65 results about "Wafer Product" patented technology

The utility model discloses a wafer product edge detection device, which comprises a marble platform and a marble cantilever, four corners below the marble platform are fixedly connected with air floating pads, the middle part of one end of the marble platform is fixedly connected with the marble cantilever, and the marble cantilever is fixedly connected with the air floating pads. A wafer rotating platform is fixedly connected to the middle of the upper portion of the marble platform, a wafer body is arranged above the rotating output end of the wafer rotating platform, and positioning air cylinder sets are arranged at the quartering positions, below the wafer body, of the wafer rotating platform. According to the utility model, the wafer rotating platform and the positioning air cylinder group are arranged, three groups of air cylinders for jacking are designed at the edge of the platform and are matched with corresponding conical heads, so that glass is positioned to the center and then stably falls onto the platform for measurement, and the center of the wafer is positioned, so that large eccentricity is avoided; therefore, the visual field of the camera group can be greatly reduced.

This invention relates to the field of wafer fabrication technology, and proposes a robotic arm and wafer cleaning process for testing various types of wafer products. The robotic arm includes side grippers, a middle gripper, a first power component, and a second power component. Two side grippers are provided, each with both elastic and rigid gripping portions. The middle gripper is positioned between the two side grippers and also has a rigid gripping portion. The first power component adjusts the Y-axis distance between the two side grippers and simultaneously adjusts the X-axis distance between the side grippers and the middle gripper. The second power component drives the side grippers to rotate about the Z-axis. By incorporating a first power component, this invention allows adjustment of the distance between the two side grippers, thus accommodating the gripping of wafers of different sizes and specifications, and enabling the removal of wafers from stacking containers, making it highly convenient to use. Furthermore, it facilitates adjustment of the gripping direction of the side grippers, further improving the ease of application.

The utility model discloses a main shaft debugging tool which comprises a main shaft positioning piece, and the main shaft positioning piece is provided with a first positioning part and a first peripheral surface; the table surface positioning piece is provided with a second positioning part; the positioning connecting piece can be matched with the first positioning part and the second positioning part respectively, so that the axis of the main shaft is parallel to the axis of the rotating table; the measuring assembly comprises a telescopic measuring meter hand, the measuring assembly can be detachably connected to the table top positioning piece through a first connecting structure, and the first connecting structure is configured to enable the top end of the measuring meter hand to coincide with the axis of the table top positioning piece, so that the debugging precision and operability can be improved; the precise position relation between the main shaft of the wafer thinning machine and the rotating table is ensured, the machining precision of equipment and the product quality are improved, and high-quality wafer products can be produced easily.

The utility model discloses a kind of material receiving jigs for wafer chemical plating processing, including frame, two groups of material receiving units and protection structure, two groups of material receiving units are all equipped with multiple respectively as vertical arc-shaped groove body structure and along first horizontal direction interval arrangement material receiving groove, multiple material receiving grooves in two groups of material receiving units are mirror-symmetrical along second horizontal direction and set on frame, and any two material receiving grooves cooperatively formed material receiving groove group being mirror-symmetrical;Protection structure is equipped with multiple along first horizontal direction extension protection strip, multiple protection strip is interval set on frame along second horizontal direction, to resist and press limit wafer top side clamped in material receiving groove group;Frame top side is fixed with to hang on transmission device on hook.The material receiving jig can effectively avoid wafer edge to appear plating or thin plating, wafer crack piece and chemical plating uneven etc. Unfavorable phenomenon, improve wafer product yield;Again structure is simple, reasonable, integrated and functional, easy to operate implementation.

The utility model discloses a wafer product anti-mixing device, which relates to the field of industrial product processing equipment, and comprises a marble platform, a wafer detection device is arranged on the marble platform, the wafer detection device comprises a tooling plate, a mounting bottom plate is arranged at the center of the tooling plate, a connecting port is arranged on the mounting bottom plate, and the connecting port is connected with the marble platform. A supporting plate is arranged on the connecting opening, and an opening matched with the connecting opening is formed in the supporting plate. In the anti-mixing device for the wafer products, the edge correction sensors are carefully arranged on the two sides of the wafer on the tool plate, the detection piece connected above the edge correction sensors and the control rod cooperatively operate through the connecting transverse plate, and the edge correction sensors can quickly and sensitively sense subtle changes, transmit signals in time and start corresponding adjusting mechanisms, so that the wafer products are prevented from being mixed. The position of the wafer is accurately corrected, detection errors caused by position deviation are greatly reduced, a solid foundation is laid for various subsequent detection procedures, and the accuracy and reliability of detection data are powerfully guaranteed.

The utility model discloses a kind of wafer product double-sided suction cups, including flange joint, the aluminium plate fixed groove is opened in the middle of one end of flange joint away from flange face, flange joint is opened with air pipe groove in the center of one end close to flange face, the inside of two air pipe grooves is all provided with air pipe joint, the inside upper portion of aluminium plate fixed groove is provided with upper aluminium plate, the inside lower portion of aluminium plate fixed groove is provided with lower aluminium plate, the separation aluminium plate is arranged between the upper aluminium plate and lower aluminium plate.The utility model is provided with upper aluminium plate, lower aluminium plate and separation aluminium plate, cooperate air path groove can be fixed under bolt, by opening air path on two aluminium plates, and using middle aluminium plate separates upper and lower air path to form suction cup air path combination, after being mounted to robot arm, can be connected vacuum pipeline by air pipe joint, two surfaces each connect a pipeline, and then can be set up PEEK suction cup on two pipelines, so that two surfaces can be adsorbed wafer product.

The invention relates to the technical field of etching machine protection, and discloses an induction type protection device for an etching machine, which comprises an equipment body, a mounting top seat arranged above a top cavity, an induction type sensor arranged at the top of the mounting top seat, and a mounting part arranged in an inner cavity of the mounting cavity, and the quick fixing component is arranged in the inner cavity of the top cavity. According to the induction type protection device for the etching machine table, the induction type sensor on the mounting top seat adopts a non-contact type induction detection principle, and physical contact and mechanical pressing actions do not exist between the sensor and a target object, so that particle scraps generated by mechanical wear are thoroughly avoided, and potential threats of such pollution to the yield of wafer products are greatly reduced; compared with the prior art, the invention has the advantages of simple structure, convenience in operation, satisfaction of the ultimate requirement on cleanliness in semiconductor manufacturing, radically overcomes the problems of metal fatigue, contact oxidation and the like caused by long-term use of the traditional mechanical switch due to no mechanical moving part, and is longer in service life and more stable in working state.

The invention discloses wafer waxing and polishing integrated equipment, and belongs to the technical field of semiconductor processing. After being grabbed by the wafer taking and transferring assembly, the wafers are sequentially operated and processed among the processing units; the porcelain plates are operated between the porcelain plate brushing assembly and the surface mounting assembly through the plate carrying assembly, and finally surface mounting is achieved at the surface mounting assembly. And the porcelain plate transferring assembly transfers the porcelain plates subjected to surface mounting to each polishing device for further polishing treatment. In other words, the wafer waxing machine and the polishing machine are integrated and linked to achieve automatic cleaning, waxing, wafer pasting, polishing and wafer discharging of the wafers and the porcelain plates, and the situation that the wafers are manually carried to be processed in all single-machine processing mechanisms in the related technology can be omitted. Therefore, the wafer polishing process efficiency is effectively improved, the wafer conveying instability of workers is reduced, a series of risks caused by possible misoperation of the workers are greatly reduced, the cleaning efficiency and the cleaning process capability of the wafers and the porcelain plates are improved, and the yield of integrated wafer products is guaranteed.

The invention discloses a method and device for carrying out background replacement on an image and a storage medium. The method comprises the steps of obtaining a standard product image and an actual product image to be subjected to background replacement; respectively extracting foreground areas of the standard product image and the actual product image to obtain a standard foreground mask pattern and an actual foreground mask pattern; solving a difference graph of the standard foreground mask graph and the actual foreground mask graph; based on the difference graph and the standard foreground mask graph, repairing the actual foreground mask graph to obtain a repaired actual foreground mask graph; and based on the restored actual foreground mask pattern, setting a background area of the actual product image as a preset background color so as to realize background replacement of the actual product image. According to the scheme of the invention, the processing speed can be improved and the cost can be reduced while the background replacement accuracy and stability are ensured, and the method is suitable for the background replacement requirements of wafer products with different sizes.

Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

The utility model relates to the technical field of semiconductor cleaning, in particular to an up-down spraying cleaning structure. According to the utility model, the conveying track conveys the wafer product to the cleaning station, after the positioning mechanism positions the wafer product on the conveying track, the driving assembly drives the spraying head to spray and clean the upper surface of the wafer product, and the spraying mechanism sprays and cleans the lower surface of the wafer product. According to the wafer cleaning device, the upper surface and the lower surface of a wafer product can be synchronously cleaned on line, the cleaning efficiency is greatly improved, the wafer product can be thoroughly cleaned without being overturned, and the wafer cleaning effect is optimal.

The utility model relates to the technical field of semiconductor processing, and relates to a wafer spray cleaning device. Wafer products enter the cleaning chamber through the feeding port, the receiving mechanism receives the wafer products and transfers the wafer products to the rotating mechanism, the rotating mechanism drives the wafer products to rotate, the upper surfaces of the wafers are cleaned in a spraying mode through the cleaning device, the upper surfaces of the wafers can be evenly cleaned, and the wafer cleaning efficiency is improved. The cleaning effect is improved.

The invention provides a wafer detection method and a related device, and the method comprises the steps: obtaining an optical signal representing the shape of the edge of a wafer; and according to the change of the light intensity or the light sensing area of the light signal at each position of the wafer edge, determining the position of a wafer gap or a broken edge at the wafer edge. According to the invention, the change of the light intensity or the light sensing area of the light signal at each position of the wafer edge is taken as the basis for determining the position of the notch or the edge breakage of the wafer, the detection missing or misjudgment caused by single position point detection is avoided, and the accuracy of determining the position of the notch or the edge breakage of the wafer is high. By adopting the detection method provided by the embodiment of the invention, the position of the notch or the edge breakage of the wafer can be determined with high accuracy, the situation that multiple times of detection or manual intervention detection is needed is avoided, the wafer processing efficiency is improved, and the improvement of the wafer product quality is also facilitated.

A reconstituted wafer product may include a plurality of die structures bonded to a wafer in a manner that provides a thermally conductive connection between the wafer and the plurality of die structures. The wafer is compatible with semiconductor processing. Each die structure may include a die containing diamond bonded to a heatsink-side surface of the wafer. Two or more dies containing diamond in the plurality of die structures are of different thickness.

The utility model provides a calibration structure and a semiconductor processing device, the calibration structure is used for calibrating a manipulator carrying a wafer, the manipulator is used for conveying and placing the wafer to a processing platform in the semiconductor processing device, and the calibration structure comprises a base which can be fixed on the processing platform; the fixing piece is arranged on one side of the base and is far away from the base, the center of the fixing piece and the center of the base are located on the same vertical line, and the fixing piece and the base are relatively horizontal, the fixing piece is used for fixing a carrying platform of the mechanical arm so that the carrying platform and the machining platform can be aligned and are relatively horizontal, and therefore the position between the carrying platform and a mechanical arm of the mechanical arm can be calibrated, adjusted and fixed. According to the calibration structure, the accuracy of the wafer conveying position can be improved, the wafer manufacturing quality is further improved, meanwhile, the equipment calibration time is shortened, and the working efficiency of a factory is improved.

The present invention provides a susceptor with improved responsiveness of temperature control, and an object thereof is to obtain a high-quality wafer product without impairing productivity. Provided is a susceptor that generates heat by induction heating, the susceptor including a graphite base material and a ceramic coating layer. The graphite base material exhibits a variation (ρmax / ρmin) Of an in-plane electrical resistivity distribution of the graphite base material at room temperature of 1.00 to 1.05 and a rate of high-temperature change (ρ1600 / ρ800) of electrical resistivity at 1600° C. to that at 800° C. of 1.14 to 1.30.

