A functional soft board base material without glue is composed of a metal layer, a basal layer and a metal passivation layer which are superimposed. The manufacturing method includes that (1), polyimide is used to make a basal body, and surface treatment is performed for two faces (or one face) of the basal body; (2), a physical vapor deposition (PVD) method is adopted to deposit and form a metal membrane layer on a product improve (PI) face of a treated face; and (3), passivation treatment is performed for the metal membrane layer. The soft board base material without the glue has high-strength tensile performance, excellent chemical resistance, heat resistance, dimensional stability, peel strength, compactness, uniform consistency, and mechanical machining performance, is strong in shielding function, and can be used for manufacturing printed circuit boards (PCB), flexible printed circuits (FPC), soft and hard combination plate, special function (shielding function) material and the like, the PVD method is adopted to deposit the metal layer, the thickness of the metal layer is enabled to be adjustable, achievement of superfine precision circuit is enabled to be possible, and the soft board base material without glue is low in cost, environment-friendly, good in bending performance and easy for technical processing.