Pattern electroplating method with pattern electroplating accompanying plating plate reusable

A technology of pattern electroplating and accompany plating, which is used in the reinforcement of conductive patterns, removal of conductive materials by chemical/electrolytic methods, electrical components, etc. The effect of improving electroplating quality and reducing production cost

Active Publication Date: 2019-12-20
珠海崇达电路技术有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the problem that the graphic electroplating accompanying plate used in the current VCP electroplating cannot be reused for a long time, which leads to the increase of electroplating cost and affects the production efficiency, and provides a reusable graphic electroplating accompanying plate so as to improve the electroplating production efficiency and reduce the production cost. Pattern plating method

Method used

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  • Pattern electroplating method with pattern electroplating accompanying plating plate reusable

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Effect test

Embodiment

[0028] The present embodiment provides a pattern electroplating method that can be reused for a pattern electroplating accompanying plate, including making a pattern electroplating accompanying plate with a pattern for accompanying plating and being made with a nickel-gold protective layer on the pattern for accompanying plating. The pattern electroplating accompanying plate is etched so that the pattern electroplating accompanying plate can be repeatedly used in pattern electroplating. The specific pattern electroplating method comprises the following steps:

[0029] (1) Select a double-sided copper-clad laminate with a copper layer thickness of H OZ, and cut the double-sided copper-clad laminate according to the size of the production board to obtain a substrate. The height of the substrate is equivalent to the height of the production board, and the height difference is controlled within the range of ±3cm.

[0030] The substrate is coated / filmed, exposed, developed, and et...

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PUM

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Abstract

The invention relates to the technical field of printed circuit boards, in particular to a pattern electroplating method with a pattern electroplating accompanying plating plate reusable. When a VCP is used to carry out pattern electroplating processing on a production board, a pattern electroplating accompanying plating plate which makes an accompanying plating pattern and electroplates a nickelgold layer on the accompanying plating pattern as an etching protection layer is used for accompanying plating, the pattern electroplating accompanying plating plate is used to pass through an alkaline etching line when the production board in each line completes electroplating processing, a copper layer formed on the surface of the pattern electroplating accompanying plating plate in the patternelectroplating processing process is removed through etching processing, the pattern electroplating accompanying plating plate restores the state before the use and can be used again in pattern electroplating processing, reuse of the pattern electroplating accompanying plating plate is realized, the problems that the appearance of the existing pattern electroplating accompanying plating plate becomes poor and the existing pattern electroplating accompanying plating plate becomes heavier and thicker along with increase of the number of times of use, and consequently the pattern electroplating accompanying plating plate falls off, a clamp is damaged, and a copper cylinder is polluted in the pattern electroplating process are completely solved, the production cost can be reduced, and the production efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a reusable pattern electroplating method for a pattern electroplating accompanying plate. Background technique [0002] In the production of circuit boards, electroplating is almost an essential process. At present, electroplating is usually carried out using gantry electroplating lines or vertical continuous electroplating equipment (VCP), and due to the safety and economy of vertical continuous electroplating equipment, it replaces gantry electroplating lines. has become an inevitable trend. [0003] When using vertical continuous electroplating equipment for electroplating, in order to ensure that during the electroplating process of the production board, the first board and the last board in each line of production boards will not cause burn-in problems due to excessive current. An accompanying plate is added in front of one plate and after the last plate, esp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/24H05K3/02H05K3/06
CPCH05K3/022H05K3/06H05K3/241
Inventor 徐文中胡志杨李江涂波
Owner 珠海崇达电路技术有限公司
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