The utility model relates to the technical field of wafer processing, and relates to a cleaning and overturning device. According to the utility model, the wafer product is conveyed to the positioning jig by the belt line, and after the wafer product is positioned by the jig frame, the rotating mechanism drives the positioning jig and the wafer product on the positioning jig to rotate, so that the spraying cleaning angle of the wafer product can be changed, the cleaning surface can be enlarged, and the cleaning efficiency can be improved; impurities in a small-area irregular area can be rapidly cleaned, the jig frame is arranged on the avoiding open groove in a penetrating mode so that the jig frame can synchronously clean the surface of a wafer product online, and the cleaning efficiency is greatly improved.

The utility model belongs to the technical field of automation equipment, and particularly relates to a cutting, detecting and packaging device. The cutting, detecting and packaging device mainly comprises a cutting assembly, a feeding assembly, an air blowing assembly, a detecting assembly, a carrying assembly and a packaging assembly. The cutting assembly is arranged below the feeding assembly. The blowing assembly is arranged at the downstream of the feeding assembly; the detection assembly is arranged at the downstream of the blowing assembly; the packaging assembly is arranged on the downstream of the detection assembly. The carrying assembly sucks the products to move among the blowing assembly, the detecting assembly and the packaging assembly. The feeding assembly comprises a feeding air cylinder and a feeding suction nozzle. The detection assembly comprises a camera and a light source; the light source is arranged below the camera; the carrying assembly comprises two groups of carrying cylinders and carrying suction nozzles; the packaging assembly comprises a non-defective product collecting barrel and a defective product collecting barrel. The cutting, detecting and packaging device can be used for automatically detecting and packaging the cut wafer products, so that the production efficiency is improved, and the production quality is ensured.

The application discloses a laser processing method of a quartz crystal wafer, which comprises the following steps: 1) thinning the wafer by using an ultrafast laser in a vacuum environment; 2) cutting the wafer by using the ultrafast laser to obtain a small wafer contour, the bottom of a cutting line of a small wafer combination area comprises a non-penetrating weakened layer, and the small wafer contour line surrounds a small wafer and a main wafer of the wafer to form a connecting point; 3) corroding the wafer by using a corrosion liquid to separate the small wafer combination area from the main wafer of the wafer; 4) vacuum sputtering a metal coating on the surface of the wafer; 5) etching an electrode pattern on the small wafer of the coated wafer by using the ultrafast laser; and 6) disconnecting the connecting point between the small wafer and the main wafer to obtain a single crystal wafer product. The application has the advantages of simple process, low cost, high precision and less environmental pollution.

The invention discloses a laser processing method for a quartz crystal oscillator wafer, which comprises the following steps of: 1) in a vacuum environment, carrying out thinning treatment on the wafer by using ultrafast laser; (2) ultrafast laser is used for conducting small wafer contour cutting on the wafer, the bottom of a cutting line of a small wafer combination area comprises a non-penetrating weakening layer, and connecting points are arranged between the small wafer surrounded by a small wafer contour line and a main wafer of the wafer; 3) corroding the wafer by using a corrosive liquid to separate the small wafer combination area from the main wafer of the wafer; the method comprises the following steps of (1) carrying out vacuum sputtering on a main wafer, (2) carrying out vacuum sputtering on the surface of the wafer to form a metal coating, (3) carrying out vacuum sputtering on the surface of the wafer to form a metal coating, (4) carrying out vacuum sputtering on the surface of the wafer to form a metal coating, (5) etching an electrode pattern on a small wafer of the coated wafer by using ultrafast laser, and (6) disconnecting a connection point between the small wafer and the main wafer to obtain a single crystal oscillator wafer finished product.

