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47results about How to "Maximum polarization" patented technology

Apparatus and method for ferroelectric conversion of heat to electrical energy

The present invention relates to a new method and apparatus for converting heat to electric energy. The invention exploits the rapid changes in spontaneous polarization that occur in ferroelectric materials during phase change. The invention permits robust and economical generation of electric energy from thermal energy, and it can be used in many different applications. In one aspect, the present invention relates to an apparatus for converting heat to electric energy comprising a pair of electrodes; a ferroelectric layer formed there between with a ferroelectric material characterized with a Curie temperature, Tc, such that when the temperature of the ferroelectric material is lower than Tc, the ferroelectric material is in a ferroelectric phase in which very powerful polarization is established spontaneously in the unit cells of the ferroelectric material, and when the temperature of the ferroelectric material is greater than Tc, spontaneous polarization is not established in the unit cells of the ferroelectric material; and a means for alternately delivering a flow of cold fluid and a flow of hot fluid to the ferroelectric layer so as to alternately cool the ferroelectric layer at a first temperature TL that is lower than Tc, and heat the ferroelectric layer at a second temperature TH that is higher than Tc, thereby the ferroelectric material of the ferroelectric layer undergoes alternating phase transitions between the ferroelectric phase and the paraelectric phase with temperature cycling.
Owner:THE NEOTHERMAL ENERGY

Preparation of AFE capacitor with high energy storage density and high energy storage efficiency, anti-ferroelectric film layer and preparation thereof and flexible AFE capacitor

The invention relates to preparation of an AFE capacitor with high energy storage density and high energy storage efficiency, an anti-ferroelectric film layer and preparation thereof, and a flexible AFE capacitor. The preparation method of the AFE capacitor comprises the following steps: depositing a buffer layer on a substrate; depositing a first electrode layer on the buffer layer; depositing anantiferroelectric thin film layer comprising more than two layers of thin films on the electrode layer; and depositing a second electrode layer on the antiferroelectric film layer to obtain an AFE capacitor, wherein the antiferroelectric thin film layer is deposited through pulse laser, and elements contained in adjacent thin films can be the same or different. According to the AFE capacitor prepared by the invention, the maximum breakdown voltage is improved; meanwhile, according to the AFE capacitor layer prepared by using a method of different excitation number components, the energy storage density and the energy storage efficiency of the AFE capacitor are improved; and the AFE capacitor has excellent fatigue resistance and flexible mechanical properties, the polarization and other properties of the AFE capacitor can be kept in a bent state, and a new way is developed for development and application of novel energy storage equipment.
Owner:SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI

Nitride semiconductor multilayer film reflector and light-emitting device using the same

Achieving resistance reduction of a nitride semiconductor multilayer film reflector. In the nitride semiconductor multilayer film reflector, a first semiconductor layer (104) has a higher Al composition than a second semiconductor layer (106). A first composition-graded layer (105) is interposed between the first and second semiconductor layers (104, 106) so as to be located at a group III element face side of the first semiconductor layer (104), the first composition-graded layer (105) being adjusted so that its Al composition becomes lower as coming close to the second semiconductor layer (106). A second composition-graded layer (103) is interposed between the first and second semiconductor layers (104, 106) so as to be located at a nitride face side of the first semiconductor layer (104). The second composition-graded layer (103) is adjusted so that its Al composition becomes lower as coming close to the second semiconductor layer (106). Energy levels of electrons at bottoms of conduction bands of the first and second semiconductor layers (104, 106) and the first and second composition-graded layers (105, 103) are continuous without band offset. The first composition-graded layer (105) has an n-type impurity concentration of not less than 5×1019 cm−3.
Owner:MEIJO UNIVERSITY
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