Plane button type packing technology of integrated circuit or discrete component and its packing structure

A planar bump type, discrete component technology, applied in the direction of electrical components, circuits, electrical solid devices, etc., can solve the problems affecting solderability, air residue, water absorption rate increase, etc., to achieve reliability assurance and stable quality , Yield rate improvement effect
CN1725460AActive Publication Date: 2006-01-25长电科技管理有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
长电科技管理有限公司
Publication Date
2006-01-25

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Abstract

This invention relates to a plane salient point encapsulation technology and its structure of IC or discrete components, among which, the technology includes: taking a base plate, dry-film layers are pasted to the front and back side of the base plate, removing part of the upper layer for the preparation of forming a basic island and pins, plating metal layers on the front, removing the rest dry film on the upper layer of the base plate, semi-etching it, removing the dry film on the back, implanting the chip, wiring, packaging with plastic capsule, pasting a dry film on the back of the base plate again, etching the dry film at the back and the rest of the metal of the semi-etched zone again so as to enable the back of the basic island and the pin projecting over the plastic capsule, removing the rest dry film, plating metal layers on the surface, pasting film on the front of the plastic capsule then cutting.
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Description

Technical field:

[0001] The invention relates to a planar bump packaging process for integrated circuits or discrete components and a packaging structure thereof. It belongs to the technical field of packaging of integrated circuits or discrete components. Background technique:

[0002] The traditional ultra-thin leadless packaging process and packaging structure of integrated circuits or discrete components, the packaging type is a four-sided leadless surface mount package, and the display assembly is cut into a single unit. Its substrate type is lead frame type. It mainly has the following deficiencies:

[0003] 1. Lead frame: The lead frame is made by penetrating etching.

[0004] 2. Chemical adhesive film: because of the penetrating etching method, it will cause overflow during the encapsulation process.

[0005] 3. Pollution: Because of the use of chemical tape, the adhesive of the film is easily vaporized due to high temperature in various high-temperature processe...

Claims

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