Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Control of electrolyte hydrodynamics for efficient mass transfer during electroplating

A technology of electrolyte and electroplating equipment, applied in the direction of electrolysis components, electrolysis process, current insulation devices, etc.

Active Publication Date: 2012-01-25
NOVELLUS SYSTEMS
View PDF9 Cites 32 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Higher plating rates create challenges with respect to the uniformity of the electrodeposited layer, i.e. plating must be done in a highly uniform manner

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
  • Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
  • Control of electrolyte hydrodynamics for efficient mass transfer during electroplating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] A. General Device Context

[0048] Figure 1A and Figure 1B The following description provides some general non-limiting context for the devices and methods described herein. Various features presented in the following discussion are also present in one or more of the above figures. The following discussion of such features is intended only as an addition to the description of the embodiments included herein. The particular focus in the last few figures is towards the wafer holder assembly in relation to the various flow shaping plates and flow diverters, and exemplary positioning mechanisms, rotation mechanisms and wafer holders are thus described.

[0049] Figure 1A A perspective view of a wafer holding and positioning apparatus 100 for electrochemically processing semiconductor wafers is provided. Device 100 has various features shown and described in subsequent figures. For example, apparatus 100 includes a wafer engaging assembly (sometimes referred to here...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
heightaaaaaaaaaa
thicknessaaaaaaaaaa
heightaaaaaaaaaa
Login to View More

Abstract

Described are apparatus and methods for electroplating one or more metals onto a substrate. Embodiments include electroplating apparatus configured for, and methods including, efficient mass transfer during plating so that highly uniform plating layers are obtained. In specific embodiments, the mass transfer is achieved using a combination of impinging flow and shear flow at the wafer surface.

Description

[0001] Cross References to Related Applications [0002] This application is asserted under 35 U.S.C. §119(e) U.S. Provisional Patent Application No. 61 / 361,333 filed July 2, 2010, U.S. Provisional Patent Application No. 61 / 374,911 filed August 18, 2010 and US Provisional Patent Application No. 61 / 405,608, filed October 21, 2010, each of which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to methods and apparatus for controlling electrolyte hydrodynamics during electroplating. More particularly, the methods and apparatus described herein are particularly useful for plating metals onto semiconductor wafer substrates. Background technique [0004] In modern integrated circuit fabrication, the electrochemical deposition process has gained wide acceptance. The transition from aluminum wires to copper wires in the early years of the twenty-first century has driven the need for increasingly complex electrodeposition ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C25D19/00C25D21/12
CPCC25D21/10C25D5/04C25D17/02C25D17/001C25D5/08C25D17/008C25D5/02C25D5/611C25D17/00C25D17/002
Inventor 史蒂文·T·迈尔戴维·W·波特
Owner NOVELLUS SYSTEMS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com