160 results about "Wafer Product" patented technology

The invention relates to the technical field of semiconductor material preparation, and provides a method for controlling the resistivity of a fifth main group element doped crystal bar, crystal pulling time is distinguished in different crystal pulling stages, the volatilization coefficient of doped elements in different time periods is adjusted, the volatilization amount of the doped elements in each time interval is calculated more accurately, and the resistivity of the doped crystal bar is controlled. Therefore, the amount of doping elements required for controlling the resistance can be calculated more accurately, the resistance of the crystal bar can be adjusted more effectively and more accurately, the resistance difference between the head and the tail of the single-crystal crystal bar can be better reduced, meanwhile, through timely adjustment of the control process of the grade and the ending volatilization amount, the supplementary doping condition in the crystal pulling process is defined, and the crystal pulling efficiency is improved. And the resistance hit rate of the crystal bar is improved, and the head and tail resistance difference is reduced, so that the resistivity of each part of the crystal bar is accurately controlled, and the consistency of subsequent silicon wafer product quality is ensured.

The invention discloses wafer cleaning equipment and a wafer cleaning method, and belongs to the technical field of wafer cleaning. The groove type cleaning machine and the single-piece scrubbing machine are arranged side by side, so that after cleaned wafers are conveyed to the material waiting station through the first wafer taking assembly, the second wafer taking assembly in the single-piece scrubbing machine conveys the wafers to the scrubbing and spin-drying assembly through the wafer inlet and the wafer outlet to be further cleaned and dried. Namely, the groove-type cleaning machine and the single-piece brushing machine are integrated and linked to clean and dry the wafer, and the technological process that the wafer subjected to groove-type cleaning is manually carried into wafer drying equipment and then the dried wafer is manually carried into the single-piece brushing machine in the related technology can be omitted. Therefore, the instability of wafer conveying by personnel is reduced while the equipment investment cost is reduced, the risk caused by possible misoperation of the personnel is reduced, the wafer cleaning efficiency and the cleaning process capability are improved, and the yield of integrated wafer products is ensured.

According to the carrier provided by the invention, the parts are simple in structure, a universal mechanical manufacturing process is adopted, and the cost of the carrier can be greatly reduced; the carrying platform is light in weight, so that the driving load and energy consumption can be effectively reduced; a traditional clamping jaw fixing mode is replaced, the application range of the carrying table to the cleaning liquid is expanded, and the maintenance frequency of a client side is reduced; the method can be suitable for wafer products with large warping degree, and the phenomena of vacuum leakage and fragments are effectively avoided.

The invention discloses a method for detecting and positioning an anchor frame and a notch point of a good wafer product, which comprises the following steps of: cutting an input wafer image data set, and carrying out normalization processing to obtain a preprocessed image; the improved YOLOv5-Seg model is trained by adopting the preprocessed image, and the learning ability of the model is enhanced by adopting a self-adaptive data enhancement method designed by the invention in the training process; the improved YOLOv5-Seg model comprises three parts, namely, an OfficientVit-Backbone part, a Neck part and a Head part; performing target detection and mask segmentation on an input wafer image by adopting the trained model to obtain a detection frame of each good wafer product and a mask segmentation result of the detection frame; according to a mask segmentation result, fitting by adopting a least square method to obtain the center and radius of a fitting circle of each good wafer product, and positioning a notch of the wafer according to the coordinates of the contour pixel points of the wafer and the corresponding radius of the contour pixel points of the wafer; and converting the notch of the wafer from the image coordinate system to the fitting circular coordinate system, and calculating the angle of the notch of the wafer relative to the rotary table based on the converted coordinate.

The invention relates to the technical field of wafer cutting, and provides a cutting-up method of a gallium arsenide wafer, in a cutter grinding stage, two times of cutter grinding are achieved through a cutter grinding plate, on one hand, diamonds of a grinding wheel blade can be exposed, a chip pocket is generated, on the other hand, the grinding wheel blade can be rounded, it is guaranteed that the grinding wheel blade and a main shaft are concentric, and the cutting-up efficiency is improved. Moreover, the cutting edge part in contact with the knife sharpening plate can be damaged during knife sharpening each time, and the cutting edge of the grinding wheel blade can be changed into a V shape, so that the purpose of trimming the shape of the cutting edge is achieved, the contact area between the cutting edge and a material is smaller in the product cutting process, the impact crushing impact force on the material is smaller, the breakage and cracks of particles after cutting can be obviously reduced, and the product quality is improved. The cutting quality of the wafer is improved, so that the yield of wafer products is improved; in the cutting-up stage, the wafer is preferentially divided into a plurality of stepping wide-strip-shaped cutting channels, and then fine division is carried out, so that the material stress can be preliminarily released, and the large area of the wafer wide strip is enough to resist the crack extension problem.

