Automatic feeding and discharging mechanism for wafer product electroplating hanger

Abstract

The invention discloses an automatic feeding and discharging mechanism for a wafer product electroplating hanger. The automatic feeding and discharging mechanism comprises a Y-direction hanger socket, an electroplating hanger, an X-direction sliding assembly, a P-axis overturning driving assembly, an overturning supporting assembly and a feeding and discharging suction cup assembly. The electroplating hanger is inserted into the Y-direction hanger socket, and at least one side surface of the electroplating hanger is provided with a trough; and the P-axis overturning driving assembly is located on the trough side of the electroplating hanger and is driven by the X-direction sliding assembly to be close to or away from the electroplating hanger in the X-direction. The feeding and discharging suction cup assembly is connected to the P-axis overturning driving assembly through the overturning supporting assembly, and when the P-axis overturning driving assembly drives the overturning supporting assembly to overturn along the P-axis and move in the X-direction, the feeding and discharging suction cup assembly can be driven to be aligned with the trough to complete feeding or discharging of wafer type products. Automatic feeding and discharging operation of products can be achieved, equipment operation and control are more flexible, and efficiency is high.

Description

technical field [0001] The invention relates to the technical field of automation equipment in the semiconductor industry, and more specifically, to an automatic loading and unloading mechanism for an electroplating hanger for wafer products. Background technique [0002] Wafer refers to a silicon wafer made of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. A layer of conductive metal is plated on the wafer, and the conductive metal layer is processed to make a conductive circuit. In the automated process of the semiconductor industry, it is often necessary to flip the wafer up and down around its center. During the flipping process, there is a high requirement for concentricity between the center of the wafer and the center of the rotation axis, and there is also a high requirement for the accuracy of the angle of flipping. For example, the electroplating process is one of the key processes for making these metal layers. How...

AI Technical Summary

Problems solved by technology

For example, the electroplating process is one of the key processes for making these metal layers. However, the existing wafer electroplating equipment, especially the vertical wafer electroplating equipment, usually uses manual operations for wafer electroplating loading and unloading, resulting in low wafer loading and unloading efficiency. At the same time, manual operation also affects the quality of wafer plating

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