Image acquisition module

Abstract

Provided is an image acquisition module, comprising an image sensing unit, a framework housing and an actuator structure. The image sensing unit comprises a bearing substrate, and an image sensing chip arranged on and electrically connected to the bearing substrate. The framework housing is arranged on the bearing substrate through a surrounding adhesive structure, and encircles the image sensing chip, wherein the surrounding adhesive structure comprises a surrounding adhesive colloid of uniform thickness, and a plurality of spheroidal particles of same dimension; the surrounding adhesive colloid is arranged between the bearing substrate and the framework housing, and each spheroidal particle is arranged between the bearing substrate and the framework housing, and is covered by the surrounding adhesive colloid. The actuator structure comprises a lens holder arranged on the framework housing, and a movable lens module capable of being movably arranged in the lens holder.

Description

technical field [0001] The invention relates to an image acquisition module, in particular to an image acquisition module for increasing bonding strength and flatness. Background technique [0002] In recent years, it has become increasingly common for handheld devices such as mobile phones and PDAs to be equipped with imaging modules. With the market demand for better functions and smaller volumes of handheld devices in the product market, imaging modules have become Faced with the dual requirements of higher image quality and miniaturization. For the improvement of the picture quality of the imaging module, on the one hand, it is to increase the pixels. The market trend has been improved from the original VGA level of 30 pixels to the current common 2 million pixels, 3 million pixels, and even worse. Introduce a higher level of more than 8 megapixels. In addition to the improvement of pixels, another concern is the clarity of image capture. Therefore, the image capture m...

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention is to provide an image acquisition module for increasing bonding strength and flatness, which can effectively solve the problem of "when the image sensor and bracket in the known image acquisition module are stacked sequentially with the circuit board as the stacking reference plane." When it goes up, it will cause the assembly inclination angle of the bracket relative to the image sensor to be too large, resulting in the defect that the image quality obtained by the known imaging module cannot be effectively improved”

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