The utility model relates to a
semiconductor device and its packaging technical field, specifically disclose a kind of module terminal and HPD packaging module using laminated
busbar structure, including DC terminal, DC terminal includes: two ends and
chip and
direct current power supply intercommunication's first component and second component, first component and second component current is opposite;First component and second component form laminated
busbar structure to offset
reverse current magnetic field, the partial area of first component and the overall area of second component overlap to expand
magnetic field offset effective area.The utility model forms laminated
busbar structure by setting first component and second component, offset the
magnetic field generated by
reverse current, secondly, the projection area of second component is the effective overlapping area of first component and second component, to expand the effective area of magnetic field offset as far as possible, to reduce total
magnetic flux without affecting
laser welding, to reduce
stray inductance, improve
system reliability.