Soft board base material without glue and preparation method thereof

A soft board substrate and base material technology, applied in circuit substrate materials, chemical instruments and methods, printed circuit manufacturing, etc., can solve the problems of poor dimensional stability, different material properties, poor heat resistance, etc., and achieve mechanical processing performance. Good, easy processing, excellent bending performance
CN103167731AActive Publication Date: 2013-06-19英德宏庆电子有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
英德宏庆电子有限公司
Publication Date
2013-06-19

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Abstract

A functional soft board base material without glue is composed of a metal layer, a basal layer and a metal passivation layer which are superimposed. The manufacturing method includes that (1), polyimide is used to make a basal body, and surface treatment is performed for two faces (or one face) of the basal body; (2), a physical vapor deposition (PVD) method is adopted to deposit and form a metal membrane layer on a product improve (PI) face of a treated face; and (3), passivation treatment is performed for the metal membrane layer. The soft board base material without the glue has high-strength tensile performance, excellent chemical resistance, heat resistance, dimensional stability, peel strength, compactness, uniform consistency, and mechanical machining performance, is strong in shielding function, and can be used for manufacturing printed circuit boards (PCB), flexible printed circuits (FPC), soft and hard combination plate, special function (shielding function) material and the like, the PVD method is adopted to deposit the metal layer, the thickness of the metal layer is enabled to be adjustable, achievement of superfine precision circuit is enabled to be possible, and the soft board base material without glue is low in cost, environment-friendly, good in bending performance and easy for technical processing.
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Description

technical field

[0001] The invention relates to a soft board base material and a preparation method thereof, in particular to an adhesive-free soft board base material and a preparation method thereof. Background technique

[0002] "Without electronic substrates, there would be no electronic technology industry today." Benefiting from the rapid development of electronic information and other industries, the market demand for electronic substrates is becoming stronger and stronger. Flexible Printed Circuit (FPC), referred to as FPC, has the advantages of softness, lightness, thinness and flexibility. It has been widely used under the trend of information electronics products becoming light, thin, short and small. Used in notebook computers, digital related, mobile phones, LCD monitors, etc. At present, the world's electronic substrates use adhesive substrates and non-adhesive substrates.

[0003] The traditional glued flexible board substrates are divided into two categorie...

Claims

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