken edge at the wafer edge. According to the invention, the change of the light intensity or the light sensing area of the light signal at each position of the wafer edge is taken as the basis for determining the position of the notch or the edge breakage of the wafer, the detection missing or misjudgment caused by single position point detection is avoided, and the accuracy of determining the position of the notch or the edge breakage of the wafer is high. By adopting the detection method provided by the embodiment of the invention, the position of the notch or the edge breakage of the wafer can be determined with high accuracy, the situation that multiple times of detection or manual intervention detection is needed is avoided, the wafer processing efficiency is improved, and the improvement of the wafer product quality is also facilitated.

The utility model discloses a tool for detecting the boundary dimension of a wafer product, which comprises a working panel, a sliding rail is longitudinally arranged in the center of the working panel, a sliding plate is slidably connected onto the sliding rail and moves up and down along the sliding rail, a turntable is rotatably connected onto the sliding plate, and a product to be detected is arranged on the turntable. Two rows of sliding grooves are formed in the working panel in the sliding direction of the sliding rail from bottom to top in parallel, the upper row of sliding grooves are lower limit adjusting grooves which are divided into two sections and symmetrically distributed on the two sides of the sliding rail respectively, the lower row of sliding grooves are upper limit adjusting grooves which are divided into two sections and symmetrically distributed on the two sides of the sliding rail respectively, and lower limit check blocks are connected to the lower limit adjusting grooves in a sliding mode. The upper limit adjusting groove is slidably connected with an upper limit stop block. According to the utility model, whether the boundary dimension of a wafer product meets the specification is detected by setting an upper limit, a lower limit, up-down movement and rotation, so that the detection process is greatly simplified, excessive complex operation is not needed, and the quality is ensured, the efficiency is improved and the labor force is saved under the condition of avoiding the collision risk.

A reconstituted wafer product may include a plurality of die structures bonded to a wafer in a manner that provides a thermally conductive connection between the wafer and the plurality of die structures. The wafer is compatible with semiconductor processing. Each die structure may include a die containing diamond bonded to a heatsink-side surface of the wafer. Two or more dies containing diamond in the plurality of die structures are of different thickness.

The utility model provides a calibration structure and a semiconductor processing device, the calibration structure is used for calibrating a manipulator carrying a wafer, the manipulator is used for conveying and placing the wafer to a processing platform in the semiconductor processing device, and the calibration structure comprises a base which can be fixed on the processing platform; the fixing piece is arranged on one side of the base and is far away from the base, the center of the fixing piece and the center of the base are located on the same vertical line, and the fixing piece and the base are relatively horizontal, the fixing piece is used for fixing a carrying platform of the mechanical arm so that the carrying platform and the machining platform can be aligned and are relatively horizontal, and therefore the position between the carrying platform and a mechanical arm of the mechanical arm can be calibrated, adjusted and fixed. According to the calibration structure, the accuracy of the wafer conveying position can be improved, the wafer manufacturing quality is further improved, meanwhile, the equipment calibration time is shortened, and the working efficiency of a factory is improved.

The present invention provides a susceptor with improved responsiveness of temperature control, and an object thereof is to obtain a high-quality wafer product without impairing productivity. Provided is a susceptor that generates heat by induction heating, the susceptor including a graphite base material and a ceramic coating layer. The graphite base material exhibits a variation (ρmax / ρmin) Of an in-plane electrical resistivity distribution of the graphite base material at room temperature of 1.00 to 1.05 and a rate of high-temperature change (ρ1600 / ρ800) of electrical resistivity at 1600° C. to that at 800° C. of 1.14 to 1.30.

The utility model relates to the technical field of wafer processing, and relates to a cleaning and overturning device. According to the utility model, the wafer product is conveyed to the positioning jig by the belt line, and after the wafer product is positioned by the jig frame, the rotating mechanism drives the positioning jig and the wafer product on the positioning jig to rotate, so that the spraying cleaning angle of the wafer product can be changed, the cleaning surface can be enlarged, and the cleaning efficiency can be improved; impurities in a small-area irregular area can be rapidly cleaned, the jig frame is arranged on the avoiding open groove in a penetrating mode so that the jig frame can synchronously clean the surface of a wafer product online, and the cleaning efficiency is greatly improved.

