25results about "Current insulating devices" patented technology

The invention discloses a continuous vertical electroplating system, which comprises: a frame body, an annular track is arranged on the frame body, and a plurality of carrying devices moving along the track of the track are arranged on the annular track; the electroplating tunnel module comprises an electrolytic bath and two spraying units arranged in the electrolytic bath, and an electroplating tunnel is formed between the two spraying units; the cathode hanging tool at least comprises a frame main body provided with a window for accommodating a workpiece to be electroplated, a conductive clamping structure used for clamping the workpiece and providing cathode current for the workpiece, and a shielding skirt edge arranged on the inner edge of the window of the frame main body, and the shielding skirt edge is made of a non-metal insulating material; a shielding gap with a preset distance is formed between the shielding skirt edge and the edge of the clamped and fixed workpiece; the vertical electroplating system can solve the problems that when a traditional vertical electroplating system for the PCB is used for electroplating the PCB, due to the fact that an electric field is concentrated in an edge area of a workpiece, the current density is obviously higher than that in a center area, an edge plating layer is too thick, and a center plating layer is insufficient.

Provided herein are methods, inks, devices, and systems for forming metal features on semiconductor substrates. Advantageously, the techniques herein do not require the use of photoresist and can be accomplished without many of the processes and equipment used in conventional process flows. Instead, electrohydrodynamic ejection printing is used to deposit an ink containing electroplating additives, such as accelerators or inhibitors. The printed substrate can then be electroplated with a preferential deposition process that achieves a first deposition rate in areas of the substrate where the ink is present and a second deposition rate in areas of the substrate where the ink is not present, the first and second deposition rates being different from one another. After electroplating, chemical etching may be used to spatially isolate the preferentially grown metal features from one another.

The present invention inhibits or prevents plating liquid from invading a sealed space of a substrate holder, and early detects a case where plating liquid has invaded. A substrate holder for holding a substrate and bringing the substrate into contact with plating liquid to perform plating, wherein the substrate holder has: an internal space that houses a peripheral portion of the substrate in a state of being sealed from the outside of the substrate holder in a state where the substrate is held by the substrate holder; a first passage that communicates the outside of the substrate holder with the internal space to introduce liquid into the internal space; and a detector disposed in the internal space for monitoring a current flowing in the liquid or a resistance of the liquid in a state where the liquid is introduced into the internal space in plating, thereby detecting leakage of plating liquid into the internal space.

Provided is a technique that allows removing gas bubbles attached to a hole of an ionically resistive element.A plating method includes: stirring a plating solution by driving a paddle arranged above the ionically resistive element in a state where an anode and the ionically resistive element are immersed in the plating solution (step S20); immersing a substrate as a cathode in the plating solution in a state where the stirring of the plating solution with the paddle is stopped (step S40); resuming the stirring of the plating solution with the paddle arranged above the ionically resistive element and below the substrate in a state where the substrate is immersed in the plating solution (step S50); and performing a plating process on the substrate by flowing electricity between the substrate and the anode in a state where the stirring of the plating solution with the paddle is resumed (step S60).

The invention provides a plating apparatus. The plating device is provided with: a plating tank; a substrate holder; an anode; at least one resistor disposed between the anode and the substrate holder and used for adjusting an electric field, the at least one resistor having a plurality of through-holes communicating with the anode side and the substrate holder side; and a resistance member disposed between the anode and the substrate holder for adjusting an electric field, the resistance member being provided with an introduction port through which a fluid is introduced, the resistance member being configured such that the volume of the fluid is changed by changing the amount or pressure of the fluid in the resistance member. The resistor member is provided so as not to block the plurality of through-holes on the surface of the at least one resistor closest to the anode.

The invention discloses an electrolytic bath bipolar plate electroplating device with a pre-cleaning function, and relates to the technical field of bipolar plate electroplating. The device comprises an electrolytic bath, wherein an electroplating mechanism is arranged in the electrolytic bath; a cleaning mechanism is arranged on one side of the electrolytic cell, the cleaning mechanism comprises a cleaning tank fixedly mounted on one side of the electrolytic cell, the bipolar plate can be soaked in the cleaning tank through the arranged cleaning mechanism, and pollutants can be separated from the surfaces of the bipolar plate and the outer frame bracket. When the pollutants are separated, the pollutants can float to the liquid level of the cleaning liquid to facilitate follow-up pollution discharge and cleaning, when the pollutants float, the cleaning plate moves upwards to push the cleaning agent, and the pollutants are discharged through the pollution discharge pipe, so that the pollutants are ensured to be removed in time and prevented from being re-deposited in the tank; and meanwhile, a rotating plate is arranged, so that a worker can adjust the hole diameter of a gushing hole according to the gathering degree of pollutants, and the flowing intensity of the cleaning agent is adjusted.

