81results about "Processing steps order" patented technology

The invention relates to the technical field of automatic production lines of small electric appliances, in particular to an automatic production process of chargers. The automatic production process comprises steps as follows: plate feeding, adhesive dispensing, plug-in mounting of elements, welding, shearing, plate brushing, plate splitting, assembling of a PCBA (printed circuit board assembly), cover assembling, power-on testing, encasement and packaging. After a production line is set according to the procedure, plate feeding is performed firstly, adhesive dispensing is performed on the PCB, various electronic components are plugged in the PCB through a component plug-in machine after adhesive dispensing, the shearing procedure is set behind the welding procedure, then the plate brushing procedure is performed, damage of shearing work to the electronic components is reduced, then, the plate splitting procedure is performed, the processing efficiency of the plate brushing procedure can be greatly improved, a power-on test is performed after the cover assembling procedure is performed, the problems that charging is caused in the cover assembling process and damage of a charger cannot be detected in the power-on test procedure can be effectively solved, and the product quality is more reliable through first cover assembling and second detection.

The invention provides a printed circuit board solder mask manufacturing method. The printed circuit board solder mask manufacturing method is characterized by comprising the steps of silk-screen printing of a first side, pre-drying for the first time, silk-screen printing of a second side, pre-drying for the second time, roller coating, pre-drying for the third time, exposing, developing and post-curing. According to the printed circuit board solder mask manufacturing method, on the premise that the requirement for the solder mask thickness of a product is met, solder mask surface smoothness is improved, and the number of solder mask pits is reduced; meanwhile, due to the fact that roller coating is used for double-faced coating and automatic production is adopted, production efficiency is improved, and production cost is reduced.

The invention discloses a production technique of a half-hole PCB. The production technique comprises the following steps: material cutting by cutting a basal plate whose upper and lower surfaces are covered in copper layers; inner circuit manufacturing by manufacturing an inner circuit on the cut basal plate to get a circuit board; lamination by covering the upper and lower surfaces of the circuit board with a prepreg and copper foil, and conducting lamination to get a multilayer circuit board; round hole drilling by drilling round holes in scheduled positions for formation of half holes on the surface or the edges of the PCB; outer conducting film manufacturing by manufacturing macromolecular conducting films on the upper and lower surfaces of the PCB by a macromolecular conductive polymerization technique; half hole milling by milling the round holes into half holes; copperizing by electrically copperizing the half holes on the PCB; and outer layer photoetching and etching by performing photoetching and etching on the upper and lower surfaces of the PCB. The manufacturing of the half holes is finished before the outer layer photoetching and etching, so as to avoid the situation where hole-wall copper is pulled out when the half holes are being formed, and increase the yield rate of the products.

Disclosed herein is a rigid flexible printed circuit board (PCB) including: a flexible area having a flexible copper foil laminate in which circuit layers are formed on an insulating material, and cover lays formed on the laminate; and rigid areas having insulating layers and copper layers built-up on both sides of the flexible area, and flattening materials to flatten outer surfaces of the insulating layers.

The present disclosure provides a touch panel, including a substrate, at least one sensing electrode layer, a wire layer, a first light-shielding layer and a second light-shielding layer. The substrate has a visible region and a non-visible region. The wire layer corresponds to the non-visible region, wherein the wire layer includes signal lines and at least one gap therebetween, the signal lines electrically connect the sensing electrode layer. The first light-shielding layer is disposed within the non-visible region and between the substrate and the wire layer, wherein the first light-shielding layer includes at least one recess and a position of the recess corresponds to a position of the gap. The second light-shielding layer corresponds to the recess, wherein an area covered by the second light-shielding layer is equal to or greater than an aperture of the recess. The present disclosure also provides a method for manufacturing a touch panel.