The utility model discloses a wafer product size measuring instrument which comprises a marble table board. A rotating seat; a cantilever; the number of the measuring cameras is four; an electric clamping jaw is arranged on the rotating part of the rotating seat; three clamping fingers are arranged on the electric clamping jaw; the clamping fingers are connected with extension rods; and a limiting rod is longitudinally arranged at one end of the extension rod. The actual plane size of the wafer can be directly and quickly calculated only by placing the wafer on the supporting cap, and the supporting cap can be rotated to measure a plurality of point positions to obtain an average value according to a higher precision requirement. The measuring precision is improved by reducing the detection range through the cameras, benchmarking is carried out through the benchmarking piece, and the actual size of the wafer is measured through the actual displacement difference of the two cameras. When the limiting rod is on the outer side, the wafer can be manually taken and placed conveniently; when the limiting rods move towards the inner side, the wafer is centered, and clamping is completed at the same time.

The utility model belongs to the technical field of automation equipment, and particularly relates to a cutting, detecting and packaging device. The cutting, detecting and packaging device mainly comprises a cutting assembly, a feeding assembly, an air blowing assembly, a detecting assembly, a carrying assembly and a packaging assembly. The cutting assembly is arranged below the feeding assembly. The blowing assembly is arranged at the downstream of the feeding assembly; the detection assembly is arranged at the downstream of the blowing assembly; the packaging assembly is arranged on the downstream of the detection assembly. The carrying assembly sucks the products to move among the blowing assembly, the detecting assembly and the packaging assembly. The feeding assembly comprises a feeding air cylinder and a feeding suction nozzle. The detection assembly comprises a camera and a light source; the light source is arranged below the camera; the carrying assembly comprises two groups of carrying cylinders and carrying suction nozzles; the packaging assembly comprises a non-defective product collecting barrel and a defective product collecting barrel. The cutting, detecting and packaging device can be used for automatically detecting and packaging the cut wafer products, so that the production efficiency is improved, and the production quality is ensured.

The application discloses a laser processing method of a quartz crystal wafer, which comprises the following steps: 1) thinning the wafer by using an ultrafast laser in a vacuum environment; 2) cutting the wafer by using the ultrafast laser to obtain a small wafer contour, the bottom of a cutting line of a small wafer combination area comprises a non-penetrating weakened layer, and the small wafer contour line surrounds a small wafer and a main wafer of the wafer to form a connecting point; 3) corroding the wafer by using a corrosion liquid to separate the small wafer combination area from the main wafer of the wafer; 4) vacuum sputtering a metal coating on the surface of the wafer; 5) etching an electrode pattern on the small wafer of the coated wafer by using the ultrafast laser; and 6) disconnecting the connecting point between the small wafer and the main wafer to obtain a single crystal wafer product. The application has the advantages of simple process, low cost, high precision and less environmental pollution.

The invention discloses a laser processing method for a quartz crystal oscillator wafer, which comprises the following steps of: 1) in a vacuum environment, carrying out thinning treatment on the wafer by using ultrafast laser; (2) ultrafast laser is used for conducting small wafer contour cutting on the wafer, the bottom of a cutting line of a small wafer combination area comprises a non-penetrating weakening layer, and connecting points are arranged between the small wafer surrounded by a small wafer contour line and a main wafer of the wafer; 3) corroding the wafer by using a corrosive liquid to separate the small wafer combination area from the main wafer of the wafer; the method comprises the following steps of (1) carrying out vacuum sputtering on a main wafer, (2) carrying out vacuum sputtering on the surface of the wafer to form a metal coating, (3) carrying out vacuum sputtering on the surface of the wafer to form a metal coating, (4) carrying out vacuum sputtering on the surface of the wafer to form a metal coating, (5) etching an electrode pattern on a small wafer of the coated wafer by using ultrafast laser, and (6) disconnecting a connection point between the small wafer and the main wafer to obtain a single crystal oscillator wafer finished product.