94results about "Current insulating devices" patented technology

A plating apparatus capable of improving the uniformity of the thickness of a plating film formed on an object to be plated is proposed. The resistor of the plating apparatus includes a first resistive member and a second resistive member disposed between the first resistive member and a substrate holder or between the first resistive member and an anode. The first resistive member has a plurality of first through holes formed therein, the first through holes opening toward the substrate holder side and the anode side, at least some of the first through holes overlap with the second resistive member so that the anode cannot be seen when the anode side is viewed from the substrate side, and the second resistive member is configured such that the distance between the second resistive member and the first resistive member is variable.

Uniformity of plating film thickness distribution is improved in a plating device that supplies power to only one of opposite edges of a substrate. An intermediate mask (30) includes a pair of first edge members (31) that oppose a power supply edge member of a substrate holder, a pair of second edge members (33) that oppose a non-power supply edge member of the substrate holder, a first electric field supply member (35) disposed at the first edge members (31), and a second electric field supply member (37) disposed at the second edge members (33). The first electric field supply member (35) is configured to extend along the first edge members (31) between a first position (PG-1) on an extension line of a first edge (30a-1) of a second central opening (30a) and a second position (PG-2) on an extension line of a second edge (30a-2) opposite the first edge (30a-1). The second electric field supply member (37) is configured to supply an electric field as a pair away from a third position (PG-3) on an extension line of a third edge (30a-3) of the second central opening (30a) and a fourth position (PG-4) on an extension line of a fourth edge (30a-4) opposite the third edge (30a-3).

To improve uniformity of a plating film-thickness formed on a substrate.A plating module 400 includes a plating tank 410 for housing a plating solution, a substrate holder 440 for holding a substrate Wf, an anode 430 housed within the plating tank 410, an anode mask 460 arranged between the substrate Wf held by the substrate holder 440 and the anode 430 and provided with an opening 466 in a center, and an ionically resistive element 450 arranged at an interval from the anode mask 460 between the substrate Wf held by the substrate holder 440 and the anode mask 460 and provided with a plurality of holes.

The invention provides an electroplating device and an electroplating method, and relates to the field of semiconductor manufacturing equipment.The electroplating device comprises a substrate holder used for fixedly holding and rotating a substrate; the film frame is located below the substrate holder, the interior of the film frame is used for containing electroplating liquid, and the film frame is provided with a plurality of liquid outlet holes used for spraying the electroplating liquid to the surface of the substrate; the shielding part is connected with the substrate holder through a fixing column, a gap is formed between the shielding part and the substrate, the shielding part is located between the substrate and the film frame, and the shielding part shields a circle of edge of the substrate and is used for weakening an edge electric field of the substrate. The electroplating device provided by the invention can weaken or shield the electric field near the edge of the substrate, effectively reduce the coating thickness of the edge of the substrate, and realize the uniformity of the coating thickness on the substrate.

A specific portion of a substrate is allowed to be shielded at a desired timing, and making a plating film-thickness uniform is improved.A plating module includes: a plating tank 410 for housing a plating solution; an anode 430 disposed in the plating tank410; a substrate holder 440 for holding a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 447 configured to rotate the substrate holder 440 in a first direction and a second direction opposite to the first direction; and a shielding mechanism 485 configured to move a shielding member 481 into between the anode 430 and the substrate Wf depending on a rotation angle of the substrate holder 440.

The invention discloses a continuous vertical electroplating system, which comprises: a frame body, an annular track is arranged on the frame body, and a plurality of carrying devices moving along the track of the track are arranged on the annular track; the electroplating tunnel module comprises an electrolytic bath and two spraying units arranged in the electrolytic bath, and an electroplating tunnel is formed between the two spraying units; the cathode hanging tool at least comprises a frame main body provided with a window for accommodating a workpiece to be electroplated, a conductive clamping structure used for clamping the workpiece and providing cathode current for the workpiece, and a shielding skirt edge arranged on the inner edge of the window of the frame main body, and the shielding skirt edge is made of a non-metal insulating material; a shielding gap with a preset distance is formed between the shielding skirt edge and the edge of the clamped and fixed workpiece; the vertical electroplating system can solve the problems that when a traditional vertical electroplating system for the PCB is used for electroplating the PCB, due to the fact that an electric field is concentrated in an edge area of a workpiece, the current density is obviously higher than that in a center area, an edge plating layer is too thick, and a center plating layer is insufficient.

