Roller brush unit concentric snapping structure for cleaning wafers

Abstract

The invention provides a roller brush unit concentric snapping structure for cleaning wafers. An elastic telescopic snapping structure is arranged on a driving unit for realizing quick snapping and changing. The roller brush unit concentric snapping structure reduces a non-coaxiality manufacturing tolerance between a driving shaft and an idle shaft. The rotating shaft and the driving shaft or the idle shaft of the roller brush utilize a structure form in which a conical hole and a conical shaft are connected in a flexible concentric positioning manner and a square hole and a square shaft are connected in a rigid engaging force transmission manner, thereby reducing a rigid connection degree and the rotating shaft, the driving shaft and the idle shaft of the roller brush, attenuating rotation bounce of the rotating shaft of the roller brush, and eliminating impact of roller brush bounce to a wafer. A glyd ring is arranged for realizing bidirectional sealing. Not only is bidirectional leakage of the idle shaft is settled, but also a function of supporting the idle shaft in concentric rotation is performed. The roller brush unit concentric snapping structure for cleaning the wafers is used for a cleaning system after chemically mechanical polishing (CMP) of the wafer, thereby preventing impact damage of the wafer by the roller brush, improving wafer product quality, reducing sealing gasket changing frequency and prolonging maintenance period of the cleaning equipment.

Description

technical field [0001] The invention relates to a wafer cleaning device, in particular to a concentric clamping structure of a rolling brush unit for chemically cleaning a wafer. Background technique [0002] The cleaning after wafer chemical mechanical polishing (CMP) is completed by the rolling drag force of the PVA roller brush on the roller brush unit in the equipment and the scouring of the chemical solution. The PVA rolling brush is overcoated on the rotating shaft of the rotating brush and scrubs the wafer along with the rotation of the rotating shaft of the rotating brush. One end of the traditional rolling brush shaft is connected to the drive shaft of the drive unit, and the other end is connected to the idle shaft of the inertia unit. The connection methods are realized by inserting square holes and square shafts into each other. In this connection structure, the drive shaft and the idle shaft exist as two independent bodies, and there are non-parallel and non-co...

AI Technical Summary

Problems solved by technology

[0004] Another defect of the traditional inertial unit is that the idler shaft and other components are sealed with O-rings. The O-rings have poor sealing effect, short service life, and need to be replaced frequently, which not only causes various wastes but also reduces equipment utilization.

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