Defect detecting system and method

Abstract

The invention relates to the technical field of semiconductors, and discloses a defect detecting system and method. According to the method, a process device operation information database connected with a production management system is established, information of operation cavities of all process devices is collected and stored in the database, meanwhile, the database is further connected with all the defect detecting devices, the number of wafers for defect detection is defined according to the number of operation cavities of process devices of wafer products, and the number of the wafers is transmitted to the defect detection devices. Compared with the prior art, when a certain or a set of cavities of the process devices can not normally work due to various reasons of the process devices, the process device operation information database defines the number of wafer products for defect detection according to the number of actual operation cavities of the process devices, spot check rules of the defect detecting devices are timely regulated, defect detection operation efficiency is effectively improved, detection resources are saved, and dynamic and self-adjustable effective defect detection is achieved.

Description

technical field [0001] The invention relates to the field of semiconductor technology, in particular to a defect detection system and method in semiconductor technology. Background technique [0002] With the development of integrated circuit technology and the continuous reduction of feature size, the integration of semiconductor chips continues to increase. Integrated circuit design has developed from transistor integration to logic gate integration, and further developed to IP integration. The integration of chips is getting higher and higher. , the distribution of circuits on the chip is becoming more and more complex. Under this development trend, defects in the chip manufacturing process have an increasing impact on chip functions, and some defects can even lead to complete destruction of the entire chip. At the same time, slight changes in equipment performance during the production process will cause resulting in the scrapping of the entire wafer. Therefore, in ord...

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Problems solved by technology

However, in view of many factors, such as fault maintenance, technical verification, etc., some process equipment may be operated under the condition that certain leases or certain process units are stopped

Therefore, when the process equipment 110 that can operate at most 4 groups of cavities at the same time has only two groups of cavities, if the

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