The embodiment of the invention relates to the technical field of silicon wafer cleaning, and discloses a cleaning method and system for improving the surface metal level of a silicon wafer. The method comprises the steps that a silicon wafer is ground, the treated ground silicon wafer is washed with deionized water, the treated silicon wafer is washed with a DHF, ammonia water, hydrogen peroxide and water mixed solution at the room temperature for 270-300 s, and then the silicon wafer is washed with high-purity water for 270-300 s; the washed silicon wafer is put into an ozone and hydrochloric acid mixed cleaning tank to be washed for 270-300 s, and then rapid high-purity water secondary washing is carried out for 270-300 s; the silicon wafer subjected to secondary flushing is cleaned for 270-300 s by adopting a nitric acid solution under the room temperature condition, and then rapid high-purity water third-time flushing is carried out for 270-300 s; and drying the silicon wafer which is washed for the third time, and packaging to obtain a final silicon wafer product. The technical problem that precious metal is difficult to remove in the silicon wafer cleaning process in the prior art can be at least solved.

The utility model discloses a wafer product edge detection device, which comprises a marble platform and a marble cantilever, four corners below the marble platform are fixedly connected with air floating pads, the middle part of one end of the marble platform is fixedly connected with the marble cantilever, and the marble cantilever is fixedly connected with the air floating pads. A wafer rotating platform is fixedly connected to the middle of the upper portion of the marble platform, a wafer body is arranged above the rotating output end of the wafer rotating platform, and positioning air cylinder sets are arranged at the quartering positions, below the wafer body, of the wafer rotating platform. According to the utility model, the wafer rotating platform and the positioning air cylinder group are arranged, three groups of air cylinders for jacking are designed at the edge of the platform and are matched with corresponding conical heads, so that glass is positioned to the center and then stably falls onto the platform for measurement, and the center of the wafer is positioned, so that large eccentricity is avoided; therefore, the visual field of the camera group can be greatly reduced.

The utility model discloses a nitrogen bin for automatically storing wafers, which belongs to the field of storage equipment, is used for solving the problem of low efficiency of manual wafer storage and taking in the prior art, and comprises a bin body, a goods shelf, a conveying line and a material taking mechanism, the bin body is provided with a closed storage cavity, and the bin body is provided with a feed port and a discharge port which are communicated with the storage cavity; the goods shelf is arranged in the storage cavity and is used for placing wafers; the conveying line is arranged in the storage cavity and connected with the feeding port and the discharging port. The material taking mechanism comprises a moving module and a mechanical arm which are arranged in the storage cavity and connected with each other, the moving module is used for driving the mechanical arm to move between the goods shelf and the conveying line, and the mechanical arm is used for grabbing the conveying line or the wafers on the goods shelf and placing the wafers on the goods shelf or the conveying line. According to the wafer automatic storage nitrogen bin, the conveying line, the moving module and the manipulator cooperate to realize automatic storage and taking functions of wafers, so that the efficiency and the accuracy of wafer product storage and taking operation are improved.

The utility model relates to a polishing pad trimmer and chemical mechanical polishing equipment, an adjusting assembly is arranged at one end of a swing arm, and the adjusting assembly comprises an airtight cavity; the trimming disc is arranged on the side, away from the swing arm, of the adjusting assembly. The adjusting assembly drives the finishing disc to move in the direction close to or away from the adjusting assembly through deformation of the airtight cavity. The pressure detection device is embedded in the airtight chamber and is used for detecting an internal gas pressure value of the airtight chamber; the controller is used for receiving the internal gas pressure value of the airtight cavity and controlling the working state of the grinding pad trimmer. The change condition of the dressing pressure of the dressing disc can be accurately measured in real time, the situation that the grinding pad is damaged due to the fact that the pressure is abnormal is avoided, wafer products are further prevented from being damaged, and the labor cost of detection is reduced.