Provided herein are methods, inks, devices, and systems for forming metal features on semiconductor substrates. Advantageously, the techniques herein do not require the use of photoresist and can be accomplished without many of the processes and equipment used in conventional process flows. Instead, electrohydrodynamic ejection printing is used to deposit an ink containing electroplating additives, such as accelerators or inhibitors. The printed substrate can then be electroplated with a preferential deposition process that achieves a first deposition rate in areas of the substrate where the ink is present and a second deposition rate in areas of the substrate where the ink is not present, the first and second deposition rates being different from one another. After electroplating, chemical etching may be used to spatially isolate the preferentially grown metal features from one another.

To provide a plating apparatus that corrects disorder in plating film thickness at a peripheral portion of a substrate to improve uniformity of the plating film thickness over the entire surface to be plated.SOLUTION: A plating module 400 comprises a plating tank 410 configured to contain a plating solution, an anode 430 disposed in the plating tank 410, a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward, an elevating mechanism 443 configured to raise and lower the substrate holder 440, a rotation mechanism 447 configured to rotate the substrate holder 440, a shielding member 481 capable of shielding an electric field formed between the anode 430 and the substrate Wf, and a shielding mechanism 485 configured to switch and dispose the shielding member 481 among a reference position between the anode 430 and the substrate Wf, a shielding position where an electric field shielding area becomes larger than at the reference position, and a retracted position retracted from between the anode 430 and the substrate Wf.SELECTED DRAWING: Figure 3

The present invention inhibits or prevents plating liquid from invading a sealed space of a substrate holder, and early detects a case where plating liquid has invaded. A substrate holder for holding a substrate and bringing the substrate into contact with plating liquid to perform plating, wherein the substrate holder has: an internal space that houses a peripheral portion of the substrate in a state of being sealed from the outside of the substrate holder in a state where the substrate is held by the substrate holder; a first passage that communicates the outside of the substrate holder with the internal space to introduce liquid into the internal space; and a detector disposed in the internal space for monitoring a current flowing in the liquid or a resistance of the liquid in a state where the liquid is introduced into the internal space in plating, thereby detecting leakage of plating liquid into the internal space.

An exemplary electroplating system can include a vessel. The system can include a paddle disposed within the vessel. The paddle can be characterized by a first surface and a second surface. The first surface of the paddle can include a plurality of ribs extending upwardly from the first surface. The plurality of ribs can be disposed generally parallel about the first surface. The paddle can define a plurality of apertures through a thickness of the paddle. Each of the plurality of apertures can have a diameter of less than about 5 mm. The paddle can have an open area of ​​less than about 15%.

The present invention provides a plating device capable of improving the uniformity of the thickness of a plated film formed on a plated object. The device-use resistor is a plating device-use resistor for adjusting the electric field, disposed between an anode and a holder holding the plated object in the plating device. The plating device-use resistor comprises a plate-shaped main body having an upper surface, a lower surface, and a plurality of through-holes connecting the upper surface and the lower surface. The plating device-use resistor further comprises an insert disposed within the main body, the insert having a plurality of through-holes, and the insert being movable between a first position in which the plurality of through-holes of the insert communicate with the plurality of through-holes of the main body, and a second position in which the plurality of through-holes of the insert are not connected with the plurality of through-holes of the main body.

Provided is a technique that allows removing gas bubbles attached to a hole of an ionically resistive element.A plating method includes: stirring a plating solution by driving a paddle arranged above the ionically resistive element in a state where an anode and the ionically resistive element are immersed in the plating solution (step S20); immersing a substrate as a cathode in the plating solution in a state where the stirring of the plating solution with the paddle is stopped (step S40); resuming the stirring of the plating solution with the paddle arranged above the ionically resistive element and below the substrate in a state where the substrate is immersed in the plating solution (step S50); and performing a plating process on the substrate by flowing electricity between the substrate and the anode in a state where the stirring of the plating solution with the paddle is resumed (step S60).

The present disclosure is directed to an electroless plating process using a panel basket for holding semiconductor panels comprising a plurality of metal pads and shielding the metal pads from contaminants and over-etching and under-etching caused by the contaminants.

The invention provides a plating apparatus. The plating device is provided with: a plating tank; a substrate holder; an anode; at least one resistor disposed between the anode and the substrate holder and used for adjusting an electric field, the at least one resistor having a plurality of through-holes communicating with the anode side and the substrate holder side; and a resistance member disposed between the anode and the substrate holder for adjusting an electric field, the resistance member being provided with an introduction port through which a fluid is introduced, the resistance member being configured such that the volume of the fluid is changed by changing the amount or pressure of the fluid in the resistance member. The resistor member is provided so as not to block the plurality of through-holes on the surface of the at least one resistor closest to the anode.

