Metal nano injection molding air tightness electric connector and manufacturing process thereof

Abstract

The invention discloses a metal nano injection molding air tightness electric connector manufacturing process. The process comprises the following steps: S1, an outer shell and a contact piece are molded through mechanical processing; S2, the surface of the contact piece matched with the stainless steel or titanium shell for use is plated with nickel and gold, and the contact piece matched with the aluminum alloy or copper alloy shell is not plated; S3, the sealing interface of the nickel and gold-plated contact piece is processed mechanically to remove the plating layer, nano modified treatment is then carried out, nano modified treatment is directly carried out on the stainless steel or titanium alloy shell, and surface nano modified treatment is directly carried out on the aluminum alloy or copper alloy shell and the matched contact piece; and S4, the contact piece is assembled in the outer shell through a nano injection molding process. High strength for the contact piece of the air-tightness connector can be kept, and plug-pull contact reliability can be improved; the electroplating efficiency and the electroplating layer quality can be improved; the weight of the connector is reduced greatly to reduce load of an aircraft; and power load of the air tightness electric connector is greatly enhanced.

Description

technical field [0001] The invention relates to a metal nano-injection-molded airtight electrical connector and a manufacturing process thereof. Background technique [0002] The electrical connector industry used in space and underwater usually requires connectors to be airtight and watertight. Existing seals include glass seals and ceramic seals. Glass sealing is more conventional. It uses a glass body to seal Kovar alloy, stainless steel and other metal casings and Kovar alloy pins at high temperatures. The outer casing and pins are both matched and sealed with Kovar alloy. The outer casing of other non-Kvart alloy materials and Kovar or non-Kvart pins are sealed by compression; the glass body can be a glass plate or a glass bead. Ceramic sealing is to replace glass high-temperature sealing with ceramic metallized interface brazing and sealing. The outer shell is made of light material with gold plating or tin plating, and the inner conductor is made of copper alloy wit...

AI Technical Summary

Problems solved by technology

[0004] 1. After the glass is sealed at high temperature and electroplated, the small Kovar alloy pins are annealed and softened, and it is difficult to maintain sufficient rigidity to support high-strength plug-in connections

[0005] 2. Discrete pins need to be tethered and electroplated. The continuity of the coating is not good or the corrosion resistance is not strong; even if electroless nickel plating, electroless palladium plating, and gold plating after immersion gold plating are used, tethering is required.

[0006] 3. Kovar alloy is heavy, and the electronic products used in aerospace will be limited

[0007] 4. Very low production efficiency

[0008] 5. The electrical conductivity of Kovar alloy connectors is not strong, and gold plating can only reduce its surface resistance value, and large current transmission will cause excessive temperature rise

Long process flow, high energy consumption and high cost

[0011] 2. The dimensional accuracy of the ceramic mounting plate is low. In the process of subsequent brazing and sealing to the connector, precise positioning tooling is required, which further increases the cost

[0012] 3. When coating the brazing sealing interface of the ceramic mounting plate, it is difficult to coat the small holes and deep holes evenly. There is no way to characterize the coating quality of the sintered slurry in the hole. The dispersion of the corresponding quality level is large and controllable Low, the quality of finished products depends on full inspection and control, and cannot be reworked and repaired, and the corresponding quality cost is high

[0013] 4. The production efficiency is relatively low

Images