To improve uniformity of plating thickness in a plating apparatus.SOLUTION: A plating apparatus is provided for plating a substrate by passing an electric current from an anode to the substrate. The plating apparatus comprises a plurality of anode-side electrical wires electrically connected to the anode via a plurality of electrical contacts on the anode, a plurality of substrate-side electrical wires electrically connected to the substrate via a plurality of electrical contacts on the substrate, and on at least either one of the anode side or the substrate side, a plurality of variable resistors located in the middle of the plurality of anode-side electrical wires or the plurality of substrate-side electrical wires, and a controller configured to adjust the respective resistance values of the plurality of variable resistors.SELECTED DRAWING: Figure 5

The invention belongs to the field of electroforming, and particularly relates to an anode hanger for electroforming square capillary tubes, which comprises a square metal core mold, four sheet-shaped anodes, four shielding plates, an anode fixing seat, an anode guide seat, two electrically-conductive titanium sheets and a hanging rod. The anode fixing seat is provided with a square through hole. The anode guide seat is provided with a square through hole and a square groove. Flexible bristles are arranged on the wall surface of the square through hole II. The two electrically-conductive titanium sheets are provided with a square through hole III, which are in close contact with and electrically connected to the front and back end surfaces of the sheet-shaped anode. The center lines of the cross sections of the square through hole I, the square through hole and the square through hole III are collinear, and the three are non-contact and reciprocally linearly movable on the square metal core mold. The invention can effectively solve the problems of rounding of the outer surface and poor thickness uniformity of the electroformed square capillary tube, and ensure high-precision forming of the square capillary tube.

Forming plural bumps on a substrate in such a manner that the bumps have uniform heights. A plating apparatus for forming bumps on a substrate is provide. The plating apparatus comprises: a substrate holder constructed to hold the substrate; a plating tank constructed to store plating liquid and the substrate holder; an anode arranged in the inside of the plating tank in such a manner that the anode faces the substrate held by the substrate holder; an electric power source constructed to supply electric current flowing between the substrate and the anode; and a controller; wherein the controller is constructed to make the electric power source output electric current that comprises a first period during that positive-direction electric current is supplied for depositing metal on the substrate from the plating liquid, a second period during that at lest one reverse-current pulse, that flows in a direction opposite to a direction of the positive-direction electric current, is supplied, and a third period during that supplying of electric current is stopped, wherein the third period is a period in the middle of a transition from the reverse-current pulse to the positive-direction electric current.

An electroplating system to process a substrate includes clamps and a membrane. The membrane is held by the clamps and separates a first portion of a chamber of the electroplating system from a second portion of the chamber. The membrane includes a surface extending from a center of a cavity of the chamber radially outward at an angle relative to a reference plane. The angle is greater than or equal to 0° and less than or equal to 3°.

To provide an improved plating system and a plating method which can be used for manufacturing high-quality devices and structures.SOLUTION: An electroplating system comprising a vessel and a paddle disposed within the vessel, the paddle characterized by a first surface and a second surface, the first surface of the paddle including a plurality of ribs extending upwardly from the first surface, wherein the plurality of ribs are arranged substantially parallel around the first surface, the paddle defining a plurality of apertures through the top surface of at least some of the plurality of ribs from the second surface, each of the plurality of apertures having a diameter of 10 mm or less, and the paddle having an open area of 30% or less.SELECTED DRAWING: Figure 5

An electrochemical deposition apparatus is provided to include a process groove body with an accommodating groove is configured to accommodate a plating solution; a substrate carrier including a carrying surface for carrying a substrate to be plated, and at least a portion of the substrate carrier is in the accommodating groove; and at least one driving assembly on the process groove body and configured to control the substrate carrier to move along a first plane, wherein the first plane intersects with a normal direction of the carrying surface.