To provide a device for a cell of an apparatus for wet processing of workpieces that enables processing of relatively thin workpieces while holding the workpieces relatively well in a single plane.SOLUTION: This object is achieved according to a first aspect by the device according to the invention, which is characterized in that channels are provided through walls, each channel arranged to conduct liquid to a respective one of the apertures.SELECTED DRAWING: Figure 1

A technique capable of preventing bubbles from being accumulated on a lower surface of an electric field shield plate is provided. A plating apparatus includes: a plating tank in which a plating solution is retained, and an anode is arranged: a substrate holder that is arranged above the anode, and holds a substrate serving as a cathode such that a surface to be plated of the substrate faces the anode; a diaphragm that partitions an inside of the plating tank into an anode region where the anode is arranged, and a cathode region where the substrate is arranged; and a supporting member that is in contact with a lower surface of the diaphragm and supports the diaphragm, and includes a plurality of beam components extending over regions between the anode and the substrate along the lower surface of the diaphragm, the beam components including bubble guide paths for guiding bubbles from the regions between the anode and the substrate to an outside.

Provided is a plating apparatus which is capable of improving the uniformity of the thickness of a plating film that is formed on an object to be plated.　Also provided is a resistor for electric field adjustment for a plating apparatus, the resistor for a plating apparatus being disposed between an anode and a holder for holding an object to be plated in a plating apparatus. The resistor for a plating apparatus has a plate-like main body. The plate-like main body has an upper surface, a lower surface, and a plurality of through holes with which the upper surface and the lower surface are in communication with each other. The resistor for a plating apparatus additionally has an insertion body that is disposed inside the main body. The insertion body has a plurality of through holes, and the insertion body is movable between a first position at which the plurality of through holes of the insertion body are in communication with the plurality of through holes of the main body and a second position at which the plurality of through holes of the insertion body are not in communication with the plurality of through holes of the main body.

The invention discloses an electrolytic bath bipolar plate electroplating device with a pre-cleaning function, and relates to the technical field of bipolar plate electroplating. The device comprises an electrolytic bath, wherein an electroplating mechanism is arranged in the electrolytic bath; a cleaning mechanism is arranged on one side of the electrolytic cell, the cleaning mechanism comprises a cleaning tank fixedly mounted on one side of the electrolytic cell, the bipolar plate can be soaked in the cleaning tank through the arranged cleaning mechanism, and pollutants can be separated from the surfaces of the bipolar plate and the outer frame bracket. When the pollutants are separated, the pollutants can float to the liquid level of the cleaning liquid to facilitate follow-up pollution discharge and cleaning, when the pollutants float, the cleaning plate moves upwards to push the cleaning agent, and the pollutants are discharged through the pollution discharge pipe, so that the pollutants are ensured to be removed in time and prevented from being re-deposited in the tank; and meanwhile, a rotating plate is arranged, so that a worker can adjust the hole diameter of a gushing hole according to the gathering degree of pollutants, and the flowing intensity of the cleaning agent is adjusted.

A cable includes at least one inner conductor and an insulation layer surrounding the inner conductor. An outer conductive layer surrounds the insulation layer and center conductor and includes a carbon nanotube substrate having opposing face surfaces and edges. One or more metals are applied as layer(s) to the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate. The metallized carbon nanotube substrate is wrapped to surround the insulation layer and center conductor for forming the outer conductive layer. Embodiments of the invention include a braid layer positioned over the outer conductive layer. The braid layer is woven from of plurality of carbon nanotube yarn elements made of a plurality of carbon nanotube filaments. The carbon nanotube filaments include a carbon nanotube core and metal applied as a layer on the carbon nanotube core for forming a metallized carbon nanotube filaments and yarns woven to form the braid layer.

The present disclosure relates to an electrolyte and current distribution system (1) for the simultaneous chemical and / or electrolytic surface treatment of at least two substrate surfaces (51) of at least two different substrates (5), comprising a substrate holder unit (3) comprising two substrate holders (31), a wetting tank (4), at least two distribution bodies (7) and a control unit, each substrate holder (31) is configured to hold one of the at least two substrates (5) in the wetting tank (4), where the wetting tank (4) is configured to contain a common electrolyte for surface treatment of the substrates (5), where the two substrate holders (31) are further configured to electrically contact the two substrate surfaces (51), wherein each distribution body (7) is arranged for designation to one of the two substrate surfaces (51), and wherein each distribution body (7) comprises an injection hole for directing a flow of electrolyte to the designated substrate surface (51) and a discharge hole for directing an electrical current to the relatively designated substrate surface (51), and wherein the control unit is configured to individually control the flow of the electrolyte and the flow of the current for each distribution body (7) and / or each substrate surface (51). Furthermore, the present disclosure relates to a method (20) of electrolyte and current distribution for simultaneous chemical and / or electrolytic surface treatment of at least two substrate surfaces (51) of at least two different substrates (5).