The invention belongs to the field of circuit board processing and discloses a method for press fitting a thick copper printed circuit board. The method comprises the following steps of: filling an etched area of the inner-layer board of the printed circuit board with copper and arranging an air discharge duct on an enclosed block formed by filling the copper; performing brown oxide; cutting a prepreg and a copper foil and riveting the inner-layer board and the prepreg by using rivets in an overlapped manner to achieve laminated positoning; prearranging the inner-layer board; stacking boards; performing hot pressing and cold pressing treatment; and drilling a mark hole. After the etched area is filled with the copper, the residual copper rate of the inner-layer board is at least increased by 5 to 10%. Thus, the filling effect of the inner-layer board is obviously enhanced; a technology problem of press fit cavities is effectively relieved, and a decrease in the voltage withstand capability of a product is prevented. The air discharge duct arranged after the copper is filled guarantees good flow of the prepreg in a press fitting production process.

The invention provides a preparation method for HDI rigid-flex PCB interlayer blind hole all-copper filling, comprising the following steps: (1) preparing a double-sided copper-clad board and reducing copper on one side of the double-sided copper-clad board; (2) preparing an inverted trapezoidal blind hole in the copper-reduced side of the double-sided copper-clad board through laser drilling; (3) cleaning the wall and bottom of the blind hole and removing residue left on the wall and bottom during hole drilling; (4) depositing a metal copper layer on the surface of the wall and bottom of the blind hole; and (5) filling the blind hole deposited with the metal copper layer with copper to realize interlayer interconnection of the HDI rigid-flex PCB. Compared with the prior art, HDI rigid-flex PCB interlayer blind hole all-copper filling is realized, the interlayer connectivity of the blind hole is ensured, the wiring density of the HDI rigid-flex PCB is improved, the cost of equipment investment is reduced, and the production efficiency and production benefit are improved.

The invention belongs to the field of processing of a circuit board, in particular relates to a fabrication method for a high-aspect rate copper-thickness printed circuit board (pcb) solder mask. By respectively carrying out the three steps of plug hole processing, circuit oil spraying and screen printing and circuit boards are respectively processed after three steps, and thus, the technological difficulties that green oil in a plug hole is difficult to dry, humidity of the green oil is high, green oil is expanded fast with high temperature to cause oil explosion in the plug hole on PAD and the like are solved. First post-baking treatment is divided into eight sections, second post-baking treatment is divided into six sections, oil explosion during board baking with high temperature in one time is prevented, the fabrication yield of the high-aspect rate copper-thickness pcb solder mask is effectively improved, and the fabrication method has high favorable market prospect and application value.

The invention provides a non-laminated rigid-flexible printed circuit board and a manufacturing method thereof. The manufacturing method of the non-laminated rigid-flex printed circuit board comprises the steps of: manufacturing at least two flexible core boards; manufacturing a circuit pattern on the surface of each flexible core board; sticking pure glue at the slotting zone on one of two opposite surfaces of the adjacent flexible core boards arranged according to the preset stack-up sequence, sticking a cover film at the slotting zone on the other surface and sticking the cover films at the slotting zones on the adjacent surfaces of the flexible core boards and the rigid core boards; arranging grooves, matching with the slotting zones of the flexible core boards, on the rigid core boards and the prepregs; stacking up and pressing all flexible core boards, rigid core boards and prepregs according to the preset sequence. According to the non-laminated rigid-flexible printed circuit board and the manufacturing method thereof, the cracking risk of holes can be effectively avoided, the heat-resisting reliability and size stability of the non-laminating rigid-flexible printed circuit board can be guaranteed and the impedance design requirement of the rigid-flexible print circuit board can be guaranteed.

The invention discloses a high-precision etching production system and method for a flexible PCB. The system comprises a PCB substrate feeding device, a line body conveying device and a finished product discharging device, the line body conveying device is provided with a plurality of etching stations in the line body conveying direction, and a spraying system for independently controlling parameters is disposed above each etching station. The PCB substrate feeding device is used for feeding exposed and developed PCB substrates to the line body conveying device, the PCB substrates pass throughthe three etching stations in sequence through line body conveying, the spraying pressure of the three etching stations is gradually increased, the concentration of etching liquid is gradually reduced, a large amount of etching of metal etching layers on the PCB substrates is completed through different parameters, and basic forming etching and high-precision forming etching are carried out, so that high-precision etching production of the flexible PCB is completed. The system and the method are simple in structure, high in production efficiency, high in etching precision and suitable for mass production of high-precision miniature circuit boards, and the efficiency of an existing production line can be greatly improved by modifying the prior art.

