140results about "Current insulating devices" patented technology

There is provided an apparatus for plating, comprising: a plating tank configured to store a plating solution therein; an anode placed in the plating tank and provided with a plurality of through holes; a substrate holder provided to hold a substrate to be opposed to the anode; a barrier membrane placed to be brought into close contact with a first face on a substrate side of the anode; and a rear face plate placed to be opposed to a second face of the anode that is on an opposite side to the first face and to be separated from the second face by a predetermined distance and configured to regulate an amount of bubbles generated from the anode and accumulated on the second face.

A device for holding and electrically contacting a hollow workpiece (1), for insertion with at least a free end (3) in an axial direction into an interior of the hollow workpiece (1), comprises a first member (10) and a second member (11) for engaging the hollow workpiece (1). At least the first member (10) is electrically conducting and comprises at least one terminal (15) for electrically connecting the first member (10) to an electrical current supply. The first and second members (10,11) are oriented to extend at least predominantly parallel to the device axis (13). The device comprises guide parts (19a,b) for guiding relative movement of the first and second members (10,11). At least a component of the relative movement is a displacement transverse to the device axis (13). The guide parts (19a,b) comprise at least one guide part fixed in position with respect to the first member (10) and engaging a further guide part at a respective engagement location, the engagement permitting relative motion. The engagement locations are separate from the at least one terminal (15).

There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; and an intermediate mask placed between the substrate and the anode to be arranged on a substrate side, provided with a first center opening that causes an electric field from the anode toward the substrate to pass through, and further provided with an auxiliary anode that is placed in an internal space of the intermediate mask to be arranged around the first center opening, wherein the auxiliary anode has an area that is not greater than ⅕ of an area of the anode.

A plating apparatus capable of improving the uniformity of the thickness of a plating film formed on an object to be plated is proposed. The resistor of the plating apparatus includes a first resistive member and a second resistive member disposed between the first resistive member and a substrate holder or between the first resistive member and an anode. The first resistive member has a plurality of first through holes formed therein, the first through holes opening toward the substrate holder side and the anode side, at least some of the first through holes overlap with the second resistive member so that the anode cannot be seen when the anode side is viewed from the substrate side, and the second resistive member is configured such that the distance between the second resistive member and the first resistive member is variable.

Uniformity of plating film thickness distribution is improved in a plating device that supplies power to only one of opposite edges of a substrate. An intermediate mask (30) includes a pair of first edge members (31) that oppose a power supply edge member of a substrate holder, a pair of second edge members (33) that oppose a non-power supply edge member of the substrate holder, a first electric field supply member (35) disposed at the first edge members (31), and a second electric field supply member (37) disposed at the second edge members (33). The first electric field supply member (35) is configured to extend along the first edge members (31) between a first position (PG-1) on an extension line of a first edge (30a-1) of a second central opening (30a) and a second position (PG-2) on an extension line of a second edge (30a-2) opposite the first edge (30a-1). The second electric field supply member (37) is configured to supply an electric field as a pair away from a third position (PG-3) on an extension line of a third edge (30a-3) of the second central opening (30a) and a fourth position (PG-4) on an extension line of a fourth edge (30a-4) opposite the third edge (30a-3).

To improve uniformity of a plating film-thickness formed on a substrate.A plating module 400 includes a plating tank 410 for housing a plating solution, a substrate holder 440 for holding a substrate Wf, an anode 430 housed within the plating tank 410, an anode mask 460 arranged between the substrate Wf held by the substrate holder 440 and the anode 430 and provided with an opening 466 in a center, and an ionically resistive element 450 arranged at an interval from the anode mask 460 between the substrate Wf held by the substrate holder 440 and the anode mask 460 and provided with a plurality of holes.

