6results about "Current insulating devices" patented technology

Forming plural bumps on a substrate in such a manner that the bumps have uniform heights. A plating apparatus for forming bumps on a substrate is provide. The plating apparatus comprises: a substrate holder constructed to hold the substrate; a plating tank constructed to store plating liquid and the substrate holder; an anode arranged in the inside of the plating tank in such a manner that the anode faces the substrate held by the substrate holder; an electric power source constructed to supply electric current flowing between the substrate and the anode; and a controller; wherein the controller is constructed to make the electric power source output electric current that comprises a first period during that positive-direction electric current is supplied for depositing metal on the substrate from the plating liquid, a second period during that at lest one reverse-current pulse, that flows in a direction opposite to a direction of the positive-direction electric current, is supplied, and a third period during that supplying of electric current is stopped, wherein the third period is a period in the middle of a transition from the reverse-current pulse to the positive-direction electric current.

An electroplating system to process a substrate includes clamps and a membrane. The membrane is held by the clamps and separates a first portion of a chamber of the electroplating system from a second portion of the chamber. The membrane includes a surface extending from a center of a cavity of the chamber radially outward at an angle relative to a reference plane. The angle is greater than or equal to 0° and less than or equal to 3°.