Processing method for printed-circuit connector of PCB of high-speed photoelectric coupling module

A photoelectric coupling and printed plug technology, which is applied in printed circuit manufacturing, electrical components, printed circuits, etc., to improve quality, reduce costs, meet the effects of mass production and safe production
CN112752431APending Publication Date: 2021-05-04HUIZHOU KING BROTHER CIRCUIT TECH +2
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
HUIZHOU KING BROTHER CIRCUIT TECH
Publication Date
2021-05-04

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Abstract

The invention belongs to the technical field of manufacturing of printed circuit boards, and provides a processing method for a printed-circuit connector of a PCB of a high-speed photoelectric coupling module. The processing methodcomprises the following steps: preparation of the PCB of the photoelectric coupling module, preparation of an inner layer, lamination, edge milling, drilling, electroplating, preparation of an outer-layer circuit, AOI scanning, preparation of a wet film circuit, preparation of a thick gold dry film, nickel and gold plating, film stripping, film pasting, exposure, alkaline etching, AOI scanning, resistance welding, character preparation, surface treatment, forming, electric testing and finished product inspection. According to the processing method, a lead is etched after the lead is internally drawn and electroplated with nickel and gold, so the process technology of coating the four sides of the golden finger part of the PCB of the photoelectric coupling module with nickel and gold is realized, the requirements of products on MFG mixed gas testing and salt spray testing are met, and product quality is improved.
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Description

technical field

[0001] The invention belongs to the technical field of manufacturing printed circuit boards of high-speed photoelectric coupling modules, and in particular relates to a processing method for printing plug PCBs of high-speed photoelectric coupling modules. Background technique

[0002] The optoelectronic coupling module is composed of optoelectronic devices, functional circuits and optical interfaces. The optoelectronic devices include two parts: transmitting and receiving. The optical module is mainly responsible for photoelectric conversion. The transmitting end converts the electrical signal into an optical signal. After transmission through the optical fiber, the receiving end converts the optical signal into an electrical signal.

[0003] In the photoelectric module market, the rate below 10Gbps basically adopts gold plating + gold finger technology. This process first electroplates the gold finger and then etch the lead wire before etching. Only the u...

Claims

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