The invention discloses a welding wire electroplating treatment device, and relates to the technical field of welding wire surface electroplating treatment, the welding wire electroplating treatment device comprises an electroplating bath, the top side of the electroplating bath is provided with a lifting mechanism, the lifting mechanism is provided with a threading mechanism used for enabling a welding wire to enter and exit from the electroplating bath on the same side, and the threading mechanism is provided with a rotating mechanism used for enabling an anode in the electroplating bath to rotate; according to the device, through the arrangement of the pulley block, the fixed pulley, the rotating ring, the collecting round frame and the like, in the continuous electroplating process of the welding wires, the welding wires are fed in and discharged out of the single side of the electroplating tank to be matched with rotation of the anode plates, and therefore the welding wires can be continuously electroplated; the electrode distance is dynamically balanced, the stroke of the welding wire in the electroplating bath is prolonged, the coating uniformity is improved, the anode plate rotates to drive the collecting round frame to slide in a reciprocating mode, meanwhile, the surface of the welding wire before and after electroplating is scraped, and the use convenience of the structure is improved.

The invention provides an electroplating device and an electroplating method, and relates to the field of semiconductor manufacturing equipment.The electroplating device comprises a substrate holder used for fixedly holding and rotating a substrate; the film frame is located below the substrate holder, the interior of the film frame is used for containing electroplating liquid, and the film frame is provided with a plurality of liquid outlet holes used for spraying the electroplating liquid to the surface of the substrate; the shielding part is connected with the substrate holder through a fixing column, a gap is formed between the shielding part and the substrate, the shielding part is located between the substrate and the film frame, and the shielding part shields a circle of edge of the substrate and is used for weakening an edge electric field of the substrate. The electroplating device provided by the invention can weaken or shield the electric field near the edge of the substrate, effectively reduce the coating thickness of the edge of the substrate, and realize the uniformity of the coating thickness on the substrate.

A specific portion of a substrate is allowed to be shielded at a desired timing, and making a plating film-thickness uniform is improved.A plating module includes: a plating tank 410 for housing a plating solution; an anode 430 disposed in the plating tank410; a substrate holder 440 for holding a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 447 configured to rotate the substrate holder 440 in a first direction and a second direction opposite to the first direction; and a shielding mechanism 485 configured to move a shielding member 481 into between the anode 430 and the substrate Wf depending on a rotation angle of the substrate holder 440.

The invention discloses a continuous vertical electroplating system, which comprises: a frame body, an annular track is arranged on the frame body, and a plurality of carrying devices moving along the track of the track are arranged on the annular track; the electroplating tunnel module comprises an electrolytic bath and two spraying units arranged in the electrolytic bath, and an electroplating tunnel is formed between the two spraying units; the cathode hanging tool at least comprises a frame main body provided with a window for accommodating a workpiece to be electroplated, a conductive clamping structure used for clamping the workpiece and providing cathode current for the workpiece, and a shielding skirt edge arranged on the inner edge of the window of the frame main body, and the shielding skirt edge is made of a non-metal insulating material; a shielding gap with a preset distance is formed between the shielding skirt edge and the edge of the clamped and fixed workpiece; the vertical electroplating system can solve the problems that when a traditional vertical electroplating system for the PCB is used for electroplating the PCB, due to the fact that an electric field is concentrated in an edge area of a workpiece, the current density is obviously higher than that in a center area, an edge plating layer is too thick, and a center plating layer is insufficient.

A plating membrane includes a support structure extending radially outward from a nozzle that is to direct a flow of a plating solution toward a wafer. The plating membrane also includes a frame, supported by the support structure, having an inner wall that is angled outward from the nozzle. The outward angle of the inner wall relative to the nozzle directs a flow of plating solution from the nozzle in a manner that increases uniformity of the flow of the plating solution toward the wafer, reduces the amount of plating solution that is redirected inward toward the center of the plating membrane, reduces plating material voids in trenches of the wafer (e.g., high aspect ratio trenches), and / or the like.

Provided herein are methods, inks, devices, and systems for forming metal features on semiconductor substrates. Advantageously, the techniques herein do not require the use of photoresist and can be accomplished without many of the processes and equipment used in conventional process flows. Instead, electrohydrodynamic ejection printing is used to deposit an ink containing electroplating additives, such as accelerators or inhibitors. The printed substrate can then be electroplated with a preferential deposition process that achieves a first deposition rate in areas of the substrate where the ink is present and a second deposition rate in areas of the substrate where the ink is not present, the first and second deposition rates being different from one another. After electroplating, chemical etching may be used to spatially isolate the preferentially grown metal features from one another.