A device for holding and electrically contacting a hollow workpiece (1) for insertion with at least a free end (3) into an interior of the hollow workpiece (1) in an axial direction comprises a first part (10) and a second part (11) for engaging the hollow workpiece (1). At least the first component (10) is electrically conductive and comprises at least one terminal (15) for electrically connecting the first component (10) to a current supply. The first part (10) and the second part (11) are oriented to extend at least mainly parallel to a device axis (13). The device comprises guide portions (19a, b) for guiding the relative movement of the first part (10) and the second part (11). At least a component of the relative movement is a displacement transverse to the device axis (13). The guide parts (19a, b) comprise at least one guide part which is fixed in position relative to the first part (10) and engages with the other guide part at a respective engagement position, said engagement allowing a relative movement. The engagement position is separated from the at least one terminal (15).

[0003] Examples related to cleaning an ion exchange membrane in an electrodeposition system are disclosed. In one example, the electrodeposition system includes a fluid distribution system comprising a membrane assembly including a membrane frame configured to support an ion exchange membrane defining a boundary of a cathode chamber. The fluid distribution system further includes a high resistance virtual anode (HRVA) positioned between the membrane frame and a substrate holder, a catholyte circulation loop operable to flow catholyte in a first direction across a surface of the HRVA facing the substrate holder, and a plurality of flow barriers extending between the membrane frame and the HRVA along a second direction transverse to the first direction. Cleaning conduits are positioned between adjacent flow barriers, and each cleaning conduit is configured to receive catholyte from the catholyte circulation loop and direct the catholyte toward the membrane assembly via a plurality of emitters.

Provided are an anode holder capable of reducing consumption of an additive in a plating apparatus, and a plating apparatus. An anode holder for holding an anode for use in a plating apparatus is provided, and the anode holder includes an inner space formed in the anode holder, to house the anode, a mask including a plurality of holes, and configured to cover a front surface of the inner space, and a diaphragm, at least part of the diaphragm being fixed to the mask in a region of the mask that covers the front surface of the inner space.

Correcting the irregularities in the coating thickness at the periphery of the substrate improves the uniformity of the coating thickness across the entire coated surface. The plating module (400) includes: a plating tank (410) configured to contain a plating solution; an anode (430) disposed within the plating tank (410); a substrate support (440) configured to hold a substrate (Wf) with the plating surface (Wf-a) facing downwards; a lifting mechanism (443) configured to lift the substrate support (440); a rotating mechanism (447) configured to rotate the substrate support (440); a shielding member (481) capable of shielding the electric field formed between the anode (430) and the substrate (Wf); and a shielding mechanism (485) configured to switch between a reference position between the anode (430) and the substrate (Wf), a shielding position with an electric field shielding area larger than the reference position, and a retraction position that retracts from the anode (430) and the substrate (Wf).

An electrode for an apparatus (1) for electrolytically treating a workpiece (3), the apparatus (1) being of a type arranged to transport the workpiece (3) so that the surface to be treated is directed past and toward the surface of the electrode, the electrode being divided into a plurality of segments (23a-e) at at least the surface of the electrode. The segments (23a-e) are arranged adjacent to one another in a first direction (x). Adjacent segments (23a-e) are separated from one another along their respective segment edges (24a-f) to enable adjacent segments (23a-e) to be maintained at different respective voltages. The segment edges (24a-f) extend at least partially in a second direction (y) from a common coordinate value (y0) in the second direction (y) to at least an edge (25, 26) of the conductive portion of the surface of the electrode, the second direction (y) being transverse to the first direction (x) and corresponding to the direction of movement of the workpiece in use. The segment edges (24a-f) between at least one pair of adjacent segments (23a-e) extend along respective paths, the angles of which relative to the electrode surface edge (25, 26) decreasing from the common coordinate value (y0) towards the electrode surface edge (25, 26).

A device for a cell of an apparatus for wet processing of a planar workpiece, comprises a structure comprising first and second walls. The workpiece is movable in a central plane through a space between the first and second walls in a first direction (y). Apertures for introducing pressurised liquid between the first and second walls are on opposite sides of the central plane and facing the central plane. The apertures are distributed in the first direction (y) and in a second direction (x) transverse to the first direction (y). Discharge openings for the liquid to leave the space are on opposite sides, in the second direction (x), along the space in the first direction (y). The first and second walls form barriers to liquid flow from the space in a direction (z) perpendicular to the central plane. Channels through the walls are arranged to conduct liquid to respective one of the apertures.

