Silicon wafer dual-face grinding equipment and production process thereof

Abstract

The invention provides silicon wafer dual-face grinding equipment and a production process thereof. The equipment comprises an up and down grinding disc system, a lower plane disc for loading a silicon wafer to be ground and a spraying sweeping chip removal system mounted on the upper grinding disc system, the spraying sweeping chip removal system comprises an upper plane disc mechanism corresponding to the lower plane disc, a liquid supply device communicating with the upper plane disc mechanism, and an upper transmission assembly for driving the upper plane disc mechanism to rotate, when theupper plane disc mechanism rotates to the position above the corresponding lower plane disc, trigger liquid outlet is achieved, cleaning liquid is sprayed out under the rotation centrifugal effect ina sprinkler manner, grinding impurities are removed in a spraying manner from the center of the lower plane disc to the center and are swept, in cooperation with a chip removal extrusion system mounted on the lower grinding disc system, impurity mixed liquid is extruded, transferred, filtered and recycled, the liquid outlet manner is ingeniously designed while the automatic liquid supply is achieved to synchronously remove the grinding impurities in time, and the technical problems that in the prior art, the grinding impurities cannot be removed in time, and a silicon wafer product is poor inquality and low in yield can be solved.

Description

technical field [0001] The invention relates to the field of silicon wafer grinding, in particular to a silicon wafer double-sided grinding equipment and a production process thereof. Background technique [0002] Monocrystalline silicon has become the most widely used semiconductor material in integrated circuit manufacturing. More than 95% of semiconductor devices and more than 99% of integrated circuits in the world use single crystal silicon as the substrate material. In the process of preparing silicon wafers, the surface of single crystal silicon wafers needs to be ground and polished. Both sides are ground simultaneously. Through the upper and lower grinding discs, the center wheel, and the planetary wheel, the four directions and speeds of the grinding movement are coordinated during processing, so as to achieve the efficient operation of simultaneous grinding of the upper and lower surfaces. [0003] The Chinese invention patent with the application number CN20182...

AI Technical Summary

Problems solved by technology

[0005] In view of the above problems, the present invention provides a double-sided grinding equipment for silicon wafers and its production process. By setting the spraying and sweeping debris removal system on the upper grinding disc system, when the upper planetary disc mechanism revolves above the corresponding lower planetary disc The liquid is triggered, and the cleaning liquid is sprayed in the shape of a shower under the centrifugal action of the upper planetary disc mechanism, and the grinding impurities are sprayed from the center of the lower plan

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