The embodiment of the present specification provides an elastic component applied to a carrier for transporting wafers, comprising: an inlay part for being inlaid in a mounting groove of the carrier; and a supporting part for supporting the wafer, the supporting part being fixedly connected with the inlay part, a side of the supporting part facing the wafer being provided in a planar shape, and a side of the supporting part facing the mounting groove being protruded out of the inlay part so that the supporting part is supported on a surface of the carrier. The elastic component contains a wafer supporting surface with a larger area, which can reduce wafer damage caused by changes in contact pressure and is less likely to slide sideways. The side of the supporting part facing the mounting groove is protruded out of the inlay part, which can inhibit torsion of the elastic component itself in the mounting groove and improve the stability of transportation. Using the above-mentioned elastic component, lossless transportation of wafer products can be achieved, and transportation efficiency can be improved.

This invention provides a liquid removal tank and a cleaning device. The liquid removal tank includes: a tank body capable of accommodating a silicon wafer carrier, with a drain pipe at the bottom of the tank body; and a liquid removal assembly, at least partially disposed within the tank body, for removing liquid from the bottom of the silicon wafer carrier placed within the tank. The technical solution of this invention can effectively remove liquid adhering to the bottom of the silicon wafer carrier, preventing liquid residue on the bottom of the silicon wafer carrier. This ensures that no drying blind spots are created when the silicon wafer carrier undergoes the liquid removal operation, thereby preventing impact on subsequent processing steps and improving the quality of silicon wafer products.

The utility model discloses a wafer calibration device, which belongs to the technical field of wafer calibration and comprises a workbench, and a wafer feeding bin, a wafer discharging bin, a single plate carrier bin, a combined calibration station, a single plate calibration station, a combined carrier bin and a wafer calibration station are sequentially arranged at the top end of the workbench around the center. Correction mechanisms are arranged in the combined calibration station, the single plate calibration station and the wafer calibration station, and detection cameras are fixedly connected to the top ends of the combined calibration station, the single plate calibration station and the wafer calibration station; according to the utility model, the three correction mechanisms cooperate with the three detection cameras to calibrate wafers and carriers of different types respectively, and the calibrated wafers can be placed in the wafer storage bin to be used in subsequent processes and can also be placed in a single-plate carrier and a combined carrier to be used in the subsequent processes. The wafer calibration device has multiple working modes and diversified functions, and can meet the simultaneous calibration work of multiple types of wafer products.

The utility model provides a wafer wire bonding jig and wire bonding machine equipment. The wafer wire bonding jig comprises a bearing platform, a vacuum channel device and a vacuum control device. The bearing platform comprises a top surface and a bottom surface which are oppositely arranged, the bearing platform has a thickness between the top surface and the bottom surface, the bearing platform is provided with a plurality of vacuum holes, and the vacuum holes extend into the bearing platform from the top surface along the thickness direction. The vacuum channel device comprises a plurality of vacuum channels, the vacuum channels are arranged between the top face and the bottom face of the bearing platform and extend in a plane perpendicular to the thickness, and each vacuum channel is communicated with the vacuum holes. The vacuum control device comprises a plurality of vacuum controllers which are connected with the vacuum channels in a one-to-one correspondence mode. When the vacuum control device is started, negative pressure can be formed at the vacuum hole of the bearing platform, and a product is firmly adsorbed. Through independent control of a plurality of vacuum controllers, the universality of the wafer wire bonding jig to various different wafer products is realized.

The application provides a bonding process of a deep pad wafer and application thereof. The bonding process first contacts a glass substrate with bonding glue and a wafer, then performs pretreatment, and finally fills the bonding glue on the glass substrate into a pad pit of the wafer under the condition of temperature rise and solidifies, so as to complete the bonding of the deep pad wafer. Through limiting the pretreatment to include twice vacuum extraction and once vacuum breaking, air remaining in the pad pit is effectively removed before solidification, the problems of holes and residual glue in the wafer after solidification are fundamentally avoided, the defective rate of the deep pad bonded wafer product is reduced, the stability of the bonding process is improved, and a new process method is provided for the bonding of the deep pad wafer.