The device for gripping a workpiece (2) and making electrical contact with at least one surface of the workpiece (2) comprises a first member (9, 44, 82, 120, 155) extending between a first end (12, 47, 85, 123, 158) and a second end (13, 48, 86, 124, 159), and a workpiece (2) extending between a first end (10, 45, 88, 121, 156) and a second end (11, 46, 84, 122, 157) and a first member (8, 9; 43, 44, 82, 120, 155) extending between a first end (12, 47, 85, 123, 158) and a second end (13, 48, 86, 124, 159). and a second member (8, 43, 81, 119, 154) movably journalled relative to the first member (9, 44, 82, 120, 155) to enable the second member (8, 43, 81, 119, 154) to be held between the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) at respective clamping positions closer to the first ends (10, 45, 88, 121, 156) and (12, 47, 85, 123, 158) than the second ends (11, 46, 84, 122, 157) and (13, 48, 86, 124, 159) along the extent of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155). Each of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) includes at least one section located along the extent of that member (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) between the clamping location and the second ends (11, 46, 84, 122, 157) and (13, 48, 86, 124, 159). At least one of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) is electrically conductive and is provided with a contact area in the clamping position for contacting a surface of the workpiece (2), the contact area including at least one exposed surface (25, 30; 63, 68; 100, 105; 137, 142; 173, 178) facing the other of the first member (8, 43, 81, 119, 154) and the second member (9, 44, 82, 120, 155).The device includes at least one shield portion (17, 32-35, 38-40; 70-72, 75-78; 93a, 93b, 94, 107-109, 112-114; 131, 144-147, 149, 150; 166a, 166b, 167, 180-182, 185-187) that is obtainable independently from the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) and is made of a material having a lower electrical conductivity than the conductive material of the conductive members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155). At least one section located between the clamping position and the second ends (11, 46, 84, 122, 157) and (13, 48, 86, 124, 159) of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) that are conductive is a shield part (17, 32-35, 38-40; 70-72, 75-78; 93a, 93b, 94, 10 7-109, 112-114; 131, 144-147, 149, 150; 166a, 166b, 167, 180-182, 185-187) on a side of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) facing the other of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155). A shielding portion (17, 33, 34, 39, 40; 71, 77, 78; 93a, 93b, 94, 108, 113; 131, 145, 146, 150; 166a, 166b, 167, 181, 186) that shields that section of either of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) on a side of that member facing the other of the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155) is adjacent to a gap through which liquid can flow between the first and second members (8, 9; 43, 44; 81, 82; 119, 120; 154, 155).

To provide a system and method for plating a workpiece.SOLUTION: In one aspect, an apparatus includes a deposition chamber, a workpiece holder adapted for insertion into and removal from the deposition chamber, a shield with patterns of apertures corresponding to features on the workpiece, a shield holder also adapted for insertion into and removal from the deposition chamber, and a positioning mechanism to position the workpiece in the workpiece holder such that the pattern of apertures on the shield will align with the corresponding features on the workpiece when the workpiece holder and the shield support are inserted into the deposition chamber.SELECTED DRAWING: Figure 8

To improve uniformity of plating thickness in a plating apparatus.SOLUTION: A plating apparatus is provided for plating a substrate by passing an electric current from an anode to the substrate. The plating apparatus comprises a plurality of anode-side electrical wires electrically connected to the anode via a plurality of electrical contacts on the anode, a plurality of substrate-side electrical wires electrically connected to the substrate via a plurality of electrical contacts on the substrate, and on at least either one of the anode side or the substrate side, a plurality of variable resistors located in the middle of the plurality of anode-side electrical wires or the plurality of substrate-side electrical wires, and a controller configured to adjust the respective resistance values of the plurality of variable resistors.SELECTED DRAWING: Figure 5

To improve in-plane uniformity of a film to be plated on a polygonal substrate. A plating apparatus includes: a plating tank; a substrate holder configured to hold a polygonal substrate; an anode disposed inside the plating tank such that the anode faces the substrate held by the substrate holder; and an anode mask defining an opening corresponding to an outer shape of the polygonal substrate. The anode mask includes a first mask member defining a first projecting portion projecting toward a center of the opening at a center portion of a first opening side of the opening corresponding to a first side of the polygonal substrate and a second mask member defining a second projecting portion projecting toward the center of the opening at a center portion of a second opening side of the opening corresponding to a second side of the polygonal substrate, and is configured to be able to adjust a mutual distance between the first mask member and the second mask member.