Solar silicon wafer surface defect detection device

A solar silicon wafer and defect detection technology, which is applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve the problems of silicon wafer damage, large mechanical loss, and low long-term efficiency, so as to facilitate mechanical control and facilitate The effect of short control and operation process

Inactive Publication Date: 2017-07-28
CHENGDU FUYU TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology describes an apparatus called Surface Defect Detech (SD) or Solar Silicone Wafer Scale Detector (SSWD). These devices use suctions made of rubbing materials like clothings to hold onto the silica substrate before applying light thereto while still allowing for precise inspexposition. They also include features such as cameras, lights, sensors, and actuators to inspect their surfaces efficiently and accurately. Additionally, they may involve various components including pliers, rods, and other tools to manipulate them smoothly. Overall these technical improvements enhance the performance, reliability, ease-of-use, manufacturability, and functionality of this type of equipment.

Problems solved by technology

This technical problem addressed in this patents relates to improving the manufacturing processes used during producing high-quality crystalline materials such as solar silicone wires (Solar Silica Wrap). Specifically, there needs to have better ways to accurately measure these properties without damaging them while also being able to quickly identify any flaws on their surface before further processing steps can occur due to poorly formed edges caused from insufficient photon absorption at specific angles.

Method used

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  • Solar silicon wafer surface defect detection device
  • Solar silicon wafer surface defect detection device
  • Solar silicon wafer surface defect detection device

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Embodiment 1

[0050] Such as Figure 1-3 , a surface defect detection device for solar silicon wafers according to the present invention, comprising a grabbing component, a circular track 8, a detection component, a gas distribution component, a display component, a feeding device, a feeding device, a drive system and a control system , the control system controls the driving system to drive the grabbing part, detection part, display part, feeding device and unloading device, the control system includes a processing module, and the grabbing part includes four suction cups 1, The gas distribution assembly includes an air guide tube 2 and a sleeve 3, the air guide tube 2 is a hollow copper tube, the sleeve 3 is provided with an inner hole 31, and the lower end of the air guide tube 2 is connected to the inner hole 31. The upper end of the air guide tube 2 is provided with an opening one, the opening one is connected to the air pipe two 7 through the rotary joint 6, the air pipe two 7 is conne...

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PUM

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Abstract

The invention relates to a solar silicon wafer surface defect detection device, comprising: a grabbing component, a circular track, a detection component, a driving system and a control system wherein the detection component consists of a photographing component 1 and a photographing component 2. The photographing component 1 is arranged under the suction plate. The position of the photographing component 1 is adapted to the motion trajectory of the suction plate. The photographing component 1 is used to photograph the bottom of the wafer and the photographing component 2 is used to photograph the top of the wafer. According to the invention, with the suction plate, one-time fetching and rotating of the silicon wafer are enough for the photographing of its front side and the back side for the detection of the wafer defects in appearance and size. Free from the face turning of the wafer, the structure of the grabbing component is simplified. The operation process is short, highly efficient and mechanical loss reducing. With the device, additional loss of a wafer product can be avoided; and the appearance quality is increased, while the cost is reduced.

Description

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Claims

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Application Information

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Owner CHENGDU FUYU TECH
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