To provide a plating apparatus that corrects disorder in plating film thickness at a peripheral portion of a substrate to improve uniformity of the plating film thickness over the entire surface to be plated.SOLUTION: A plating module 400 comprises a plating tank 410 configured to contain a plating solution, an anode 430 disposed in the plating tank 410, a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward, an elevating mechanism 443 configured to raise and lower the substrate holder 440, a rotation mechanism 447 configured to rotate the substrate holder 440, a shielding member 481 capable of shielding an electric field formed between the anode 430 and the substrate Wf, and a shielding mechanism 485 configured to switch and dispose the shielding member 481 among a reference position between the anode 430 and the substrate Wf, a shielding position where an electric field shielding area becomes larger than at the reference position, and a retracted position retracted from between the anode 430 and the substrate Wf.SELECTED DRAWING: Figure 3

The present invention inhibits or prevents plating liquid from invading a sealed space of a substrate holder, and early detects a case where plating liquid has invaded. A substrate holder for holding a substrate and bringing the substrate into contact with plating liquid to perform plating, wherein the substrate holder has: an internal space that houses a peripheral portion of the substrate in a state of being sealed from the outside of the substrate holder in a state where the substrate is held by the substrate holder; a first passage that communicates the outside of the substrate holder with the internal space to introduce liquid into the internal space; and a detector disposed in the internal space for monitoring a current flowing in the liquid or a resistance of the liquid in a state where the liquid is introduced into the internal space in plating, thereby detecting leakage of plating liquid into the internal space.

An exemplary electroplating system can include a vessel. The system can include a paddle disposed within the vessel. The paddle can be characterized by a first surface and a second surface. The first surface of the paddle can include a plurality of ribs extending upwardly from the first surface. The plurality of ribs can be disposed generally parallel about the first surface. The paddle can define a plurality of apertures through a thickness of the paddle. Each of the plurality of apertures can have a diameter of less than about 5 mm. The paddle can have an open area of ​​less than about 15%.

The present invention provides a plating device capable of improving the uniformity of the thickness of a plated film formed on a plated object. The device-use resistor is a plating device-use resistor for adjusting the electric field, disposed between an anode and a holder holding the plated object in the plating device. The plating device-use resistor comprises a plate-shaped main body having an upper surface, a lower surface, and a plurality of through-holes connecting the upper surface and the lower surface. The plating device-use resistor further comprises an insert disposed within the main body, the insert having a plurality of through-holes, and the insert being movable between a first position in which the plurality of through-holes of the insert communicate with the plurality of through-holes of the main body, and a second position in which the plurality of through-holes of the insert are not connected with the plurality of through-holes of the main body.

Appropriately shielding a non-patterned area according to the chip arrangement pattern on the substrate. A resistor mask used for a resistor disposed between a substrate and an anode in a plating apparatus and having a cross-shaped pattern area formed by overlapping two rectangles, the resistor mask including first to fourth mask pieces provided corresponding to respective corners of one of the two rectangles, and fifth and sixth mask pieces provided for respective ones of a pair of protruding portions extending outward from respective sides of two opposite sides of the one rectangle.

Provided is a technique that allows removing gas bubbles attached to a hole of an ionically resistive element.A plating method includes: stirring a plating solution by driving a paddle arranged above the ionically resistive element in a state where an anode and the ionically resistive element are immersed in the plating solution (step S20); immersing a substrate as a cathode in the plating solution in a state where the stirring of the plating solution with the paddle is stopped (step S40); resuming the stirring of the plating solution with the paddle arranged above the ionically resistive element and below the substrate in a state where the substrate is immersed in the plating solution (step S50); and performing a plating process on the substrate by flowing electricity between the substrate and the anode in a state where the stirring of the plating solution with the paddle is resumed (step S60).

The present disclosure is directed to an electroless plating process using a panel basket for holding semiconductor panels comprising a plurality of metal pads and shielding the metal pads from contaminants and over-etching and under-etching caused by the contaminants.

