A method for preparing tungsten-copper or molybdenum-copper high-voltage contact materials by direct forming

A high-voltage contact, direct technology, applied in the direction of pressure inorganic powder plating, electrical components, electrical switches, etc., can solve the problems of tungsten or molybdenum particle aggregation and growth, copper solidified phase distribution coarse, coarse and uneven, etc., to reduce Equipment cost, overcoming high temperature deformation, and reducing the effect of thermal stress

Inactive Publication Date: 2011-12-21
SHENYANG GOLDEN HEADPOWER NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the preparation process of this infiltration sintering process, the liquid phase copper infiltrates only by the capillary action of the tungsten or molybdenum skeleton pores, the copper

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A method for directly forming a tungsten-copper high-voltage contact material, comprising the following steps:

[0021] The first step is to uniformly mix the raw material powder according to the composition ratio of the high-voltage contact. The composition includes 50-80% copper by mass percentage, 20-50% tungsten, the particle size of tungsten is 5-50μm, and the particle size of copper is 70 -150μm,

[0022] In the second step, the mixed raw material powder is input into the powder feeding system of the cold spraying system, and the heated gas is used for spraying. The temperature of the heated gas is 500-550°C. The collision copper substrate undergoes plastic deformation, and then deposits on the surface of the copper base to form a high-voltage contact material. The gas is air.

[0023] The cold spraying system includes a high-pressure gas source, a gas heater, a high-pressure powder feeder, a gas regulation control system and a spray gun, the high-pressure gas so...

Embodiment 2

[0026] A method for directly forming a tungsten-copper high-voltage contact material, comprising the following steps:

[0027] The first step is to uniformly mix the raw material powder according to the composition ratio of the high-voltage contact. The composition includes 20-60% copper by mass percentage, 40-80% tungsten, the particle size of tungsten is 5-50μm, and the particle size of copper is 70 -150μm,

[0028] In the second step, the mixed raw material powder is input into the powder feeding system of the cold spraying system, and the heated gas is used for spraying. The temperature of the heated gas is 500-550°C. The collision copper substrate undergoes plastic deformation, and then deposits on the surface of the copper base to form a high-voltage contact material. The gas is industrial nitrogen.

[0029] The cold spraying system includes a high-pressure gas source, a gas heater, a high-pressure powder feeder, a gas regulation control system and a spray gun, the high...

Embodiment 3

[0032] A method for directly forming a tungsten-copper high-voltage contact material, comprising the following steps:

[0033] The first step is to uniformly mix the raw material powder according to the composition ratio of the high-voltage contact. The composition includes 20-60% copper by mass percentage, 40-80% tungsten, the particle size of tungsten is 5-50μm, and the particle size of copper is 70 -150μm,

[0034] In the second step, the mixed raw material powder is input into the powder feeding system of the cold spraying system, and the heated gas is used for spraying. The temperature of the heated gas is 500-550°C. The collision copper substrate undergoes plastic deformation, and then deposits on the surface of the copper base to form a high-voltage contact material. The gas is industrial pure argon.

[0035] The cold spraying system includes a high-pressure gas source, a gas heater, a high-pressure powder feeder, a gas regulation control system and a spray gun, the hi...

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Abstract

A method for preparing tungsten-copper or molybdenum-copper high-voltage contact materials by direct forming. Firstly, the raw material powder is uniformly mixed according to the composition ratio of the high-voltage contact, and then the mixed raw material powder is input into the powder feeding system of the cold spraying system. Or spraying with heated gas, under the action of high-pressure gas, the raw material powder collides with the copper substrate to undergo plastic deformation, and then deposits on the surface of the copper base to form a high-voltage contact material, and finally the formed tungsten copper or molybdenum copper high-voltage contact material Use directly or after annealing at 1000-1400°C for 30-60 minutes. The invention simplifies the process, overcomes the high-temperature deformation of the copper base, distributes the copper solidified phase finely and uniformly, reduces the equipment cost of cold spraying, improves the safety of the working process, is suitable for online processing, and saves spraying cost.

Description

technical field [0001] The invention relates to the technical field of high-voltage switch electrical contact materials, in particular to a method for directly forming tungsten-copper or molybdenum-copper high-voltage contact materials. Background technique [0002] Tungsten-copper-based or molybdenum-copper-based alloys are pseudo-alloys composed of high-melting point, high-hardness tungsten or molybdenum and high-conductivity and thermal-conductivity copper. They have good arc erosion resistance, welding resistance, high strength and high hardness. And other advantages, is widely used in various types of ultra-high voltage, high voltage, medium voltage circuit breakers, transformer transfer switches, vacuum contactors, load switch contact material. At present, the main preparation methods of such contacts are as follows: [0003] 1. Mixing-pressing sintering method, which is a traditional powder metallurgy process. Firstly, tungsten powder or molybdenum powder and copper ...

Claims

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Application Information

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IPC IPC(8): C23C24/04H01H11/04
Inventor 王亚平李纯明王慧馨
Owner SHENYANG GOLDEN HEADPOWER NEW MATERIALS
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