The invention discloses a manufacture method of a multi-layer aluminum base sandwich printed circuit board. The main manufacture process of the printed circuit board includes the steps: manufacturing an aluminum base sandwich isolating ring, performing vacuum lamination and glue filling for the aluminum base sandwich isolating ring, treating the surface of an aluminum base sandwich, and performing aluminum base sandwich edge sealing treatment and multi-layer laminated composite treatment. The isolating ring is manufactured at a metalized through hole in the aluminum base sandwich in a boring manner, the outer circle diameter of the isolating ring is larger than the diameter of the metalized through hole, aluminum base sandwich vacuum glue is pressed for the aluminum base sandwich isolating ring by taking a bored copper foil as surface protection, surface roughening and cleaning treatment are performed for the aluminum base sandwich after the vacuum glue is pressed, pressing and edge sealing treatment is performed for the aluminum base sandwich, and the aluminum base sandwich is fixedly clamped in the middle of the multi-layer PCB (printed circuit board) in an aligned manner and then is treated in a pressing manner to obtain the multi-layer aluminum base sandwich printed circuit board. By the aid of the manufactured printed circuit board, double surfaces of a metal base board can be attached, and the manufactured printed circuit board has the advantages of high production efficiency, product reliability and safety and fine radiating effect.

The invention discloses a PCB (printed circuit board) resistance welding pretreatment process. The PCB resistance welding pretreatment process includes the steps of automatic feeding, volcanic-ash board grinding, roughening, microetching, surface cleaning, board drying, cooling and automatic board collecting. The process is high in automation degree, feeding and receiving are operated automatically, the step of carrying boards manually is omitted, processing efficiency is improved, and labor cost is lowered; in the steps of roughening and microetching, copper surfaces and holes of the PCBs aretreated by adopting a roughening solution and a microetching solution, the copper surface roughening effect is controlled by controlling of copper surface roughness and cleanliness, the roughness anduniformity of the copper surfaces can be optimized by roughening and microetching treatment, the binding force of the copper surfaces and the holes of the PCBs with resistance welding ink is improved, problems of bubbling and ink coming off the resistance welding layer are solved, and in addition, automatic board collecting operation also reduces the probability of friction on the board surfaces.

The invention relates to the technical field of PCB manufacturing, in particular to a manufacturing method for a resin plug hole in a PCB. The technological process is adjusted, a metallized buried hole is filled with resin after an inner layer circuit is manufactured in an inner layer board, the inner layer board is stilled rather than baked to solidify the resin after the hole is filled with the resin, and meanwhile the resin protruding out of the surface of the inner layer board is removed through a thin film in an adhering mode, so that the step of grinding the board through an abrasive belt is omitted, and the occurrence that the manufacturing precision of subsequent working procedures is affected by expanding and shrinking, caused by board grinding of the abrasive belt, of the inner layer board is avoided. By adjusting the manufacturing technology, the manufacturing precision of the PCB is guaranteed, the manufacturing flow is shortened, the production technology is simplified, and the production cost is reduced.

The invention belongs to the technical field of fabrication of a printed circuit board (PCB), and relates to a forming process of a burr-free PCB. The forming process sequentially comprises the following steps of substrate fabrication, plated through hole drilling, electroplating, circuit transfer-printing, hole drilling and breaking, circuit etching and milling. According to the forming process, the step of circuit etching is arranged after the step of hole drilling and breaking, burrs formed during hole drilling and breaking is corroded by a corrosion reagent, the burr problem also can be solved although the step of processing is not added, and the qualified rate of circuit board drilling is improved.

