1results about How to "No bumps" patented technology

The application belongs to the field of semiconductor chip assembly, and particularly relates to a method for eutectic sintering of semiconductor chips. The method uses formic acid as a protective agent during eutectic sintering, and scientifically sets the eutectic sintering temperature rising and constant temperature programs, so that heat can be effectively and uniformly transferred to the solder and the chip, the solder can be stably melted, the formation of voids is reduced, and the adverse effects of the voids on the qualified rate of the solder piece are reduced.