A kind of silicon wafer double-sided grinding equipment and its production process

Abstract

The invention provides a silicon wafer double-sided grinding equipment and its production process, including an upper and lower grinding disc system, a lower planetary disc loaded with silicon wafers to be ground, and a spraying and sweeping debris removal system arranged on the upper grinding disc system. The debris removal system includes an upper planetary disk mechanism corresponding to the lower planetary disk, a liquid supply device connected to the upper planetary disk mechanism, and an upper transmission assembly that drives the upper planetary disk mechanism to rotate. The upper planetary disk mechanism revolves to the corresponding lower planetary disk. When it is above, the liquid is triggered, and the cleaning liquid is sprayed in the shape of a shower under the action of rotation and centrifugation, and the grinding impurities are sprayed and cleaned from the center of the lower planetary disc to the outer ring, and then cooperate with the chip removal set on the lower grinding disc system to extrude The system squeezes out the impurity mixed liquid, transfers it, filters it and recycles it. While supplying the liquid automatically, the grinding impurities can be removed synchronously and in time through ingenious design of the liquid outlet method, which solves the problem that the grinding impurities in the prior art cannot be removed in time and the silicon wafer is finished. Technical problems of poor quality and low yield.

Description

technical field [0001] The invention relates to the field of silicon wafer grinding, in particular to a silicon wafer double-sided grinding equipment and a production process thereof. Background technique [0002] Monocrystalline silicon has become the most widely used semiconductor material in integrated circuit manufacturing. More than 95% of semiconductor devices and more than 99% of integrated circuits in the world use single crystal silicon as the substrate material. In the process of preparing silicon wafers, the surface of single crystal silicon wafers needs to be ground and polished. Both sides are ground simultaneously. Through the upper and lower grinding discs, the center wheel, and the planetary wheel, the four directions and speeds of the grinding movement are coordinated during processing, so as to achieve the efficient operation of simultaneous grinding of the upper and lower surfaces. [0003] The Chinese invention patent with the application number CN20182...

AI Technical Summary

Problems solved by technology

[0005] In view of the above problems, the present invention provides a double-sided grinding equipment for silicon wafers and its production process. By setting the spraying and sweeping debris removal system on the upper grinding disc system, when the upper planetary disc mechanism revolves above the corresponding lower planetary disc The liquid is triggered, and the cleaning liquid is sprayed in the shape of a shower under the centrifugal action of the upper planetary disc mechanism, and the grinding impurities are sprayed from the center of the lower planetary disc to the outer ring and cleaned, and then cooperate with the exhaust system set on the lower grinding disc system. The chip extrusion system extrudes and transfers the mixed liquid of impurities, filters and recycles it. While automatically supplying liquid, the grinding impurities can be removed synchronously and in time through ingenious design of the liquid outlet method, which solves the problem that the grinding impurities in the prior art cannot be removed in time, The technical problems of poor quality and low yield of finished silicon wafers

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