The invention provides an automatic locking control system for a wafer cutting engineering product loading jig. The automatic locking control system comprises the following steps that S1, wafer loading waiting is carried out; s2, loading a wafer loading jig; s3, automatically locking the wafer loading jig; s4, loading wafer loading jig information; s5, a wafer loading jig identification unit; and S6, unlocking the equipment. The locking device is installed at the bottom of the wafer loading jig, the locking device is in signal connection with the master control module, and the locking device cooperates with uploading and checking of information of the wafer loading jig, so that the effect that the wafer loading jig is always locked on equipment before equipment operation is finished is achieved, the situation that the wafer loading jig falls off is effectively avoided, and the working efficiency is improved. And meanwhile, the problem of fragmentation defects of wafer products is solved.

Provided in the present application are a process chamber cleanliness testing method and a process chamber. The process chamber comprises a cavity and at least one crystal oscillator, the crystal oscillator being fixedly arranged on the cavity, and the crystal oscillator having a deposit-measuring surface facing the interior of the cavity. The process chamber cleanliness testing method comprises: measuring the current inherent frequency of the crystal oscillator; according to the current inherent frequency of the crystal oscillator, determining the thickness of a deposited film layer on a corresponding inner wall of the cavity; and when the thickness of the deposited film layer is greater than a first preset thickness threshold value, determining that the process chamber needs to be cleaned. In the present application, the thickness of the deposited film layer is determined by means of the crystal oscillator arranged in the process chamber, allowing for real-time, accurate monitoring of the interior state of the process chamber; thus, the method of introducing a testing wafer and carrying out a specific testing process is not needed to confirm the interior state of the chamber, thereby improving the efficiency of process chamber maintenance, ensuring semiconductor process effects, and increasing wafer product yield rate.

The invention discloses a stable wafer lifting device which comprises a hollow lifting table, a hollow wafer carrying table used for carrying a wafer and adsorbing the wafer is arranged over the hollow lifting table, and a bottom plate is arranged under the hollow lifting table. The upper surface of the bottom plate is provided with a first piston assembly used for driving the hollow wafer carrying table to ascend and descend in the Y-axis direction and a second piston assembly used for driving the hollow lifting table to ascend and descend in the Y-axis direction, and the surface of the hollow wafer carrying table is provided with a first annular partition plate and air suction holes used for adsorbing wafers. The number of the first annular partition plates is four, the four first annular partition plates are distributed in an annular array, and the air suction holes are located in the inner sides of the first annular partition plates. According to the invention, stable jacking and descending of the wafer product are realized, and the situation that the wafer product collides with the manipulator due to horizontal displacement or sliding of the wafer product in the jacking or descending process is avoided.

A memory testing method and a computer system based on wafer stacking architecture are disclosed. The memory testing method is applied to a computer system based on wafer stacking architecture. The computer system is a three-dimensional wafer product formed by a memory wafer layer, a logic circuit layer and a substrate. When performing memory testing, the memory devices in the memory wafer layer are divided into a plurality of memory sub-blocks, each of which is tested separately. First, a data table is established in one memory sub-block. Then, a plurality of different initial values prepared in advance are provided, and a proof-of-work operation is performed to generate a plurality of operation results corresponding to each initial value by performing multiple read / write operations on the data table. The judgment module obtains the operation results from the operation module and compares them with the corresponding known solutions to calculate the error rate of the tested memory sub-block.

The invention belongs to the field of 3D advanced packaging, and particularly relates to a technological method for cleaning flux of a wafer product for HBM packaging. The method comprises the following steps that a wafer product to be cleaned and packaged by the HBM is placed in a soaking unit casset containing a flux cleaning agent to be soaked, and the casset is vibrated up and down during soaking; the soaked wafer product is conveyed to a high-pressure photoresist removing unit, a flux cleaning agent is sprayed at high pressure, and the wafer product does reciprocating forward and reverse rotation motion along the axis of the circle center during spraying; the wafer after high-pressure spraying cleaning is conveyed to a normal-pressure cleaning unit, IPA is sprayed on the surface of the wafer, and during spraying, the wafer product does reciprocating forward and reverse rotation motion along the axis of the circle center; and the wafer product after IPA cleaning rotates at a high speed and is matched with N2 for drying at the same time. By adopting the cleaning method disclosed by the invention, the flux in the tiny gap between the Die can be efficiently cleaned, no cleaning agent residue is generated, a high-quality packaging effect is ensured, and the cost is relatively low.

