The present application relates to the technical field of
semiconductor packaging, and particularly relates to a preparation method of
wafer cutting adhesive tape based on
ultraviolet curing, which comprises the following steps: obtaining a reference tensile rate corresponding to a current substrate thickness to determine a base film
ductility risk coefficient, obtaining a target dry
adhesive layer thickness to determine an
adhesive layer thickness coefficient, determining an adhesive layer dynamic
viscosity retention index based on the base film
ductility risk coefficient and the adhesive
layer thickness coefficient to determine a characteristic state of adhesive tape parameter setting, quantifying
energy transfer efficiency based on theoretical UV effective
dose, determining an insufficient
viscosity reduction risk reason based on the
energy transfer efficiency, which is that the adhesive layer UV transmission is insufficient or the adhesive layer curing demand is excessive, obtaining a measured
peel force drop rate after main curing of the adhesive layer, combining a saturated
dose required by a
viscosity reduction performance adjustment unit thickness, and determining a saturation threshold of the viscosity reduction performance of the main curing of the adhesive layer. The present application adaptively regulates and controls the performance risk through
dynamic balance of high-strength fixation and UV viscosity reduction.