Light-emitting diode chip packaging structure by using deposition method and manufacturing method thereof
A chip packaging structure and light-emitting diode technology, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, etc., can solve the problems of inconvenience, uneven distribution, and inconsistent color and luster of white light sources, and achieves simple process, Avoid the effect of shortening luminous efficiency and lifespan, and improving the luminous properties of the product
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[0065] see figure 2 ,and Figure 2A to Figure 2C shown, where figure 2 It is a flow chart of the first embodiment of the manufacturing method of the light emitting diode chip packaging structure using the deposition method of the present invention; Figure 2A to Figure 2C Each is a schematic cross-sectional view of the first embodiment of the LED chip packaging structure using the deposition method of the present invention.
[0066] As can be seen from the above figures, the first embodiment of the present invention provides a method for manufacturing a light-emitting diode chip packaging structure using a deposition method, which includes the following steps:
[0067] Step S100: see figure 2 and Figure 2A As shown, at least one light-emitting component 1a is fixed in a package body 2a having an accommodating space 20a. Taking the first embodiment as an example, the above-mentioned at least one light-emitting component 1a is a blue light-emitting diode chip, and the pack...
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