A kind of tinned copper wire electroplating method

Abstract

The invention belongs to the technical field of electroplating, specifically a tinned copper wire electroplating method. The electroplating device used in the present invention includes an electroplating pool. Both sides of the top of the electroplating pool are installed with rotating shafts through the rotation of the mounting plate. Two The surface of the rotating shaft is fixed with more than two pulleys at equal distances, the top of the electroplating pool is fixed with a dryer, and the bottom of the inner cavity of the electroplating pool is equidistantly provided with more than two rectangular grooves, each of which is slidably connected with sleeves. Two or more rollers are arranged on both sides of the electroplating pool, and the rollers on one side of the electroplating pool are all driven by a motor, and a controller is provided on the electroplating pool; the electroplating device used in the present invention includes a push The structure of the rod motor and the piston can push the casing to move continuously during the movement of the piston. During the movement of the casing, it drives the electroplating solution in the electroplating pool to oscillate, so that the impurities in the electroplating pool will not precipitate, and also make the The electroplating solution is more uniform, which improves the electroplating effect.

Description

technical field [0001] The invention belongs to the technical field of electroplating, in particular to a tinned copper wire electroplating method. Background technique [0002] Copper wire tinning is widely used in the production of wires, cables, and enameled wires. The tin coating is bright and silvery white, which can increase the weldability and decoration of copper without affecting electrical conductivity. It can be used in the electronics industry, furniture, food packaging, etc. Anti-oxidation, increase the beauty of copper workpieces. [0003] At present, there are two main problems in tinning copper wires. One is that the copper wires are placed in coils when they are put into the electroplating pool, and the surfaces of the copper wires will contact each other. The parts that the copper wires touch cannot be electroplated, resulting in electroplating The effect is poor. The second is that the surface of the copper wire is not sufficiently treated during pretreat...

AI Technical Summary

Problems solved by technology

[0003] At present, there are two main problems in tinning copper wires. One is that the copper wires are placed in coils when they are put into the electroplating pool, and the surfaces of the copper wires will contact each other. The parts that the copper wires touch cannot be electroplated, resulting in electroplating The effect is poor. The second is that the surface of the copper wire is not sufficiently treated during pretreatment, resulting in impurities attached to the surface of the copper wire. The impurities will cause the copper wire to produce protrusions during electroplating. This protrusion will fail early when the copper wire is used later. Cause the electroplating failure of copper wire, affect the use effect of electroplated copper wire, accordingly, the present invention proposes a kind of tinned copper wire electroplating method

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