Light-emitting diode chip packaging structure by using deposition method and manufacturing method thereof

Abstract

The invention discloses a light-emitting diode chip packaging structure by using a deposition method, which comprises a packaging body, at least two conductive substrates, at least one luminous component and a colloid unit, wherein the packaging body has an accommodating space; the at least two conductive substrates are arranged in the accommodating space of the packaging body; the at least one luminous component is fixedly arranged in the accommodating space of the packaging body, and is electrically connected to the at least two conductive substrates; and the colloid unit is provided with acolloid mixed with powder, and is filled in the accommodating space of the packaging body, and the powder is uniformly deposited and cured in the accommodating space of the packaging body respectively in a mode of standing at room temperature and in a mode of subsequent heating and curing.

Description

technical field [0001] The invention relates to a light emitting diode chip packaging structure and a manufacturing method thereof, in particular to a light emitting diode chip packaging structure using a deposition method and a manufacturing method thereof. Background technique [0002] Please refer to FIG. 1 , which is a schematic cross-sectional view of an LED packaging structure manufactured by a wire-bonding process. It can be seen from the figure that the existing LED packaging structure includes: a base structure 1 , a LED 2 disposed on the upper end of the base structure 1 , two wires 3 , and a colloid 4 mixed with phosphor 40 . [0003] Wherein, the light-emitting diode 2 is arranged on the base structure 1 with its light-emitting surface 20 facing away from the base structure 1, and the positive and negative electrode regions 21, 22 at the upper end of the light-emitting diode 2 are electrically connected by the above-mentioned two wires 3 . It is connected to the...

AI Technical Summary

Problems solved by technology

[0004] However, because the existing fluorescent powder 40 is mixed in the colloid 4 and presents an uneven distribution, when the projected light generated by the blue LED penetrates the colloid 4 mixed with the fluorescent powder 40, the existing light is emitted. The white light source projected by the diode package structure is prone to problems of inconsistent condensing capability and color and luster

[0005] Therefore, it can be seen from the above that the current existing LED packaging structure obviously has inconvenience and shortcomings, and needs to be improved.

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