57results about "Current insulating devices" patented technology

A plating apparatus capable of improving the uniformity of the thickness of a plating film formed on an object to be plated is proposed. The resistor of the plating apparatus includes a first resistive member and a second resistive member disposed between the first resistive member and a substrate holder or between the first resistive member and an anode. The first resistive member has a plurality of first through holes formed therein, the first through holes opening toward the substrate holder side and the anode side, at least some of the first through holes overlap with the second resistive member so that the anode cannot be seen when the anode side is viewed from the substrate side, and the second resistive member is configured such that the distance between the second resistive member and the first resistive member is variable.

Uniformity of plating film thickness distribution is improved in a plating device that supplies power to only one of opposite edges of a substrate. An intermediate mask (30) includes a pair of first edge members (31) that oppose a power supply edge member of a substrate holder, a pair of second edge members (33) that oppose a non-power supply edge member of the substrate holder, a first electric field supply member (35) disposed at the first edge members (31), and a second electric field supply member (37) disposed at the second edge members (33). The first electric field supply member (35) is configured to extend along the first edge members (31) between a first position (PG-1) on an extension line of a first edge (30a-1) of a second central opening (30a) and a second position (PG-2) on an extension line of a second edge (30a-2) opposite the first edge (30a-1). The second electric field supply member (37) is configured to supply an electric field as a pair away from a third position (PG-3) on an extension line of a third edge (30a-3) of the second central opening (30a) and a fourth position (PG-4) on an extension line of a fourth edge (30a-4) opposite the third edge (30a-3).

The invention provides an electroplating device and an electroplating method, and relates to the field of semiconductor manufacturing equipment.The electroplating device comprises a substrate holder used for fixedly holding and rotating a substrate; the film frame is located below the substrate holder, the interior of the film frame is used for containing electroplating liquid, and the film frame is provided with a plurality of liquid outlet holes used for spraying the electroplating liquid to the surface of the substrate; the shielding part is connected with the substrate holder through a fixing column, a gap is formed between the shielding part and the substrate, the shielding part is located between the substrate and the film frame, and the shielding part shields a circle of edge of the substrate and is used for weakening an edge electric field of the substrate. The electroplating device provided by the invention can weaken or shield the electric field near the edge of the substrate, effectively reduce the coating thickness of the edge of the substrate, and realize the uniformity of the coating thickness on the substrate.

The invention discloses a continuous vertical electroplating system, which comprises: a frame body, an annular track is arranged on the frame body, and a plurality of carrying devices moving along the track of the track are arranged on the annular track; the electroplating tunnel module comprises an electrolytic bath and two spraying units arranged in the electrolytic bath, and an electroplating tunnel is formed between the two spraying units; the cathode hanging tool at least comprises a frame main body provided with a window for accommodating a workpiece to be electroplated, a conductive clamping structure used for clamping the workpiece and providing cathode current for the workpiece, and a shielding skirt edge arranged on the inner edge of the window of the frame main body, and the shielding skirt edge is made of a non-metal insulating material; a shielding gap with a preset distance is formed between the shielding skirt edge and the edge of the clamped and fixed workpiece; the vertical electroplating system can solve the problems that when a traditional vertical electroplating system for the PCB is used for electroplating the PCB, due to the fact that an electric field is concentrated in an edge area of a workpiece, the current density is obviously higher than that in a center area, an edge plating layer is too thick, and a center plating layer is insufficient.

Provided herein are methods, inks, devices, and systems for forming metal features on semiconductor substrates. Advantageously, the techniques herein do not require the use of photoresist and can be accomplished without many of the processes and equipment used in conventional process flows. Instead, electrohydrodynamic ejection printing is used to deposit an ink containing electroplating additives, such as accelerators or inhibitors. The printed substrate can then be electroplated with a preferential deposition process that achieves a first deposition rate in areas of the substrate where the ink is present and a second deposition rate in areas of the substrate where the ink is not present, the first and second deposition rates being different from one another. After electroplating, chemical etching may be used to spatially isolate the preferentially grown metal features from one another.

