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Light-emitting diode chip packaging structure by using deposition method and manufacturing method thereof

A technology of chip packaging structure and light-emitting diodes, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as uneven distribution, inconvenience, and inconsistent color of white light source, achieving simple manufacturing process, Avoid shortening the luminous efficiency and life, and the effect of good product light properties

Active Publication Date: 2012-03-07
HARVATEK CORPORATION
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, because the existing fluorescent powder 40 is mixed in the colloid 4 and presents an uneven distribution, when the projected light generated by the blue LED penetrates the colloid 4 mixed with the fluorescent powder 40, the existing light is emitted. The white light source projected by the diode package structure is prone to problems of inconsistent condensing capability and color and luster
[0005] Therefore, it can be seen from the above that the current existing LED packaging structure obviously has inconvenience and shortcomings, and needs to be improved.

Method used

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  • Light-emitting diode chip packaging structure by using deposition method and manufacturing method thereof
  • Light-emitting diode chip packaging structure by using deposition method and manufacturing method thereof
  • Light-emitting diode chip packaging structure by using deposition method and manufacturing method thereof

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Embodiment Construction

[0065] see figure 2 ,and Figure 2A to Figure 2C shown, where figure 2 It is a flow chart of the first embodiment of the manufacturing method of the light emitting diode chip packaging structure using the deposition method of the present invention; Figure 2A to Figure 2C Each is a schematic cross-sectional view of the first embodiment of the LED chip packaging structure using the deposition method of the present invention.

[0066] As can be seen from the above figures, the first embodiment of the present invention provides a method for manufacturing a light-emitting diode chip packaging structure using a deposition method, which includes the following steps:

[0067] Step S100: see figure 2 and Figure 2A As shown, at least one light-emitting component 1a is fixed in a package body 2a having an accommodating space 20a. Taking the first embodiment as an example, the above-mentioned at least one light-emitting component 1a is a blue light-emitting diode chip, and the pack...

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Abstract

The invention discloses a light-emitting diode chip packaging structure by using a deposition method, which comprises a packaging body, at least two conductive substrates, at least one luminous component and a colloid unit, wherein the packaging body has an accommodating space; the at least two conductive substrates are arranged in the accommodating space of the packaging body; the at least one luminous component is fixedly arranged in the accommodating space of the packaging body, and is electrically connected to the at least two conductive substrates; and the colloid unit is provided with acolloid mixed with powder, and is filled in the accommodating space of the packaging body, and the powder is uniformly deposited and cured in the accommodating space of the packaging body respectively in a mode of standing at room temperature and in a mode of subsequent heating and curing.

Description

technical field [0001] The invention relates to a light emitting diode chip packaging structure and a manufacturing method thereof, in particular to a light emitting diode chip packaging structure using a deposition method and a manufacturing method thereof. Background technique [0002] Please refer to FIG. 1 , which is a schematic cross-sectional view of an LED packaging structure manufactured by a wire-bonding process. It can be seen from the figure that the existing LED packaging structure includes: a base structure 1 , a LED 2 disposed on the upper end of the base structure 1 , two wires 3 , and a colloid 4 mixed with phosphor 40 . [0003] Wherein, the light-emitting diode 2 is arranged on the base structure 1 with its light-emitting surface 20 facing away from the base structure 1, and the positive and negative electrode regions 21, 22 at the upper end of the light-emitting diode 2 are electrically connected by the above-mentioned two wires 3 . It is connected to the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L25/00H01L25/075H01L21/50H01L21/56
CPCH01L2224/48091H01L2224/48247H01L2224/73265
Inventor 汪秉龙巫世裕黄照元杨秉洲蒋政谚
Owner HARVATEK CORPORATION
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