The utility model discloses a packaging device for a plastic mould of a
semiconductor IGBT (Insulated Gate Bipolar Translator) tube, which relates to the technical field of semiconductors, and is characterized in that the packaging device for the plastic mould of the
semiconductor IGBT tube comprises a rack, a lower groove arranged on a lower seat of the rack, and a lower mould fixed at the top of the lower groove; according to the packaging device for the plastic mould of the
semiconductor IGBT tube disclosed by the utility model, the ejection piece, the
cutting piece and the ejection piece are matched, the movable plate is driven to translate upwards, so that pouring gate waste
cutting, waste ejection and packaged
chip ejection can be realized at one time, the cost is saved, the ejection sleeve of the ejection piece slides outside the blocking needle, and the sealing effect is good. When the ejection sleeve starts to carry out ejection work and emits a small section, the air supply
assembly supplies air into the mold cavity through the hose, the inclined groove and the upper portion of the exposed needle groove, the adhesion position of a packaged
chip is evenly ejected open through the air, the ejection
assembly can be assisted to evenly demold the packaged
chip in the vertical direction, and the demolding effect is good.