The application discloses a method, device and storage medium for background replacement of an image, the method comprising: obtaining a standard product image and an actual product image to be background replaced; extracting foreground regions of the standard product image and the actual product image respectively to obtain a standard foreground mask image and an actual foreground mask image; obtaining a difference image of the standard foreground mask image and the actual foreground mask image; repairing the actual foreground mask image based on the difference image and the standard foreground mask image to obtain a repaired actual foreground mask image; and setting a background region of the actual product image to a preset background color based on the repaired actual foreground mask image to achieve background replacement of the actual product image. The scheme of the application can improve processing speed and reduce cost while ensuring the accuracy and stability of background replacement, and is suitable for background replacement requirements of different sizes of wafer products.

The invention relates to a semiconductor device control method and a semiconductor device, and the method comprises the steps of executing at least one cycle: controlling a cavity of the semiconductor device to be in a first target process environment, and carrying out the preset process processing of a wafer in the cavity, so as to form a target compound containing a first element and a second element on the wafer; after a preset number of wafers entering the cavity one by one are subjected to preset process treatment, an adhesion layer is formed on the inner surface of the cavity; the adhesive layer contains a second element; controlling the supply equipment to continuously supply first protective gas containing the first element into the cavity at a first preset flow for a first preset time, wherein part of the first protective gas is adsorbed on the surface of the adhesion layer; at least the yield of wafer products can be improved, the preparation efficiency of the wafer products is improved, and the service life of semiconductor equipment is prolonged.

The application provides a silicon wafer wet processing method and system, and the silicon wafer wet processing system comprises a factory system, a self-activation system and a wafer processing unit; the factory system comprises an instruction receiving module and a chemical liquid preparation module; the instruction receiving module is connected with a control terminal to receive an instruction sent by the control terminal; the chemical liquid preparation module is used for preparing an initial chemical liquid according to the instruction in proportion; the factory system is connected with the self-activation system; the self-activation system is connected with the wafer processing unit; the self-activation system is used for generating an activated chemical liquid from the initial chemical liquid; the activated chemical liquid is a chemical liquid containing active ingredients; the activated chemical liquid flows into the wafer processing unit through an outlet end of the first self-activation system; and the wafer processing unit is used for processing wafer products. The silicon wafer wet processing method and system can realize self-activation of the chemical liquid, do not occupy the production capacity of the equipment, and improve the effective utilization rate of the equipment.

The invention provides an image calibration method and device of semiconductor measurement equipment, a medium and a product. The image calibration method of the semiconductor measurement equipment comprises the following steps: acquiring a reference image obtained by scanning a wafer sample by the semiconductor measurement equipment at a reference scanning rate, wherein the reference scanning rate is one of a plurality of preset scanning rates of the semiconductor measurement equipment; obtaining a calibration image obtained by scanning the wafer sample by the semiconductor measurement equipment at a calibration scanning rate, wherein the calibration scanning rate is the other one, different from the reference scanning rate, in the plurality of preset shooting rates; determining an offset between the calibration image and the reference image; and calculating and recording a required compensation value after the reference scanning rate is switched to the calibration scanning rate according to the offset. According to the invention, the required compensation value can be used to reduce the adverse effect of the image drift phenomenon caused by the switching of the scanning rate of the semiconductor measurement equipment on the final image accuracy, and the detection efficiency and accuracy of wafer products can be improved.

The application discloses a single wafer cleaning system capable of improving wafer drying capacity, and relates to the technical field of wafer cleaning systems.The single wafer cleaning system comprises a chemical integrated system, a cleaning and drying system and a recovery and storage system, the chemical integrated system is connected with the cleaning and drying system, the cleaning and drying system is connected with the recovery and storage system, and the cleaning and drying system comprises a supercritical drying module.The supercritical drying module comprises an inner shell body and an outer shell body which is slidably sleeved outside the inner shell body, the inner side of the inner shell body is provided with an inner cavity, the inner side of the outer shell body is provided with an outer cavity, and the middle part of the inner cavity is provided with a wafer bearing platform.The wafer cleaning process in the application can effectively remove impurities, particles and pollutants on the surface of a wafer, ensure the cleanliness and flatness of the surface, effectively improve the problem of pattern collapse, and ensure the yield of the overall semiconductor structure wafer product.