The invention provides a plating apparatus. The plating device is provided with: a plating tank; a substrate holder; an anode; at least one resistor disposed between the anode and the substrate holder and used for adjusting an electric field, the at least one resistor having a plurality of through-holes communicating with the anode side and the substrate holder side; and a resistance member disposed between the anode and the substrate holder for adjusting an electric field, the resistance member being provided with an introduction port through which a fluid is introduced, the resistance member being configured such that the volume of the fluid is changed by changing the amount or pressure of the fluid in the resistance member. The resistor member is provided so as not to block the plurality of through-holes on the surface of the at least one resistor closest to the anode.

To provide a device for a cell of an apparatus for wet processing of workpieces that enables processing of relatively thin workpieces while holding the workpieces relatively well in a single plane.SOLUTION: This object is achieved according to a first aspect by the device according to the invention, which is characterized in that channels are provided through walls, each channel arranged to conduct liquid to a respective one of the apertures.SELECTED DRAWING: Figure 1

A technique capable of preventing bubbles from being accumulated on a lower surface of an electric field shield plate is provided. A plating apparatus includes: a plating tank in which a plating solution is retained, and an anode is arranged: a substrate holder that is arranged above the anode, and holds a substrate serving as a cathode such that a surface to be plated of the substrate faces the anode; a diaphragm that partitions an inside of the plating tank into an anode region where the anode is arranged, and a cathode region where the substrate is arranged; and a supporting member that is in contact with a lower surface of the diaphragm and supports the diaphragm, and includes a plurality of beam components extending over regions between the anode and the substrate along the lower surface of the diaphragm, the beam components including bubble guide paths for guiding bubbles from the regions between the anode and the substrate to an outside.

Provided is a technique capable of achieving uniform film thickness. The plating method includes a supply process (S5) of supplying a substrate to a plating bath in which an anode and an intermediate member are disposed. The substrate is supplied to a location where it does not contact the intermediate member. The substrate has a pattern formation region in which a plurality of patterns are formed, the contour shape of the pattern formation region is non-circular, and the intermediate member has, in a plan view, a hole formation region in which a plurality of holes through which the plating solution can pass are formed, and an electric field shielding region disposed around the hole formation region. The contour shape of the hole formation region corresponds to the contour shape of the pattern formation region. The supply process, an alignment process (S10) of adjusting the position of the substrate so that the contour shape of the pattern formation region and the contour shape of the hole formation region are spatially aligned, and a first energization process (S20) of energizing the anode and the substrate while causing the substrate to perform a rocking rotational motion.

Provided is a plating apparatus which is capable of improving the uniformity of the thickness of a plating film that is formed on an object to be plated.　Also provided is a resistor for electric field adjustment for a plating apparatus, the resistor for a plating apparatus being disposed between an anode and a holder for holding an object to be plated in a plating apparatus. The resistor for a plating apparatus has a plate-like main body. The plate-like main body has an upper surface, a lower surface, and a plurality of through holes with which the upper surface and the lower surface are in communication with each other. The resistor for a plating apparatus additionally has an insertion body that is disposed inside the main body. The insertion body has a plurality of through holes, and the insertion body is movable between a first position at which the plurality of through holes of the insertion body are in communication with the plurality of through holes of the main body and a second position at which the plurality of through holes of the insertion body are not in communication with the plurality of through holes of the main body.

The invention discloses an electrolytic bath bipolar plate electroplating device with a pre-cleaning function, and relates to the technical field of bipolar plate electroplating. The device comprises an electrolytic bath, wherein an electroplating mechanism is arranged in the electrolytic bath; a cleaning mechanism is arranged on one side of the electrolytic cell, the cleaning mechanism comprises a cleaning tank fixedly mounted on one side of the electrolytic cell, the bipolar plate can be soaked in the cleaning tank through the arranged cleaning mechanism, and pollutants can be separated from the surfaces of the bipolar plate and the outer frame bracket. When the pollutants are separated, the pollutants can float to the liquid level of the cleaning liquid to facilitate follow-up pollution discharge and cleaning, when the pollutants float, the cleaning plate moves upwards to push the cleaning agent, and the pollutants are discharged through the pollution discharge pipe, so that the pollutants are ensured to be removed in time and prevented from being re-deposited in the tank; and meanwhile, a rotating plate is arranged, so that a worker can adjust the hole diameter of a gushing hole according to the gathering degree of pollutants, and the flowing intensity of the cleaning agent is adjusted.

