Wafer product and processing method therefor

a technology of wafers and products, applied in the field of wafer products, can solve the problems of damage to the expansible sheet attached to the rear face of the wafer, the inability to position the focal point of the inability to position the laser light inside the wafer
US20070111480A1Inactive Publication Date: 2007-05-17DENSO CORP
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
DENSO CORP
Publication Date
2007-05-17
Estimated Expiration
Not applicable · inactive patent

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Abstract

A semiconductor wafer has two faces, one of which is a laser light incident face. A dicing sheet is attached to the other face of the wafer, so that it is stretched to thereby apply tensile stress to a laser-reformed region and cause cutting with the reformed region taken as a starting point for cutting. A protection layer, such as light scattering projections and depressions, a light scattering member or a light reflecting member, is provided between the wafer and the dicing sheet to scatter or reflect the laser light passing through the wafer. Thus, the dicing sheet can be protected from being damaged because the laser light converging point is not formed in the dicing sheet.
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Description

CROSS REFERENCE TO RELATED APPLICATION

[0001] This application is based on and incorporates herein by reference Japanese Patent Applications No. 2005-331209 filed on Nov. 16, 2005, No. 2005-331218 filed on Nov. 16, 2005 and No. 2006-196890 filed on Jul. 19, 2006. FIELD OF THE INVENTION

[0002] The present invention relates to a wafer product and a processing method for the wafer product. In particular, the present invention relates to a wafer product that is cut and separated by cutting with a reformed region due to multiphoton absorption, formed by irradiation with laser light, taken as a starting point for cutting and a processing method for the wafer product. BACKGROUND OF THE INVENTION

[0003] Laser dicing technologies have been developed for cutting and separating (dividing) a wafer-like object to be processed into a plurality of chips using laser light.

[0004] For example, a wafer-like object such as a semiconductor substrate to be processed is irradiated with laser light with a...

Claims

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