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427results about How to "Improve ferroelectric properties" patented technology

Field effect transistor based on negative capacitance and preparation method thereof, and biosensor and preparation method thereof

The present invention provides a field effect transistor based on negative capacitance and a preparation method thereof, and a biosensor and a preparation method thereof. The preparation method of thefield effect transistor comprises the steps of: providing a semiconductor substrate comprising underlying silicon, buried oxide and top silicon; defining a channel figure, and a source figure and a drain figure which are connected with two ends; performing ion implantation to positions corresponding to the source figure and the drain figure to form a channel region, a source region and a drain region; forming a dielectric layer at the surface of the channel region; forming a conductive layer at the surface of the dielectric layer, and forming a ferroelectricity material layer at the surface of the conductive layer; and making a source electrode, a drain electrode and a gate electrode. According to the scheme, a traditional field effect transistor is integrated with the ferroelectricity negative capacitance to reduce the subthreshold amplitude of a device, improve the sensing sensitivity and the response speed and facilitate reduction of the device power; and moreover, the ferroelectric-doping hafnium oxide is taken as a ferroelectric negative capacitance medium so as to solve the problem that inorganic ferroelectric materials are difficult to a CMOS technology.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Method for preparing Hf0.5Zr0.5O2 ferroelectric film by ALD for ferroelectric memory applications

The invention discloses a method for preparing a Hf0.5Zr0.5O2 ferroelectric film by ALD for ferroelectric memory applications, characterized by preparing the ferroelectric film by using atomic layer deposition, using a hafnium source and a zirconium source as reaction precursors, using ozone or water as an oxygen source, using a cavity temperature of 250 to 280 degrees centigrade, and using a reaction precursor heating temperature of 75 to 80 degrees centigrade. Compared with a ferroelectric film having a perovskite structure obtained by a conventional process, the ferroelectric film preparedby the method is more liable to be compatible with a standard semiconductor manufacturing process, has higher integration, a lower annealing temperature, a higher annealing rate, shorter annealing time, and a lower ferroelectric layer thickness. The film obtained by a high annealing rate heat treatment process has high remanent polarization, a large dielectric constant, and low leakage current. The preparation method of the invention has high repeatability and can obtain uniform ferroelectric film, and contributes to realizing the wide application prospect of the ferroelectric film in the fields of information storage and integrated circuits.
Owner:INT ACAD OF OPTOELECTRONICS AT ZHAOQING SOUTH CHINA NORMAL UNIV
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