A cable includes at least one inner conductor and an insulation layer surrounding the inner conductor. An outer conductive layer surrounds the insulation layer and center conductor and includes a carbon nanotube substrate having opposing face surfaces and edges. One or more metals are applied as layer(s) to the opposing face surfaces and edges of the carbon nanotube substrate for forming a metallized carbon nanotube substrate. The metallized carbon nanotube substrate is wrapped to surround the insulation layer and center conductor for forming the outer conductive layer. Embodiments of the invention include a braid layer positioned over the outer conductive layer. The braid layer is woven from of plurality of carbon nanotube yarn elements made of a plurality of carbon nanotube filaments. The carbon nanotube filaments include a carbon nanotube core and metal applied as a layer on the carbon nanotube core for forming a metallized carbon nanotube filaments and yarns woven to form the braid layer.

The present disclosure relates to an electrolyte and current distribution system (1) for the simultaneous chemical and / or electrolytic surface treatment of at least two substrate surfaces (51) of at least two different substrates (5), comprising a substrate holder unit (3) comprising two substrate holders (31), a wetting tank (4), at least two distribution bodies (7) and a control unit, each substrate holder (31) is configured to hold one of the at least two substrates (5) in the wetting tank (4), where the wetting tank (4) is configured to contain a common electrolyte for surface treatment of the substrates (5), where the two substrate holders (31) are further configured to electrically contact the two substrate surfaces (51), wherein each distribution body (7) is arranged for designation to one of the two substrate surfaces (51), and wherein each distribution body (7) comprises an injection hole for directing a flow of electrolyte to the designated substrate surface (51) and a discharge hole for directing an electrical current to the relatively designated substrate surface (51), and wherein the control unit is configured to individually control the flow of the electrolyte and the flow of the current for each distribution body (7) and / or each substrate surface (51). Furthermore, the present disclosure relates to a method (20) of electrolyte and current distribution for simultaneous chemical and / or electrolytic surface treatment of at least two substrate surfaces (51) of at least two different substrates (5).

A device for holding and electrically contacting a hollow workpiece (1) for insertion with at least a free end (3) into an interior of the hollow workpiece (1) in an axial direction comprises a first part (10) and a second part (11) for engaging the hollow workpiece (1). At least the first component (10) is electrically conductive and comprises at least one terminal (15) for electrically connecting the first component (10) to a current supply. The first part (10) and the second part (11) are oriented to extend at least mainly parallel to a device axis (13). The device comprises guide portions (19a, b) for guiding the relative movement of the first part (10) and the second part (11). At least a component of the relative movement is a displacement transverse to the device axis (13). The guide parts (19a, b) comprise at least one guide part which is fixed in position relative to the first part (10) and engages with the other guide part at a respective engagement position, said engagement allowing a relative movement. The engagement position is separated from the at least one terminal (15).

[0003] Examples related to cleaning an ion exchange membrane in an electrodeposition system are disclosed. In one example, the electrodeposition system includes a fluid distribution system comprising a membrane assembly including a membrane frame configured to support an ion exchange membrane defining a boundary of a cathode chamber. The fluid distribution system further includes a high resistance virtual anode (HRVA) positioned between the membrane frame and a substrate holder, a catholyte circulation loop operable to flow catholyte in a first direction across a surface of the HRVA facing the substrate holder, and a plurality of flow barriers extending between the membrane frame and the HRVA along a second direction transverse to the first direction. Cleaning conduits are positioned between adjacent flow barriers, and each cleaning conduit is configured to receive catholyte from the catholyte circulation loop and direct the catholyte toward the membrane assembly via a plurality of emitters.

Provided are an anode holder capable of reducing consumption of an additive in a plating apparatus, and a plating apparatus. An anode holder for holding an anode for use in a plating apparatus is provided, and the anode holder includes an inner space formed in the anode holder, to house the anode, a mask including a plurality of holes, and configured to cover a front surface of the inner space, and a diaphragm, at least part of the diaphragm being fixed to the mask in a region of the mask that covers the front surface of the inner space.