Control of electrolyte hydrodynamics for efficient mass transfer during electroplating

A technology of electrolyte and electroplating equipment, applied in the direction of electrolysis components, electrolysis process, current insulation devices, etc.

Active Publication Date: 2012-01-25
NOVELLUS SYSTEMS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Higher plating rates create challenges with respect to the uniformity of the electrodeposited layer, i.e. plating must be done in a highly uniform manner

Method used

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  • Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
  • Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
  • Control of electrolyte hydrodynamics for efficient mass transfer during electroplating

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Embodiment Construction

[0047] A. General Device Context

[0048] Figure 1A and Figure 1B The following description provides some general non-limiting context for the devices and methods described herein. Various features presented in the following discussion are also present in one or more of the above figures. The following discussion of such features is intended only as an addition to the description of the embodiments included herein. The particular focus in the last few figures is towards the wafer holder assembly in relation to the various flow shaping plates and flow diverters, and exemplary positioning mechanisms, rotation mechanisms and wafer holders are thus described.

[0049] Figure 1A A perspective view of a wafer holding and positioning apparatus 100 for electrochemically processing semiconductor wafers is provided. Device 100 has various features shown and described in subsequent figures. For example, apparatus 100 includes a wafer engaging assembly (sometimes referred to here...

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Abstract

Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for, and methods including, efficient mass transfer during plating so that highly uniform plating layers are obtained. In specific embodiments, the mass transfer is achieved using a combination of impinging flow and shear flow at the wafer surface.

Description

[0001] Cross References to Related Applications [0002] This application is asserted under 35 U.S.C. §119(e) U.S. Provisional Patent Application No. 61 / 361,333 filed July 2, 2010, U.S. Provisional Patent Application No. 61 / 374,911 filed August 18, 2010 and US Provisional Patent Application No. 61 / 405,608, filed October 21, 2010, each of which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to methods and apparatus for controlling electrolyte hydrodynamics during electroplating. More particularly, the methods and apparatus described herein are particularly useful for plating metals onto semiconductor wafer substrates. Background technique [0004] In modern integrated circuit fabrication, the electrochemical deposition process has gained wide acceptance. The transition from aluminum wires to copper wires in the early years of the twenty-first century has driven the need for increasingly complex electrodeposition ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D19/00C25D21/12
CPCC25D21/10C25D5/04C25D17/02C25D17/001C25D5/08C25D17/008C25D5/02C25D5/611C25D17/00C25D17/002
Inventor 史蒂文·T·迈尔戴维·W·波特
Owner NOVELLUS SYSTEMS
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