The present invention inhibits or prevents plating liquid from invading a sealed space of a substrate holder, and early detects a case where plating liquid has invaded. A substrate holder for holding a substrate and bringing the substrate into contact with plating liquid to perform plating, wherein the substrate holder has: an internal space that houses a peripheral portion of the substrate in a state of being sealed from the outside of the substrate holder in a state where the substrate is held by the substrate holder; a first passage that communicates the outside of the substrate holder with the internal space to introduce liquid into the internal space; and a detector disposed in the internal space for monitoring a current flowing in the liquid or a resistance of the liquid in a state where the liquid is introduced into the internal space in plating, thereby detecting leakage of plating liquid into the internal space.

An exemplary electroplating system can include a vessel. The system can include a paddle disposed within the vessel. The paddle can be characterized by a first surface and a second surface. The first surface of the paddle can include a plurality of ribs extending upwardly from the first surface. The plurality of ribs can be disposed generally parallel about the first surface. The paddle can define a plurality of apertures through a thickness of the paddle. Each of the plurality of apertures can have a diameter of less than about 5 mm. The paddle can have an open area of ​​less than about 15%.

Provided is a technique that allows removing gas bubbles attached to a hole of an ionically resistive element.A plating method includes: stirring a plating solution by driving a paddle arranged above the ionically resistive element in a state where an anode and the ionically resistive element are immersed in the plating solution (step S20); immersing a substrate as a cathode in the plating solution in a state where the stirring of the plating solution with the paddle is stopped (step S40); resuming the stirring of the plating solution with the paddle arranged above the ionically resistive element and below the substrate in a state where the substrate is immersed in the plating solution (step S50); and performing a plating process on the substrate by flowing electricity between the substrate and the anode in a state where the stirring of the plating solution with the paddle is resumed (step S60).

The invention provides a plating apparatus. The plating device is provided with: a plating tank; a substrate holder; an anode; at least one resistor disposed between the anode and the substrate holder and used for adjusting an electric field, the at least one resistor having a plurality of through-holes communicating with the anode side and the substrate holder side; and a resistance member disposed between the anode and the substrate holder for adjusting an electric field, the resistance member being provided with an introduction port through which a fluid is introduced, the resistance member being configured such that the volume of the fluid is changed by changing the amount or pressure of the fluid in the resistance member. The resistor member is provided so as not to block the plurality of through-holes on the surface of the at least one resistor closest to the anode.

To provide a device for a cell of an apparatus for wet processing of workpieces that enables processing of relatively thin workpieces while holding the workpieces relatively well in a single plane.SOLUTION: This object is achieved according to a first aspect by the device according to the invention, which is characterized in that channels are provided through walls, each channel arranged to conduct liquid to a respective one of the apertures.SELECTED DRAWING: Figure 1

Provided is a plating apparatus which is capable of improving the uniformity of the thickness of a plating film that is formed on an object to be plated.　Also provided is a resistor for electric field adjustment for a plating apparatus, the resistor for a plating apparatus being disposed between an anode and a holder for holding an object to be plated in a plating apparatus. The resistor for a plating apparatus has a plate-like main body. The plate-like main body has an upper surface, a lower surface, and a plurality of through holes with which the upper surface and the lower surface are in communication with each other. The resistor for a plating apparatus additionally has an insertion body that is disposed inside the main body. The insertion body has a plurality of through holes, and the insertion body is movable between a first position at which the plurality of through holes of the insertion body are in communication with the plurality of through holes of the main body and a second position at which the plurality of through holes of the insertion body are not in communication with the plurality of through holes of the main body.

The invention discloses an electrolytic bath bipolar plate electroplating device with a pre-cleaning function, and relates to the technical field of bipolar plate electroplating. The device comprises an electrolytic bath, wherein an electroplating mechanism is arranged in the electrolytic bath; a cleaning mechanism is arranged on one side of the electrolytic cell, the cleaning mechanism comprises a cleaning tank fixedly mounted on one side of the electrolytic cell, the bipolar plate can be soaked in the cleaning tank through the arranged cleaning mechanism, and pollutants can be separated from the surfaces of the bipolar plate and the outer frame bracket. When the pollutants are separated, the pollutants can float to the liquid level of the cleaning liquid to facilitate follow-up pollution discharge and cleaning, when the pollutants float, the cleaning plate moves upwards to push the cleaning agent, and the pollutants are discharged through the pollution discharge pipe, so that the pollutants are ensured to be removed in time and prevented from being re-deposited in the tank; and meanwhile, a rotating plate is arranged, so that a worker can adjust the hole diameter of a gushing hole according to the gathering degree of pollutants, and the flowing intensity of the cleaning agent is adjusted.

