The invention provides a device and method for
processing a
semiconductor material through backward multifocal lasers and
electrochemistry in a combined manner. The energy, frequency and
wavelength of the lasers are regulated, and a multifocal
laser beam acts on the back face of a
semiconductor sample; on one hand, when the lasers radiate the back face of the
semiconductor sample, a large amount of light can be stimulated in the semiconductor sample to generate holes, the holes move to the position of the surface of the polished semiconductor sample to participate in the
electrochemistry reaction, and material
corrosion removal is achieved; and on the other hand, on the back face of the semiconductor sample, the multifocal lasers gradually conduct
processing inwards. A work
electrode is a
cathode, the semiconductor sample is used as an
anode, and when the potential between the two electrodes is high,
spark discharge processing is conducted; and when the potential is low,
electrochemistry erosion removal is conducted. The multifocal lasers and electrochemistry act on the semiconductor sample in the combined manner, the
corrosion efficiency is improved, and the surface quality of through holes is improved. When the high-precision micro-through-holes are processed in the semiconductor material, the combination effect is good in action effect, and the device and the method are suitable for precise processing.