1. The name of the product under this design: Laser marking machine (double head). 2. Purpose of this design product: used for laser marking and labeling of wafer products. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1.

This invention relates to the field of wafer fabrication technology, and proposes a robotic arm and wafer cleaning process for testing various types of wafer products. The robotic arm includes side grippers, a middle gripper, a first power component, and a second power component. Two side grippers are provided, each with both elastic and rigid gripping portions. The middle gripper is positioned between the two side grippers and also has a rigid gripping portion. The first power component adjusts the Y-axis distance between the two side grippers and simultaneously adjusts the X-axis distance between the side grippers and the middle gripper. The second power component drives the side grippers to rotate about the Z-axis. By incorporating a first power component, this invention allows adjustment of the distance between the two side grippers, thus accommodating the gripping of wafers of different sizes and specifications, and enabling the removal of wafers from stacking containers, making it highly convenient to use. Furthermore, it facilitates adjustment of the gripping direction of the side grippers, further improving the ease of application.

The utility model discloses a main shaft debugging tool which comprises a main shaft positioning piece, and the main shaft positioning piece is provided with a first positioning part and a first peripheral surface; the table surface positioning piece is provided with a second positioning part; the positioning connecting piece can be matched with the first positioning part and the second positioning part respectively, so that the axis of the main shaft is parallel to the axis of the rotating table; the measuring assembly comprises a telescopic measuring meter hand, the measuring assembly can be detachably connected to the table top positioning piece through a first connecting structure, and the first connecting structure is configured to enable the top end of the measuring meter hand to coincide with the axis of the table top positioning piece, so that the debugging precision and operability can be improved; the precise position relation between the main shaft of the wafer thinning machine and the rotating table is ensured, the machining precision of equipment and the product quality are improved, and high-quality wafer products can be produced easily.

The invention relates to the technical field of information, in particular to a wafer cleaning equipment multi-cavity liquid medicine intelligent circulation control method of a semiconductor wafer cleaning technology, which comprises the following steps of: sending optimized parameters obtained by calculation to a control unit of a corresponding cleaning cavity, and adjusting the actual working flow of a cavity circulating pump and the actual working state of a filtering device; the recycling process of the liquid medicine in the cavity is dynamically optimized, so that the quality of the liquid medicine is recovered to be within the range required by the process; according to cleaning process requirements of different wafer products, a liquid medicine quality parameter threshold range of each cleaning cavity is pre-established, and when the product model of the wafer cleaning equipment is switched, a liquid medicine quality control threshold corresponding to each cavity is automatically matched according to the product model, so that dynamic adjustment of a liquid medicine circulation mode and parameters of the sub-cavities is realized.

The utility model discloses a kind of material receiving jigs for wafer chemical plating processing, including frame, two groups of material receiving units and protection structure, two groups of material receiving units are all equipped with multiple respectively as vertical arc-shaped groove body structure and along first horizontal direction interval arrangement material receiving groove, multiple material receiving grooves in two groups of material receiving units are mirror-symmetrical along second horizontal direction and set on frame, and any two material receiving grooves cooperatively formed material receiving groove group being mirror-symmetrical;Protection structure is equipped with multiple along first horizontal direction extension protection strip, multiple protection strip is interval set on frame along second horizontal direction, to resist and press limit wafer top side clamped in material receiving groove group;Frame top side is fixed with to hang on transmission device on hook.The material receiving jig can effectively avoid wafer edge to appear plating or thin plating, wafer crack piece and chemical plating uneven etc. Unfavorable phenomenon, improve wafer product yield;Again structure is simple, reasonable, integrated and functional, easy to operate implementation.

The present invention discloses a method for stripping photoresist containing gold-tin patterns and a method for preparing a wafer chip, belonging to the field of integrated circuit manufacturing and packaging. After the wafer is patterned by photolithography to form a gold-tin alloy layer, the photoresist is removed, comprising the following steps: S8, immersing the wafer in an acetone solution, ultrasonically applying a current of 0.2A to 1A for 10 to 30 minutes, and then immersing the wafer in an isopropyl alcohol solution for 1 to 10 minutes; S9, removing the photoresist using a plasma stripper to obtain a wafer chip product. The present invention utilizes the synergistic effect of wet and dry stripping processes without damaging the properties of the gold-tin alloy to rapidly obtain a gold-tin wafer product free of photoresist residue.