A cable includes at least one inner conductor and an insulation layer surrounding the inner conductor. An outer conductive layer surrounds the insulation layer and center conductor and includes a carbon nanotube substrate having opposing face surfaces and edges. One or more metals are applied as layer(s) to the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate. The metallized carbon nanotube substrate is wrapped to surround the insulation layer and center conductor for forming the outer conductive layer. Embodiments of the invention include a braid layer positioned over the outer conductive layer. The braid layer is woven from of plurality of carbon nanotube yarn elements made of a plurality of carbon nanotube filaments. The carbon nanotube filaments include a carbon nanotube core and metal applied as a layer on the carbon nanotube core for forming a metallized carbon nanotube filaments and yarns woven to form the braid layer.

A device for holding and electrically contacting a hollow workpiece (1) for insertion with at least a free end (3) into an interior of the hollow workpiece (1) in an axial direction comprises a first part (10) and a second part (11) for engaging the hollow workpiece (1). At least the first component (10) is electrically conductive and comprises at least one terminal (15) for electrically connecting the first component (10) to a current supply. The first part (10) and the second part (11) are oriented to extend at least mainly parallel to a device axis (13). The device comprises guide portions (19a, b) for guiding the relative movement of the first part (10) and the second part (11). At least a component of the relative movement is a displacement transverse to the device axis (13). The guide parts (19a, b) comprise at least one guide part which is fixed in position relative to the first part (10) and engages with the other guide part at a respective engagement position, said engagement allowing a relative movement. The engagement position is separated from the at least one terminal (15).

Correcting the irregularities in the coating thickness at the periphery of the substrate improves the uniformity of the coating thickness across the entire coated surface. The plating module (400) includes: a plating tank (410) configured to contain a plating solution; an anode (430) disposed within the plating tank (410); a substrate support (440) configured to hold a substrate (Wf) with the plating surface (Wf-a) facing downwards; a lifting mechanism (443) configured to lift the substrate support (440); a rotating mechanism (447) configured to rotate the substrate support (440); a shielding member (481) capable of shielding the electric field formed between the anode (430) and the substrate (Wf); and a shielding mechanism (485) configured to switch between a reference position between the anode (430) and the substrate (Wf), a shielding position with an electric field shielding area larger than the reference position, and a retraction position that retracts from the anode (430) and the substrate (Wf).

The device for gripping a workpiece (2) and making electrical contact with at least one surface of the workpiece (2) comprises a first member (9, 44, 82, 120, 155) extending between a first end (12, 47, 85, 123, 158) and a second end (13, 48, 86, 124, 159), and a workpiece (2) extending between a first end (10, 45, 88, 121, 156) and a second end (11, 46, 84, 122, 157) and a first member (8, 9; 43, 44, 82, 120, 155) extending between a first end (12, 47, 85, 123, 158) and a second end (13, 48, 86, 124, 159). and a second member (8, 43, 81, 119, 154) movably journalled relative to the first member (9, 44, 82, 120, 155) to enable the second member (8, 43, 81, 119, 154) to be held between the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) at respective clamping positions closer to the first ends (10, 45, 88, 121, 156) and (12, 47, 85, 123, 158) than the second ends (11, 46, 84, 122, 157) and (13, 48, 86, 124, 159) along the extent of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155). Each of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) includes at least one section located along the extent of that member (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) between the clamping location and the second ends (11, 46, 84, 122, 157) and (13, 48, 86, 124, 159). At least one of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) is electrically conductive and is provided with a contact area in the clamping position for contacting a surface of the workpiece (2), the contact area including at least one exposed surface (25, 30; 63, 68; 100, 105; 137, 142; 173, 178) facing the other of the first member (8, 43, 81, 119, 154) and the second member (9, 44, 82, 120, 155).The device includes at least one shield portion (17, 32-35, 38-40; 70-72, 75-78; 93a, 93b, 94, 107-109, 112-114; 131, 144-147, 149, 150; 166a, 166b, 167, 180-182, 185-187) that is obtainable independently from the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) and is made of a material having a lower electrical conductivity than the conductive material of the conductive members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155). At least one section located between the clamping position and the second ends (11, 46, 84, 122, 157) and (13, 48, 86, 124, 159) of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) that are conductive is a shield part (17, 32-35, 38-40; 70-72, 75-78; 93a, 93b, 94, 10 7-109, 112-114; 131, 144-147, 149, 150; 166a, 166b, 167, 180-182, 185-187) on a side of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) facing the other of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155). A shielding portion (17, 33, 34, 39, 40; 71, 77, 78; 93a, 93b, 94, 108, 113; 131, 145, 146, 150; 166a, 166b, 167, 181, 186) that shields that section of either of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) on a side of that member facing the other of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) is adjacent to a gap through which liquid can flow between the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155).