The invention discloses a manufacturing method of a thick-copper high-density interconnected printed board. The method comprises the following steps of: manufacturing a blind hole windowing pattern ona production board, removing a copper layer at the windowing position by etching, and drilling a blind hole at the windowing position by using laser; drilling a plug hole in the production board after a film is removed, and then metallizing the blind hole and a plug hole; manufacturing a hole plating pattern on the production board, and thickening hole wall copper layers of the plug hole and theblind hole through electroplating; filling the plug hole and the blind hole with resin ink and performing curing after the film is removed, and flattening the board surface through a grinding plate; manufacturing a mask hole pattern on the production board, and thinning the thickness of the surface copper layer through micro-etching; flattening the board surface through the grinding plate after the film is removed; drilling a through hole and a through groove in the production board, and then metallizing the through hole and the through groove; and sequentially subjecting the production boardto subsequent processes, thus obtaining the thick-copper high-density interconnected printed board. According to the method, manufacturing of large-aperture blind holes and thick-copper high-density interconnected printed boards is achieved, and resin is prevented from entering through holes and grooves which do not need hole plugging.

The invention discloses a method for no-glass-cloth ceramic high-frequency PCB plate edge metallization. The method comprises steps: board cutting, drilling, groove milling, plasma processing, copper deposition, board plating, patterning, pattern electroplating, etching, solder resisting, gold deposition, board milling and the like. Through the method, plate edge metallization can be achieved, the problem of electrostatic discharge protection is solved effectively, and the breaking problem of a ceramic high-frequency PCB during the manufacturing process can be solved effectively.

The invention discloses an in-plate electroless nickel-immersion gold classification connecting finger optical module PCB manufacturing method which comprises steps of plate preparation, partial photosensitive ink treatment, gold electroplating, removing ink, secondary membrane drying, lead etching, dried membrane removal, protection welding, partial thermosetting ink treatment, electroless nickel-immersion gold and later plate treatment. Compared with a conventional common manufacturing process, the method is capable of reducing the cost on the one hand since production procedures are adjusted, that is, the step of protection welding is carried out after the step of lead etching, and thus the three times of membrane removal steps after protection welding are reduced into once; and on theother hand, attack of a strong-alkali eluant to the welding protection ink can be reduced, the bonding force of protection welding parts can be improved, and the problem that protection welding partsof finished plates are peeled off can be reduced.

The invention discloses a golden finger processing method characterized by no lead wire residues. The method comprises the following steps of (S1) internal circuit board making, laminating and boring, and full-plate electroplating; (S2) external pattern transferring for the first time; (S3) circuit board etching and film stripping; (S4) circuit board appearance detecting; (S5) external pattern transferring for the second time; (S6) hard gold layer electroplating on the golden finger part of the circuit board, and film stripping; (S7) external pattern transferring for the third time; (S8) circuit board etching and film stripping; and (S9) solder mask printing and moulding surface processing to make the circuit board. The golden finger network connection point residues are effectively prevented. Copper exposed on the front of the cut golden finger is also prevented. Phenomena of burring, upwarping during a production process are eliminated. Material supplementing on the golden finger part of the circuit board is reduced during the production process. The workload of workers is reduced. The production efficiency is improved. The generated defective products are reduced. The discarded products are also reduced. The production cost is lowered. The yield is further improved.

The invention discloses a soft and hard combined semi-finished product board, a manufacturing method thereof and a soft and hard combined board manufacturing method. The soft and hard combined semi-finished product board comprises a soft board layer, wherein an upper cover film layer, an upper first film layer, an upper hard board layer, an upper second film layer and an upper copper foil layer are laminated on one surface of the soft board layer from bottom to top, and a lower cover film layer, a lower first film layer, a lower hard board layer, a lower second film layer and a lower copper foil layer are laminated on the other surface of the soft board layer from top to bottom; a first window is formed in the upper first film layer; a second window is formed in the lower first film layer; a third window is formed in the upper hard board layer; a fourth window is formed in the upper second film layer; a fifth window is formed in the lower hard board layer; a sixth window is formed in the lower second film layer; an upper etching-resistant printing ink layer is printed on the upper surface of the bending area of the soft board layer, and a lower etching-resistant printing ink layer is printed on the lower surface of the bending area of the soft board layer. An uncovering technology does not need to be carried out, the production efficiency is high, the product quality is good, and volume production is facilitated.

