Automatic loading and film expanding equipment for wafer discs

Abstract

The invention discloses automatic loading and film expanding equipment for wafer discs. The automatic loading and film expanding equipment for the wafer discs comprises a wafer disc lifting basket device, a lifting basket lifting platform mechanism, a clamping jaw movement mechanism, a wafer clamping jaw mechanism, a wafer mold expanding workbench and an XY-axis linear module. According to the invention, rapid and mass production for blue wafer film discs in a production process for semiconductor devices can be achieved, a manual operation mode is replaced, high efficiency, high quality and stable performance are achieved, middle film expanding machine equipment is reduced, manual operation and production management costs are reduced, unstable quality caused by the fact that product quality changes along with human factors is avoided, meanwhile, production operation is convenient and rapid, wafer products are convenient to store and use, environment protection for the wafer products is facilitated, quality problems such as wafer smudginess are effectively solved, and high production efficiency and stable product quality are achieved.

Description

technical field [0001] The invention relates to the fields of semiconductor processing and industrial automation, in particular to an automatic wafer feeding and film expanding device. Background technique [0002] In the manufacturing process of semiconductor wafer products after wafer cutting and dicing, various blue film carriers are often used, because it has high cleanliness and extremely low ion impurities, moderate hardness, and can effectively absorb vibration and stress. Reduce the occurrence of fragmentation and have excellent thickness uniformity. The specially developed colloid is not easy to produce residual glue, hydrophilic colloid, if you require higher cleanliness after tearing the glue, you only need to wash it with ultra-pure water, it has excellent time stability and excellent adhesion. Good stretchability, easy to pick up chips and other advantages. Wafer dicing blue film is used as follows: blue protective tape is used as surface protection tape in th...

AI Technical Summary

Problems solved by technology

The disadvantages and deficiencies of this method are mainly as follows: first, the film needs to be expanded by the film expander equipment, and manual processing is required after expansion; second, the product quality varies with human factors, and the quality is unstable; Third, wafers are prone to contamination during production transfer, which affects product quality

Fourth, the production efficiency is extremely low, unable to meet the needs of mass production

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