The utility model discloses a wafer product anti-mixing device, which relates to the field of industrial product processing equipment, and comprises a marble platform, a wafer detection device is arranged on the marble platform, the wafer detection device comprises a tooling plate, a mounting bottom plate is arranged at the center of the tooling plate, a connecting port is arranged on the mounting bottom plate, and the connecting port is connected with the marble platform. A supporting plate is arranged on the connecting opening, and an opening matched with the connecting opening is formed in the supporting plate. In the anti-mixing device for the wafer products, the edge correction sensors are carefully arranged on the two sides of the wafer on the tool plate, the detection piece connected above the edge correction sensors and the control rod cooperatively operate through the connecting transverse plate, and the edge correction sensors can quickly and sensitively sense subtle changes, transmit signals in time and start corresponding adjusting mechanisms, so that the wafer products are prevented from being mixed. The position of the wafer is accurately corrected, detection errors caused by position deviation are greatly reduced, a solid foundation is laid for various subsequent detection procedures, and the accuracy and reliability of detection data are powerfully guaranteed.

The utility model discloses a kind of wafer product double-sided suction cups, including flange joint, the aluminium plate fixed groove is opened in the middle of one end of flange joint away from flange face, flange joint is opened with air pipe groove in the center of one end close to flange face, the inside of two air pipe grooves is all provided with air pipe joint, the inside upper portion of aluminium plate fixed groove is provided with upper aluminium plate, the inside lower portion of aluminium plate fixed groove is provided with lower aluminium plate, the separation aluminium plate is arranged between the upper aluminium plate and lower aluminium plate.The utility model is provided with upper aluminium plate, lower aluminium plate and separation aluminium plate, cooperate air path groove can be fixed under bolt, by opening air path on two aluminium plates, and using middle aluminium plate separates upper and lower air path to form suction cup air path combination, after being mounted to robot arm, can be connected vacuum pipeline by air pipe joint, two surfaces each connect a pipeline, and then can be set up PEEK suction cup on two pipelines, so that two surfaces can be adsorbed wafer product.

The invention relates to the technical field of etching machine protection, and discloses an induction type protection device for an etching machine, which comprises an equipment body, a mounting top seat arranged above a top cavity, an induction type sensor arranged at the top of the mounting top seat, and a mounting part arranged in an inner cavity of the mounting cavity, and the quick fixing component is arranged in the inner cavity of the top cavity. According to the induction type protection device for the etching machine table, the induction type sensor on the mounting top seat adopts a non-contact type induction detection principle, and physical contact and mechanical pressing actions do not exist between the sensor and a target object, so that particle scraps generated by mechanical wear are thoroughly avoided, and potential threats of such pollution to the yield of wafer products are greatly reduced; compared with the prior art, the invention has the advantages of simple structure, convenience in operation, satisfaction of the ultimate requirement on cleanliness in semiconductor manufacturing, radically overcomes the problems of metal fatigue, contact oxidation and the like caused by long-term use of the traditional mechanical switch due to no mechanical moving part, and is longer in service life and more stable in working state.

The invention discloses wafer waxing and polishing integrated equipment, and belongs to the technical field of semiconductor processing. After being grabbed by the wafer taking and transferring assembly, the wafers are sequentially operated and processed among the processing units; the porcelain plates are operated between the porcelain plate brushing assembly and the surface mounting assembly through the plate carrying assembly, and finally surface mounting is achieved at the surface mounting assembly. And the porcelain plate transferring assembly transfers the porcelain plates subjected to surface mounting to each polishing device for further polishing treatment. In other words, the wafer waxing machine and the polishing machine are integrated and linked to achieve automatic cleaning, waxing, wafer pasting, polishing and wafer discharging of the wafers and the porcelain plates, and the situation that the wafers are manually carried to be processed in all single-machine processing mechanisms in the related technology can be omitted. Therefore, the wafer polishing process efficiency is effectively improved, the wafer conveying instability of workers is reduced, a series of risks caused by possible misoperation of the workers are greatly reduced, the cleaning efficiency and the cleaning process capability of the wafers and the porcelain plates are improved, and the yield of integrated wafer products is guaranteed.