The present application provides an electroplating apparatus for a substrate, the substrate comprising an electroplating region, the electroplating region comprising a central region and an edge region surrounding the central region, comprising: a substrate holder for holding and rotating the substrate; the edge plate is connected to the lower part of the substrate bracket; wherein the edge plate comprises an annular shielding part, a circle of edge of the electroplating area falls into a projection range of the shielding part on the substrate, and the projection range of the shielding part on the substrate is gradually reduced from outside to inside, so that the electric field shielding intensity of the shielding part on the edge area is gradually reduced from outside to inside; and the current density acting on the edge area and the current density acting on the central area are uniform, so that the coating thicknesses of the edge area and the central area are uniform.

The present disclosure relates to a dispensing system for process fluid for chemical and / or electrolytic surface treatment of a substrate and a manufacturing method for a dispensing system for process fluid for chemical and / or electrolytic surface treatment of a substrate. The dispensing system for process fluid for chemical and / or electrolytic surface treatment of a substrate comprises a dispensing body and a dispensing medium. The dispensing body comprises a plurality of openings for process fluid and / or electric current. The dispensing medium covers at least some of the openings of the dispensing body. The dispensing medium comprises a meshed frame with passages adapted to dispense process fluid and / or electric current from the dispensing body.

The present application provides a kind of plating device.The plating device has: substrate holder, it is configured to be able to rotate around first rotation axis in plating;Anode;Resistance body, it is resistance body for electric field adjustment, with multiple through holes communicated with the anode side of the resistance body and substrate holder side;And at least one rotatable component, be arranged between the anode and the resistance body, for electric field adjustment, the at least one rotatable component is respectively configured to be able to rotate around second rotation axis along the direction of intersection with the first rotation axis, the at least one rotatable component is respectively configured to, from the direction of the first rotation axis, it can be rotated between first position and second position, the first position is the position of overlapping with part of the multiple through holes of the resistance body, the second position is compared with the first position, and the overlap of each rotatable component with the multiple through holes is smaller.

The present invention suppresses generation of plating defects caused by bubbles generated from an anode, and simplifies a configuration related to supply of a plating solution. A plating module (400) includes: a plating bath (410) for housing a plating solution; an anode (430) disposed in the plating bath (410); a substrate holder (440) configured to hold a substrate (Wf) in a state in which a plating surface (Wf-a) faces downward; a diaphragm (420) that separates an anode region (424) in which the anode (430) is disposed and a cathode region (422) in which the substrate (Wf) is disposed at the time of a plating process, the diaphragm having an inclined surface (423a) that opposes the anode (430); a supply port (412) for supplying the plating solution to the anode region (424); and a gas-liquid pipe (470) having a first end portion (472) that opens near an upper end of the inclined surface (423a) of the diaphragm (420) and a second end portion (474) that opens above the plating surface of the substrate at the time of the plating process, the gas-liquid pipe being configured to supply the plating solution supplied from the supply port (412) to the anode region (424) to the cathode region (422) via the second end portion (474).

The present invention appropriately shields a non-pattern region according to a configuration pattern of a wafer on a substrate. A resistor mask for use in a resistor disposed between a substrate and an anode in a plating apparatus and having a cross-shaped pattern region in which two quadrangles overlap, the resistor mask being provided with: first to fourth mask sheets provided so as to correspond to each corner of one of the two quadrangles; and a fifth mask sheet and a sixth mask sheet which are respectively provided on a pair of protruding portions extending outward from each of the two opposite sides of the one quadrangle.

Provided in the present application is an electroplating device for a substrate. The substrate comprises an electroplating region, which comprises a central region and an edge region enclosing the central region. The electroplating device comprises: a substrate holder configured to hold and rotate the substrate; and an edge plate connected below the substrate holder. The edge plate comprises an annular shielding portion. The full edge of the electroplating region falls within the range of the projection of the shielding portion on the substrate. The range of the projection of the shielding portion on the substrate gradually decreases from outside to inside, such that the electric-field shielding strength of the shielding portion against the edge region gradually decreases from outside to inside. As a result, the current density acting on the edge region and the current density acting on the central region are uniform, thereby achieving a uniform plating thickness in the edge region and the central region.

