Pre-alignment device and pre-alignment method applied to same

Abstract

The embodiment of the invention provides a pre-alignment device and a pre-alignment method applied to the device, and the pre-alignment device comprises a bearing platform which is provided with a central axis and is used for bearing a wafer and driving the wafer to rotate around the central axis of the bearing platform; a position detection module which is used for detecting an offset vector of the central axis of the wafer relative to the central axis of the bearing table; a control module which is used for adjusting the position of the next wafer on the bearing table based on the offset vector; and a pre-alignment module which is used for detecting the gap position of the wafer adjusted by the control module. Through continuous detection and compensation, it is ensured that the position where the wafer is placed does not have too large deviation, so that it is ensured that the pre-alignment module can detect the notch of the wafer, the phenomenon that a machine is shut down due to the fact that the pre-alignment module cannot find the notch of the wafer is prevented, and the detection efficiency of the pre-alignment module is improved; therefore, the yield of wafer products is improved.

Description

technical field [0001] The present invention relates to the field of semiconductor technology, in particular to a pre-alignment device and a pre-alignment method applied to the device. Background technique [0002] At present, before the machine fails, during the process that the machine transports the wafer to the pre-alignment device for calibration, the pre-alignment device does not detect the position of the wafer, and the pre-alignment device does not The sensor is used to detect the position information of the wafer; until the pre-alignment device cannot find the gap of the wafer and the machine is shut down, the engineer will not know the process of the machine transporting the wafer to the pre-alignment device for position calibration , there is a problem with the position of the machine to place the wafer on the carrier table in the pre-alignment device, and then the machine must not be stopped to manually calibrate the position of the machine to place the wafer. ...

AI Technical Summary

Problems solved by technology

[0002] At present, before the machine breaks down, when the machine transports the wafer to the pre-alignment device for calibration, the pre-alignment device will not detect the position of the wafer, and the pre-alignment device has no possibility to The sensor is used to detect the position information of the wafer; the engineer will not know the process of the machine transporting the wafer to the pre-alignment device for position calibration until the pre-alignment device cannot find the gap of the wafer and the machine stops. In the middle, there is a problem with the position of the machine placing the wafer on the carrier table in the pre-alignment device, and then the machine cannot be stopped to manually calibrate the position of the machine placing the wafer

[0003] However, stopping the machine to manually calibrate the position of the machine to place the wafer, in this way, seriously affects the calibration efficiency of the machine, thereby affecting the output of wafer products

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