Plane button type packing technology of integrated circuit or discrete component and its packing structure
A planar bump type, discrete component technology, applied in the direction of electrical components, circuits, electrical solid devices, etc., can solve the problems affecting solderability, air residue, water absorption rate increase, etc., to achieve reliability assurance and stable quality , Yield rate improvement effect
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[0058] The integrated circuit or discrete component planar bump packaging process of the present invention consists of the following steps:
[0059] 1) Substrate-see figure 1 , Take a piece of metal base plate 1 with appropriate thickness. The material of the metal substrate 1 can be changed according to the functions and characteristics of the chip, such as nickel-iron alloy, pure copper, or copper alloy.
[0060] 2) Pasting dry film-see Figure 2, paste dry film layers 2 and 3 on the front and back sides of the metal substrate to protect the subsequent etching process.
[0061] 3) Remove the upper part of the dry film-see image 3 , The dry film on the upper layer of the metal substrate 1 is removed, and a base island and pins are prepared on the metal substrate 1, which is intended to expose the area on the upper layer of the substrate that needs to be plated with a metal layer.
[0062] 4) The metal plating layer on the substrate-see Figure 4 , Plating the required metal laye...
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