The invention provides a technology capable of realizing film thickness uniformization. The plating method includes: a supply process (S5) in which a substrate is supplied to a plating bath in which an anode and an intermediate member are disposed, the substrate being supplied to a portion not in contact with the intermediate member, the substrate having a pattern formation region in which a plurality of patterns are formed, the contour shape of the pattern formation region being non-circular, and the pattern formation region being formed in a non-circular shape; the intermediate member has a hole-forming region in which a plurality of holes through which the plating solution can pass are formed, and an electric field-shielding region disposed around the hole-forming region, and the contour shape of the hole-forming region corresponds to the contour shape of the pattern-forming region. An alignment process (S10) for adjusting the position of the substrate such that the contour shape of the pattern formation region and the contour shape of the hole formation region are spatially aligned; and a first energizing process (S20) for energizing the anode and the substrate while causing the substrate to swing and rotate.

The invention relates to a shield body system for a process fluid for chemical and / or electrolytic surface treatment of a substrate, use of a shield body system, and a method for a chemical and / or electrolytic surface treatment of a substrate in a process fluid. The shield body system comprises a shield body and an agitation unit. The shield body has a plurality of openings to direct the process fluid flow and / or a current density distribution towards the substrate to be treated. The agitation unit is configured to move the shield body together with the substrate vertically and / or horizontally relative to a distribution body. Alternatively or additionally, the agitation unit is configured to move the shield body together with the substrate vertically and / or horizontally relative to a deposition chamber for chemical and / or electrolytic surface treatment.

The tunnel type electroplating system comprises an electroplating tunnel module which comprises two electrolyte spraying units, an electroplating tunnel allowing a workpiece to be electroplated to penetrate through is formed between the two electrolyte spraying units, and each electrolyte spraying unit comprises a plurality of electroplating devices capable of spraying electrolyte in the second direction; the cathode hanger at least comprises a frame main body, a conductive clamping structure which is arranged on a cross beam at the upper part of the frame main body and is used for clamping a workpiece and providing cathode current for the workpiece, and a shielding skirt edge which is formed by extending towards the inner side along the inner edge of a window of the frame main body, a shielding gap with a preset distance is formed between the shielding skirt edge and the edge of the workpiece clamped by the conductive clamping structure; according to the invention, the problems that the distribution of a flow field and an electric field in a large-size electrolytic bath adopted by traditional vertical continuous electroplating equipment is difficult to be highly uniform, a'dog bone 'phenomenon is easily caused, and the uniformity of a plating layer on the surface of a PCB (Printed Circuit Board) is influenced can be solved.

The present invention appropriately masks a non-pattern area according to a layout pattern of a wafer on a substrate. A resist mask for being disposed between a substrate and an anode in a plating device and having a pattern area of a cross shape formed by two quadrilaterals overlapping each other, wherein a first mask piece to a fourth mask piece are provided corresponding to each corner portion of one of the two quadrilaterals, and a fifth mask piece and a sixth mask piece are provided respectively with respect to a pair of protruding portions extending outward from each side of two mutually opposite sides of the one quadrilateral.

A rotating plating fixture changes an orientation of the substrate throughout a plating cycle. The plating fixture changes the orientation by precisely controlling a rotation speed and position of the substrate. A stepper motor changes the orientation in response to control signals from a controller. The plating fixture includes a stepper motor (110) fixed to a hanger (102), a shaft (108) coupled to the stepper motor, a pinion gear (106) coupled to the shaft such that rotation of the shaft by the stepper motor causes rotation of the pinion gear, and a bevel gear (104) meshing with the pinion gear.

Provided is a plating device capable of improving the uniformity of the thickness of a plating film formed on an object to be plated. A resistor of a plating apparatus includes a first resistor member and a second resistor member. The first resistance member has an annular shape when viewed from above, and a plurality of first through-holes that open on the substrate holder side and the anode side are formed in the first resistance member. An annular groove is formed in the upper surface of the second resistance member, the first resistance member is disposed in the groove, and a plurality of second through-holes open on the substrate holder side and the anode side are formed in the second resistance member. The resistor is configured such that the size of the overlap between the first through-hole of the first resistor member and the second through-hole of the second resistor member is variable by rotating the first resistor member disposed in the groove of the second resistor member.