The invention discloses a method and device for carrying out background replacement on an image and a storage medium. The method comprises the steps of obtaining a standard product image and an actual product image to be subjected to background replacement; respectively extracting foreground areas of the standard product image and the actual product image to obtain a standard foreground mask pattern and an actual foreground mask pattern; solving a difference graph of the standard foreground mask graph and the actual foreground mask graph; based on the difference graph and the standard foreground mask graph, repairing the actual foreground mask graph to obtain a repaired actual foreground mask graph; and based on the restored actual foreground mask pattern, setting a background area of the actual product image as a preset background color so as to realize background replacement of the actual product image. According to the scheme of the invention, the processing speed can be improved and the cost can be reduced while the background replacement accuracy and stability are ensured, and the method is suitable for the background replacement requirements of wafer products with different sizes.

The present invention discloses a scheduling method for a hybrid processing path of a wafer, in the field of semiconductor chip manufacturing technology, comprising the following steps: constructing a ROPN model; establishing a constraint condition for deadlock processing of a main manipulator, using the ROPN model and establishing a process production area scheduling algorithm according to the constraint condition for deadlock processing of the main manipulator; establishing a constraint condition for deadlock processing of a pick-and-place manipulator, using the ROPN model and establishing a feeding strategy according to the constraint condition for deadlock processing of the pick-and-place manipulator; after determining the wafer flow type of the wafer, using the ROPN model and establishing a wafer dispatching strategy according to the constraint condition for deadlock processing of the pick-and-place manipulator. The scheduling method for the hybrid processing path of the wafer solves the problem that the existing scheduling strategy is difficult to guarantee the system's production capacity and the quality of wafer products.

The utility model provides a quartz boat and wafer processing equipment, and relates to the technical field of semiconductors. A first groove rod, a second groove rod, a third groove rod and a fourth groove rod of the quartz boat are arranged in parallel, the first groove rod and the second groove rod are located above the third groove rod and the fourth groove rod, and the projection of the third groove rod and the projection of the fourth groove rod on the horizontal plane are located between the projection of the first groove rod and the projection of the second groove rod on the horizontal plane. Two ends of the first groove rod, the second groove rod, the third groove rod and the fourth groove rod are respectively connected with the first side plate and the second side plate; wherein the inner side surfaces of the first groove rod and the second groove rod are provided with V-shaped grooves, the inner side surfaces of the third groove rod and the fourth groove rod are provided with flat-bottom grooves, and the groove widths of the V-shaped grooves and the flat-bottom grooves are greater than the width of a wafer; when the wafer is placed in the quartz boat, the wafer abuts against the bottom of the flat bottom groove and the side wall of the V-shaped groove. The method has the advantage of improving the integrity of a wafer product.

The utility model relates to the technical field of chromatic aberration detection, in particular to a wafer surface chromatic aberration detection device, which comprises a base and a mounting frame, the lower end of the mounting frame is fixedly connected with the upper end of the base, a mounting block is fixedly connected to the inner wall of the mounting frame, a positioning clamp is fixedly connected to the inner wall of the mounting frame, a sliding groove is formed in one side of the mounting block, a plurality of fixing plates are fixedly connected to the inner wall of the sliding groove, and the distance between the fixing plates is customized. And a connecting strip is inserted between the fixing plates. By arranging the positioning clamp and the limiting clamp, one side of the wafer is attached to the positioning clamp, then the connecting strip is pulled upwards, and then the connecting strip slides in the sliding groove, so that the limiting clamp is driven to move, the limiting clamp is attached to the other side of the wafer, the wafer is firmly fixed, and the wafers with different diameters can be fixed. And the accuracy of color difference detection of the wafer product is improved, so that the control on the production process and the product quality is improved.

Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

The present application relates to the field of information technology, in particular to a kind of wafer cleaning equipment multi-cavity chemical liquid intelligent circulation control method of semiconductor wafer cleaning technology, comprising: the optimized parameter calculated is sent to the control unit of corresponding cleaning cavity, the actual working flow of the cavity circulating pump and the actual working state of filter device are adjusted, the dynamic optimization of the chemical liquid circulation use process of the cavity is carried out, so that the quality of chemical liquid recovers to the process requirement range;For the cleaning process requirement of different wafer products, the threshold range of the quality parameter of chemical liquid of each cleaning cavity is established in advance, when wafer cleaning equipment switches product model, according to product model, the corresponding chemical liquid quality control threshold of each cavity is automatically matched, and the dynamic adjustment of chemical liquid circulation mode and parameter in cavity is realized.