Non-laminated rigid-flexible printed circuit board and manufacturing method thereof

Abstract

The invention provides a non-laminated rigid-flexible printed circuit board and a manufacturing method thereof. The manufacturing method of the non-laminated rigid-flex printed circuit board comprises the steps of: manufacturing at least two flexible core boards; manufacturing a circuit pattern on the surface of each flexible core board; sticking pure glue at the slotting zone on one of two opposite surfaces of the adjacent flexible core boards arranged according to the preset stack-up sequence, sticking a cover film at the slotting zone on the other surface and sticking the cover films at the slotting zones on the adjacent surfaces of the flexible core boards and the rigid core boards; arranging grooves, matching with the slotting zones of the flexible core boards, on the rigid core boards and the prepregs; stacking up and pressing all flexible core boards, rigid core boards and prepregs according to the preset sequence. According to the non-laminated rigid-flexible printed circuit board and the manufacturing method thereof, the cracking risk of holes can be effectively avoided, the heat-resisting reliability and size stability of the non-laminating rigid-flexible printed circuit board can be guaranteed and the impedance design requirement of the rigid-flexible print circuit board can be guaranteed.

Description

technical field [0001] The invention relates to circuit board manufacturing technology, in particular to a non-layered rigid-flex board and a manufacturing method thereof. Background technique [0002] Rigid-flex board is a special circuit board that combines the advantages of rigid core board and flexible core board. Due to impedance design requirements, most rigid-flex boards cannot accept the layered structure of the air gap (Air Gap) between the flexible layers, and the flexible part of the rigid-flex board must be processed in a non-layered manner. production. The general non-layered rigid-flex board adopts the method of pasting pure glue between the flexible core boards to make the flexible part, and then press it with the rigid part to form a rigid-flex board, but the rigid-flex board manufactured in this way , the flexible core boards are only connected by pure glue. Due to the difference in thermal expansion coefficient between the pure rubber and the copper and p...

AI Technical Summary

Problems solved by technology

The general non-layered rigid-flex board adopts the method of pasting pure glue between the flexible core boards to make the flexible part, and then press it with the rigid part to form a rigid-flex board, but the rigid-flex board manufactured in this way , the flexible core boards are only connected by pure glue. Due to the difference in thermal expansion coefficient between the pure rubber and the copper and polyimide (PI) on the rigid core board or flexible core board, when the rigid-flex board is working or testing under high temperature conditions It is easy to crack the hole copper, resulting in the failure of the rigid-flex board

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