Provided is a manufacturing method of a fine circuit packaging substrate. The method comprises the steps that primary desmear processing and copper deposition are carried out on a circuit board with a circuit manufactured; dry film sticking, exposure and developing processing are carried out on the circuit board obtained after copper deposition is carried out; after developing processing is carried out, electro-coppering is carried out on the circuit board; primary film stripping is carried out on the electro-coppered circuit board, then secondary desmear processing is carried out, and secondary film stripping is carried out; braking and flash rusting are carried out on the circuit board obtained after secondary film stripping is carried out to form a circuit. The Desmear and film stripping processes are added in the MSAP process, the fine circuit of which the L/S is 20/20 micrometers or even 18/18 micrometers, the cost caused by special copper deposition wire liquid medicine, optimal imaging film stripping liquid medicine and etching liquid medicine involved in the SAP process and special boards is avoided, and then the investment and production cost are greatly lowered.

The invention relates to the technical field of PCBs, and discloses a manufacturing method for a stepped groove with non-metallized side walls and a PCB. The manufacturing method comprises the following steps of pressing and preparing a multilayer board with an initial stepped groove, wherein the multilayer board comprises a first outer-layer surface and a second outer-layer surface, and a notch of the initial stepped groove is arranged in the first outer-layer surface; carrying out overall copper plating on the multilayer board and then carrying out overall tin plating; removing a tin layer on the surface of a first junction position and a second junction position in order to expose a copper layer on the first junction position and the second junction position, wherein the first junctionposition is located at the junction position of the side wall and the first outer-layer surface, and the second junction position is located at the junction position of the side wall and a bottom surface; removing the copper layer at the two junction positions, and then removing the residual tin layer; and manufacturing a preset graph at the groove bottom of the initial stepped groove, and removing the copper layer at the side walls. According to the manufacturing method and the PCB, the stepped groove is manufactured firstly and then the graph of the groove bottom is manufactured; compared with the prior art, the manufacturing process can be greatly simplified, the operation difficulty is reduced, and the working efficiency is improved.

The invention belongs to the technical field of manufacturing of printed circuit boards, and provides a processing method for a printed-circuit connector of a PCB of a high-speed photoelectric coupling module. The processing methodcomprises the following steps: preparation of the PCB of the photoelectric coupling module, preparation of an inner layer, lamination, edge milling, drilling, electroplating, preparation of an outer-layer circuit, AOI scanning, preparation of a wet film circuit, preparation of a thick gold dry film, nickel and gold plating, film stripping, film pasting, exposure, alkaline etching, AOI scanning, resistance welding, character preparation, surface treatment, forming, electric testing and finished product inspection. According to the processing method, a lead is etched after the lead is internally drawn and electroplated with nickel and gold, so the process technology of coating the four sides of the golden finger part of the PCB of the photoelectric coupling module with nickel and gold is realized, the requirements of products on MFG mixed gas testing and salt spray testing are met, and product quality is improved.

The invention discloses a method for manufacturing a thin single-sided flexible circuit board. The method comprises the following steps: A, preparing a single-sided copper foil substrate; B, drilling a positioning hole; C, pasting a dry film; D, performing local exposure; E, performing developing; F, etching thin copper; G, performing demolding; H, performing dry film pretreatment; J, pasting a dry film; K, performing circuit exposure; and L, performing DES. The single-face copper foil substrate is adopted, the thickness of the base material layer of the single-face copper foil substrate is the same as the thickness of the base material layer needed by a product, the thickness of the copper layer of the single-face copper foil substrate is larger than the thickness of the circuit layer of the product, and the product area is developed through the product area local exposure and development technology; and the copper layer in the product area is independently etched and thinned to the thickness of the circuit layer required by the product by adopting a copper etching and thinning process, so that the single-sided copper foil substrates with different required thicknesses are obtained, and the product area meets the product manufacturing requirement.