To improve uniformity of plating thickness in a plating apparatus.SOLUTION: A plating apparatus is provided for plating a substrate by passing an electric current from an anode to the substrate. The plating apparatus comprises a plurality of anode-side electrical wires electrically connected to the anode via a plurality of electrical contacts on the anode, a plurality of substrate-side electrical wires electrically connected to the substrate via a plurality of electrical contacts on the substrate, and on at least either one of the anode side or the substrate side, a plurality of variable resistors located in the middle of the plurality of anode-side electrical wires or the plurality of substrate-side electrical wires, and a controller configured to adjust the respective resistance values of the plurality of variable resistors.SELECTED DRAWING: Figure 5

To improve in-plane uniformity of a film to be plated on a polygonal substrate. A plating apparatus includes: a plating tank; a substrate holder configured to hold a polygonal substrate; an anode disposed inside the plating tank such that the anode faces the substrate held by the substrate holder; and an anode mask defining an opening corresponding to an outer shape of the polygonal substrate. The anode mask includes a first mask member defining a first projecting portion projecting toward a center of the opening at a center portion of a first opening side of the opening corresponding to a first side of the polygonal substrate and a second mask member defining a second projecting portion projecting toward the center of the opening at a center portion of a second opening side of the opening corresponding to a second side of the polygonal substrate, and is configured to be able to adjust a mutual distance between the first mask member and the second mask member.

The invention belongs to the field of electroforming, and particularly relates to an anode hanger for electroforming square capillary tubes, which comprises a square metal core mold, four sheet-shaped anodes, four shielding plates, an anode fixing seat, an anode guide seat, two electrically-conductive titanium sheets and a hanging rod. The anode fixing seat is provided with a square through hole. The anode guide seat is provided with a square through hole and a square groove. Flexible bristles are arranged on the wall surface of the square through hole II. The two electrically-conductive titanium sheets are provided with a square through hole III, which are in close contact with and electrically connected to the front and back end surfaces of the sheet-shaped anode. The center lines of the cross sections of the square through hole I, the square through hole and the square through hole III are collinear, and the three are non-contact and reciprocally linearly movable on the square metal core mold. The invention can effectively solve the problems of rounding of the outer surface and poor thickness uniformity of the electroformed square capillary tube, and ensure high-precision forming of the square capillary tube.

Forming plural bumps on a substrate in such a manner that the bumps have uniform heights. A plating apparatus for forming bumps on a substrate is provide. The plating apparatus comprises: a substrate holder constructed to hold the substrate; a plating tank constructed to store plating liquid and the substrate holder; an anode arranged in the inside of the plating tank in such a manner that the anode faces the substrate held by the substrate holder; an electric power source constructed to supply electric current flowing between the substrate and the anode; and a controller; wherein the controller is constructed to make the electric power source output electric current that comprises a first period during that positive-direction electric current is supplied for depositing metal on the substrate from the plating liquid, a second period during that at lest one reverse-current pulse, that flows in a direction opposite to a direction of the positive-direction electric current, is supplied, and a third period during that supplying of electric current is stopped, wherein the third period is a period in the middle of a transition from the reverse-current pulse to the positive-direction electric current.

An electroplating system to process a substrate includes clamps and a membrane. The membrane is held by the clamps and separates a first portion of a chamber of the electroplating system from a second portion of the chamber. The membrane includes a surface extending from a center of a cavity of the chamber radially outward at an angle relative to a reference plane. The angle is greater than or equal to 0° and less than or equal to 3°.

To provide an improved plating system and a plating method which can be used for manufacturing high-quality devices and structures.SOLUTION: An electroplating system comprising a vessel and a paddle disposed within the vessel, the paddle characterized by a first surface and a second surface, the first surface of the paddle including a plurality of ribs extending upwardly from the first surface, wherein the plurality of ribs are arranged substantially parallel around the first surface, the paddle defining a plurality of apertures through the top surface of at least some of the plurality of ribs from the second surface, each of the plurality of apertures having a diameter of 10 mm or less, and the paddle having an open area of 30% or less.SELECTED DRAWING: Figure 5

There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; and an intermediate mask placed between the substrate and the anode to be arranged on a substrate side, provided with a first center opening that causes an electric field from the anode toward the substrate to pass through, and further provided with an auxiliary anode that is placed in an internal space of the intermediate mask to be arranged around the first center opening, wherein the auxiliary anode has an area that is not greater than ⅕ of an area of the anode.

A plating apparatus capable of improving the uniformity of the thickness of a plating film formed on an object to be plated is proposed. The plating apparatus resistor is a plating apparatus resistor for adjusting an electric field, which is placed between an anode and a holder that holds an object to be plated in a plating apparatus, the plating apparatus resistor having a plate-shaped body having an upper surface, a lower surface, and a plurality of through holes connecting the upper surface and the lower surface, the plating apparatus resistor further having an insert placed inside the body, the insert having a plurality of through holes, the insert being movable between a first position where the plurality of through holes of the insert communicate with the plurality of through holes of the body, and a second position where the plurality of through holes of the insert do not communicate with the plurality of through holes of the body.

To provide a method of forming a metal film, capable of preventing a screen mask from being damaged upon being pressed by an electrolyte membrane, when the screen mask is used.SOLUTION: A substrate B is placed on a placement table 40. The substrate B is covered with a screen mask 62 having a penetrating part 68 of a prescribed pattern formed therein. The substrate B is pressed by an electrolyte membrane 13 via the screen mask 62 with a liquid pressure of a plating liquid L contacting with the electrolyte membrane 13. A voltage is applied between an anode 11 contacting with the plating liquid L and the substrate B to allow a metal ion included in the plating liquid L to pass through the electrolyte membrane 13 to form a metal film F derived from the metal ion in a prescribed pattern on the substrate B. The substrate B is formed with an outer edge Bc by an opposing face Ba opposing the screen mask 62, and a side face Bb. In the method of forming a metal film, a cushioning material 30 is arranged along the outer edge Bc prior to pressing the substrate B.SELECTED DRAWING: Figure 1

An electrochemical deposition apparatus is provided to include a process groove body with an accommodating groove is configured to accommodate a plating solution; a substrate carrier including a carrying surface for carrying a substrate to be plated, and at least a portion of the substrate carrier is in the accommodating groove; and at least one driving assembly on the process groove body and configured to control the substrate carrier to move along a first plane, wherein the first plane intersects with a normal direction of the carrying surface.

A plating film and a plating method, the plating film including a support structure extending radially outward from a nozzle for directing a flow of a plating solution toward a wafer. The plating film also includes a frame supported by the support structure having an inner wall angled outwardly from the nozzle. The outward angle of the inner wall relative to the nozzle directs the flow of the plating solution from the nozzle in such a manner that: the uniformity of the flow of the plating solution toward the wafer is increased; reducing the amount of the plating solution redirected inward toward the center of the plating film; reducing plating material voids in trenches (e.g., high aspect ratio trenches) of the wafer; and / or the like.

The present application provides an electroplating apparatus for a substrate, the substrate comprising an electroplating region, the electroplating region comprising a central region and an edge region surrounding the central region, comprising: a substrate holder for holding and rotating the substrate; the edge plate is connected to the lower part of the substrate bracket; wherein the edge plate comprises an annular shielding part, a circle of edge of the electroplating area falls into a projection range of the shielding part on the substrate, and the projection range of the shielding part on the substrate is gradually reduced from outside to inside, so that the electric field shielding intensity of the shielding part on the edge area is gradually reduced from outside to inside; and the current density acting on the edge area and the current density acting on the central area are uniform, so that the coating thicknesses of the edge area and the central area are uniform.

The present application provides a resistor capable of improving the uniformity of a plating film formed on a substrate. The present application provides a plating device resistor for adjusting an electric field, which is arranged between an anode and a holder that holds an object to be plated in a plating device. In the plating device resistor, a first resistor member having a first surface and a plurality of first through holes opened in the first surface is provided, and a second resistor member having a second surface and a plurality of second through holes opened in the second surface is provided. The plating device resistor is configured such that the first resistor member and the second resistor member are arranged in a manner that the first surface and the second surface face each other, and the size of the overlap of the plurality of first through holes and the plurality of second through holes is variable.