59results about How to "Increase the amount of glue" patented technology

The invention relates to the technical field of composite boards, and discloses a bamboo and wood composite board and a method for manufacturing the same. The bamboo and wood composite board comprises bamboo layers, wood veneer layers, more than two non-woven fabric layers and adhesive. The corresponding wood veneer layer is arranged between each two bamboo layers, the total quantity of the bamboo layers and the wood veneer layers ranges from 14 to 35, the non-woven fabric layers are arranged between the bamboo layers and the wood veneer layers, the various layers are adhered with one another by the adhesive and are integrally laminated, a surface layer and a bottom layer of the bamboo and wood composite board are bamboo layers respectively, sealing wax layers with waterproof effects are arranged on the surfaces of the bamboo and wood composite board, the bamboo layers are bamboo chip layers or bamboo curtain layers, the thickness of each bamboo layer ranges from 0.5mm to 1.5mm, the thickness of each wood veneer layer ranges from 1.5mm to 2.0mm, the adhesive is made of phenolic resin adhesive with the solid content of 50%, impregnating compounds and more than one type of waterproof agents, mothproofing agents or inorganic flame retardants are added into the phenolic resin adhesive, and the adhesive is applied to double surfaces of each of the bamboo layers, the wood veneer layers and the non-woven fabric layers. The method for manufacturing the bamboo and wood composite board includes steps of manufacturing the adhesive; treating materials of the bamboo layers; treating wood veneers; arraying and assembling blanks; laminating and forming the blanks; treating the surfaces of the blanks and warehousing the finished product.

The invention relates to an electroplating pretreatment method for plastic parts for electroplating, and belongs to the technical field of plastic material treatment. The method comprises the steps that a plastic part for electroplating is fixed to a receiving pole of an electrostatic spinning device, and a polymer solution or melt forms nano-scale fiber through the electrostatic spinning device to be deposited on the surface of the plastic product, so that an electrospun film layer with a large number of submicron-order holes is formed on the surface of the plastic part. Compared with the prior art, the proper surface hole structure is given to the plastic part to be plated through the electrostatic spinning technology, so that the plastic part treated through the method can obtain the surface appearance where metal can be deposited without roughening, and can be put on a line for directly conducting sensitization, activation and electroplating.