Gluing process for manufacturing copper-clad plate

Abstract

The invention provides a gluing process for manufacturing a copper-clad plate. According to the gluing process, the work can be completed through the cooperation of a fixing frame, a rubber roller, agluing roller and a dispersing device. The gluing process can solve the problems that during gluing, the gluing amount of a base material is smaller, therefore a rotary transmission roller only needsto drive a small amount of glue liquid to the surface of the transmission roller, but resin glue liquid is in a fluid shape, so that the glue liquid is difficultly attached to the surface of the transmission roller, which may cause the situation that the distribution of the glue liquid is not uniform due to the fact that the resin glue liquid is not attached to the surface of the partial transmission roller, so that the partial base material is not subjected to gluing treatment, the resin glue liquid is in a fluid shape after being heated, since the temperature of the surface of the transmission roller is lower, the phenomenon may occur that the partial resin glue liquid is cured when the surface of the transmission roller is in contact with the resin glue liquid, thereby affecting the gluing efficiency of the base material.

Description

technical field [0001] The invention relates to the field of manufacturing copper-clad laminates, in particular to a gluing process for manufacturing copper-clad laminates. Background technique [0002] Copper-clad laminate refers to substrates such as paper and glass fiber cloth, which are impregnated with resin to make bonding sheets. After combining several bonding sheets, copper foil is placed on one or both sides, and the board is cured by hot pressing. Shaped product, used as the basic material of PCB, the gluing process needs to be carried out in the copper clad laminate manufacturing process, the present invention dips the base material through the contact method, and the glue is transported by two transmission rollers during gluing, so that when gluing The amount of glue applied to the surface of the base material is small. Due to the small amount of glue when gluing, the following problems are often encountered during the gluing process: [0003] 1. Since the pres...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above problems, the present invention provides a gluing process for the manufacture of copper clad laminates, which can solve the problem that when gluing, since the amount of gluing on the base material of the present invention is small, the rotating drive roller only needs to apply a small amount of gluing. However, since the resin glue is fluid, it is difficult for the glue to adhere to the surface of the drive roller, which may cause some of the surface of the drive roller to fail to adhere to the resin glue, and the glue distribution is not good. Uniformity, so that some substrates cannot be glued, and the resin glue is fluid after being heated. Due to the low surface temperature of the drive roller, when the surface of the drive roller contacts the resin glue, part of the resin solution may be cured. Thus affecting the gluing efficiency of the substrate and other issues

Images