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A method for balancing distribution of wafer curvature

A bending degree and density distribution technology, applied in the direction of gaseous chemical plating, coating, electrical components, etc., can solve problems such as unbalanced bending degree distribution, achieve the effect of improving quality and wide application range

Active Publication Date: 2019-01-25
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The invention provides a method for balancing the curvature distribution of wafers, which is used to solve the problem of unbalanced curvature distribution of wafers after multi-step processing in the prior art, so as to improve the quality of wafer products

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  • A method for balancing distribution of wafer curvature
  • A method for balancing distribution of wafer curvature
  • A method for balancing distribution of wafer curvature

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Embodiment Construction

[0036] The specific implementation of the method for balancing wafer curvature distribution provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0037] During the manufacturing process of the wafer and the subsequent process of manufacturing electronic components on the surface of the wafer, the curvature distribution of the wafer may be unbalanced, resulting in warping of the wafer. The occurrence of wafer warpage will cause many problems, such as the peeling off of the laminated film on the wafer surface, wafer cracking, unstable layout alignment performance, and the sucker of the subsequent process cannot hold the wafer, etc., and the subsequent process cannot be completed, which will eventually lead to Instable performance of wafer products, and reduced yield and yield of wafer products.

[0038] Bowl-shaped wafers are a common unbalanced state of wafer bow distribution. For bowl-shaped wafers, the way to bal...

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Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a method for balancing distribution of wafer curvature. The method for balancing the wafer bending distribution comprises the following steps: providing a wafer; Acquiring a curvature distribution of the wafer; Adjusting the density distribution of the reactant on the wafer surface according to the curvature distribution, and forming a film layer with a thickness non-uniformly distributed on the wafer surface. The invention can form a film layer with non-uniform thickness distribution on the wafer surface, realizes the balance of wafer curvature distribution, is suitable for wafers with various shapes, and effectively improves the quality of wafer products.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for balancing the curvature distribution of a wafer. Background technique [0002] With the development of planar flash memory, the production process of semiconductors has made great progress. However, in recent years, the development of planar flash memory has encountered various challenges: physical limits, existing development technology limits, and storage electron density limits. In this context, in order to solve the difficulties encountered in planar flash memory and pursue lower production costs per unit storage unit, various three-dimensional (3D) flash memory structures have emerged, such as 3D NOR (3D or not) flash memory and 3D NAND (3D NAND) flash memory. [0003] Among them, 3D NAND memory takes its small size and large capacity as the starting point, and the design concept of highly integrated storage units stacked in three-dimension...

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Application Information

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IPC IPC(8): H01L21/66C23C16/455
CPCC23C16/45568H01L22/12
Inventor 孟昭生徐文浩李展信刘聪
Owner YANGTZE MEMORY TECH CO LTD
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