This invention relates to a plane salient point encapsulation technology and its structure of IC or discrete components, among which, the technology includes: taking a base plate, dry-film layers are pasted to the front and back side of the base plate, removing part of the upper layer for the preparation of forming a basic island and pins, plating metal layers on the front, removing the rest dry film on the upper layer of the base plate, semi-etching it, removing the dry film on the back, implanting the chip, wiring, packaging with plastic capsule, pasting a dry film on the back of the base plate again, etching the dry film at the back and the rest of the metal of the semi-etched zone again so as to enable the back of the basic island and the pin projecting over the plastic capsule, removing the rest dry film, plating metal layers on the surface, pasting film on the front of the plastic capsule then cutting.