Halogen-free tin-bismuth-copper soldering paste and preparation method thereof

A tin-bismuth and brazing technology, which is applied in welding equipment, welding medium, manufacturing tools, etc., can solve the problems of mechanical and electrical properties, lower insulation resistance, corrosion of residues, etc., and achieve good mold release , Reduce thermal damage, less corrosive effect

Inactive Publication Date: 2010-04-21
东莞市特尔佳电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is corrosion in the residue after welding, which has potential adverse effects on the mechanical and electrical properties of the product, such as a decrease in insulation resistance, corrosion of the base material, etc., and even lead to product failure.

Method used

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  • Halogen-free tin-bismuth-copper soldering paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Flux raw materials: polymerized rosin 35g, rosin amine polyoxyethylene ether 5g, hydrogenated castor oil 6g, sebacic acid 4g, salicylic acid 4g, triethanolamine 6g, hydroquinone 2g, polyoxyethylene glyceryl ether 2g and di Ethylene glycol monobutyl ether 36g,

[0037] Preparation method: Mix 35g of polymerized rosin, 5g of rosin amine polyoxyethylene ether and 36g of diethylene glycol monobutyl ether, and heat them at 140-150°C until completely dissolved; add 6g of hydrogenated castor oil, 4g of sebacic acid, and salicylic acid in sequence 4g, 6g of triethanolamine, 2g of hydroquinone, completely dissolved and cooled to room temperature, added 2g of polyoxyethylene glyceryl ether, stirred evenly, the prepared flux was placed in a refrigerated environment at 5-12°C for 12 hours, and the flux was taken 15g and 85g of Sn82.5Bi17Cu0.5 alloy powder were mixed and stirred in a vacuum disperser, and stirred evenly to obtain a halogen-free tin-bismuth-copper solder paste.

Embodiment 2

[0039] Flux raw materials: polymerized rosin 30g, hydrogenated rosin 8g, disproportionated rosin amine 6g, stearamide 6g, adipic acid 4g, methyl succinic acid 4g, diethanolamine 8g, 2,6-di-tert-butyl-p-cresol 2g , polyoxyethylene glyceryl ether 2g and ethylene glycol dibutyl ether 22g, tetrahydrofuran solvent 8g,

[0040] Preparation method: Mix 30g of polymerized rosin, 8g of hydrogenated rosin, 6g of disproportionated rosinamine, 22g of ethylene glycol dibutyl ether, and 8g of tetrahydrofuran solvent, mix and heat at 140-150°C until completely dissolved; add 6g of stearylamide, oxalic acid in sequence 4g, methyl succinic acid 4g, diethanolamine 8g, 2,6-di-tert-butyl-p-cresol 2g, after completely dissolving, cool to room temperature, add polyoxyethylene glyceryl ether 2g, after stirring evenly, the prepared flux is placed Refrigerate at 5-12°C for 12 hours, take 14g of flux and 86g of Sn82.5Bi17Cu0.5 alloy powder, mix and stir in a vacuum disperser, and stir evenly to obtain ...

Embodiment 3

[0042] Flux raw materials: polymerized rosin 30g, acrylic resin 10g, rosin amine 2g, disproportionated rosin amine 2g, hydroxyglyceride 6g, suberic acid 2g, dimer acid 2g, stearic acid 1g, diethylenetriamine 5g, 2,6 - Di-tert-butyl-p-cresol 1 g, polyoxyethylene glyceryl ether 2 g and ethylene glycol dibutyl ether 27 g and 2-ethyl-1,3-hexanediol 10 g. 104g

[0043] Preparation method: Mix 30g of polymerized rosin, 10g of acrylic resin, 2g of rosinamine, 2g of disproportionated rosinamine, 27g of ethylene glycol dibutyl ether and 10g of 2-ethyl-1,3-hexanediol and heat them at 140-150°C to Completely dissolve; Add 6g of hydroxyglyceride, 2g of suberic acid, 2g of dimer acid, 1g of stearic acid, 5g of diethylenetriamine, 1g of 2,6-di-tert-butyl-p-cresol in sequence, dissolve completely and cool to room temperature , add 2g of polyoxyethylene glyceryl ether, stir evenly, and place the prepared flux in a refrigerator at 5-12°C for 12 hours, take 13g of flux and 87g of Sn82.5Bi17Cu0...

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Abstract

The invention relates to the technical field of soldering pastes, in particular to a halogen-free tin-bismuth-copper soldering paste and a preparation method thereof. A soldering flux of the halogen-free tin-bismuth-copper soldering paste consists of the following components in percentage by weight: 20 to 40 percent of polymerized rosin, 1 to 6 percent of rosin amine, 4 to 8 percent of thixotropic agent, 5 to 10 percent of organic acid, 5 to 10 percent of organic amine, 1 to 5 percent of antioxidant, 0.5 to 3 percent of surfactant and an organic solvent. The halogen-free tin-bismuth-copper soldering paste is mainly characterized by adopting the organic acid and the organic amine serving as activating agents and comprising no halogens at all, so not only the solderability is not reduced, but also the expansion rate and the insulation resistance value of the soldering paste are improved, and simultaneously the corrosivity of residues after soldering to a base material is reduced and the service life of the soldering paste is prolonged; and particularly, the peak temperature of the soldering paste during soldering is lower in favor of reducing the thermal damages to electronic components.

Description

technical field [0001] The invention relates to the technical field of solder paste, in particular to a halogen-free tin-bismuth-copper solder paste and a preparation method thereof. Background technique [0002] The Sn96.5Ag3Cu0.5 alloy is widely used in the industry due to its good reliability and suitable process parameters (SAC305 for short), but the alloy SAC305 contains 3% precious metal silver, and the cost is high; the melting range of the alloy SAC305 is 217-227 ℃, the soldering temperature is above 245 ℃, and the thermal damage of electronic components with poor thermal shock resistance will be greater. Therefore, finding alternative alloys with low melting point, low cost and high reliability is an urgent problem for manufacturers of electronic welding accessories. [0003] As people pay more and more attention to the environment and improve their awareness of protecting their own health, they put forward high environmental protection requirements for various pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/362B23K35/26B23K35/40
Inventor 陈东明邓小成周华涛
Owner 东莞市特尔佳电子有限公司
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