Chip component tip packaging paste and preparation method of chip component

A technology for encapsulating slurry and components, which is applied in the direction of coating resistance materials and resistors with negative temperature coefficients, etc., to achieve the effects of qualified reliability, improved precision pass rate, and moderate viscosity

Active Publication Date: 2014-03-12
SHENZHEN SUNLORD ELECTRONICS
View PDF3 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Take the 0402-size chip negative temperature coefficient thermistor that is more common in the industry as an example. For a chip with a nominal resistance of 100kΩ at 25°C, the 1% accuracy pass rate of the chip produced by a non-high-precision process platform is less than or equal to 20%, which is high The 1% accuracy pass rate of the chips produced by the precision production process platform can only reach about 40%

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip component tip packaging paste and preparation method of chip component
  • Chip component tip packaging paste and preparation method of chip component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] This embodiment provides a paste for encapsulating the end of a chip component made of mixing raw materials with different mass ratios. The metal powder, polymer resin, calcium carbonate, and organic solvent are mechanically stirred according to the mass percentage of 40%: 20%: 20%: 20%, wherein the speed of mechanical stirring is 60-100r / min, more preferably 70% -90r / min, stirring and mixing to form an encapsulating slurry, the viscosity is about 150-170Pa*s at 25°C, and the solid content is 70-80%.

[0023] In the embodiment of the encapsulation slurry at the end of the chip component, the mass percentage of metal powder, polymer resin, calcium carbonate, and organic solvent can also be: 40%: 20%: 25%: 15%, or 45%: 20%: 20%: 15%, or 35%: 25%: 30%: 10%, or 40%: 15%: 35%: 10%.

[0024] In addition, it should be noted that silver powder is the best metal powder in this embodiment.

Embodiment 2

[0026] This embodiment provides a method for preparing a chip component by encapsulating the end of the chip component with an encapsulation slurry. This embodiment uses the example of using a thermistor high-precision chip as a chip component, and the encapsulation process of its end includes the following steps:

[0027] (1) Silver powder, polymer resin, calcium carbonate, and organic solvent are mixed according to the mass percentage of 40%: 20%: 25%: 15% respectively to form an encapsulating slurry, wherein the organic solvent can be propyl acetate and ethanol according to The ratio of mass percentage is 3:1 mixed mixture, and the polymer resin can be epoxy resin.

[0028] (2) Use a screen printing machine to print the prepared encapsulation slurry on the end of the high-precision chip of the thermistor on a screen of 300-450 mesh, and print an encapsulation protective layer with a thickness of 15-50 μm, such as figure 1 Shown is the thermistor high-precision chip 1 encap...

Embodiment 3

[0038] This embodiment also provides a method for preparing a chip component by encapsulating the encapsulating slurry on the end of the chip component. This embodiment also uses the example of using a thermistor high-precision chip as a chip component, and the encapsulation process of its end is basically the same as the preparation method of Embodiment 2. The difference is that in this embodiment, silver powder, polymer resin, carbonic acid Calcium and organic solvent are respectively 45%: 20%: 20%: 15% by mass percentage.

[0039] Randomly select 30 0402 chips with a nominal resistance value of 47kΩ made according to the above formula, and test their resistance values, see Table 2 for details.

[0040] Table 2 (unit: kΩ)

[0041] Numbering

[0042] Numbering

[0043] In this embodiment, the high-precision thermistor product made by using the encapsulating slurry has a 1% accuracy pass rate of 76.6%, and the encapsulating slurry can greatly ensure the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses chip component tip packaging paste and a preparation method of a chip component. The packaging paste comprises 35-45% by mass of metal powder, 15-25% by mass of polymer resin, 20-35% by mass of calcium carbonate and 10-20% by mass of organic solvent, and is prepared by mixing the materials. The preparation method of the chip component comprises a packaging process of the chip component, namely packaging the tip of the chip component with the packaging paste. The packaging paste disclosed by the invention has good chemical and physical property stability, good sealing property and moderate viscosity. The chip component prepared by packaging the tip of the chip component with the packaging paste solves the technological problem of chip component tip protection, and increases the 1% precision qualification rate of the prepared chip component.

Description

technical field [0001] The invention relates to a chip component end encapsulation slurry and a preparation method of the chip component. Background technique [0002] In recent years, with the rapid development of SMT technology for passive components, the market has higher and higher requirements for the electrical performance and stability of passive components. Thermistors with negative temperature characteristics are required to be fine-tuned while developing chips. Higher and higher. The chips produced by the original thermistor process platform have a low 1% accuracy pass rate, which makes it difficult to achieve mass production and cannot meet the market's demand for high-precision thermistor chips. The development of a high-precision production process platform is a difficult problem to be overcome, especially the protection of high-precision chip terminals has become a key process. [0003] Take the 0402 size chip negative temperature coefficient thermistor that ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/04H01C17/06
Inventor 王军包汉青黄飞
Owner SHENZHEN SUNLORD ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap