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676results about How to "Improve bendability" patented technology

Flexible array substrate, preparation method thereof and flexible display panel

The invention provides a flexible array substrate, a preparation method thereof and a flexible display panel. The flexible array substrate comprises a plurality of pixel island regions which are sequentially arranged, and the adjacent pixel island regions are provided with a flexible region therebetween. Each pixel island region comprises an active layer, a gate insulating layer, a gate electrodeand an interlayer insulating layer which are arranged on a flexible substrate, each flexible region comprises an elastic layer and a connecting wire which are arranged on the flexible substrate, and the connecting wire is connected with the gate electrodes of the adjacent pixel island regions. According to the invention, the flexible array substrate is divided into a plurality of pixel island regions and a plurality of flexible regions, the pixel island regions are set to serve as pixel units of an effective display region, and the flexible regions serve as stretchable or bendable regions andare only provided with the elastic layer and the connecting wire, thereby effectively overcoming a problem that the insulating layer and grid lines of the existing structure are easy to break, being capable of ensuring the flexible regions to have sufficient stretching and bending performance, and realizing good stretching and bending performance of the flexible array substrate.
Owner:BOE TECH GRP CO LTD

Flexible array substrate and preparation method thereof and flexible display panel

The invention relates to the technical field of display and discloses a flexible array substrate and a preparation method thereof and a flexible display panel. The flexible array substrate comprises aplurality of pixel island regions which are sequentially arranged; flexible areas are arranged between the adjacent pixel island regions; each pixel island region comprises a gate electrode; each flexible area comprises a first elastic layer; each first elastic layer is provided with a first connection line; each first connection line is provided with a second elastic layer; each second elastic layer is provided with a second connection line; a plurality of interlayer through holes are formed in each second elastic layer; an elastic conductive column is arranged in each interlayer through hole; the elastic conductive columns are electrically connected with the first connection lines and the second connection lines separately; and the first connection lines and/or the second connection lines are connected with the gate electrodes of the adjacent pixel island regions. Through the arrangement of the elastic conductive columns and a dual-layer connection electric structure, the flexible array substrate has relatively excellent tensile property in the direction vertical to the flexible array substrate, and good tensile property and bendability of the flexible array substrate are achieved.
Owner:BOE TECH GRP CO LTD

Ultra-thin shielding film and circuit board capable of changing circuit impedance, and method for preparing same

The invention provides an ultra-thin shielding film and a circuit board capable of changing circuit impedance, and a method for preparing same. The shielding film capable of changing the circuit impedance consists of an insulated coverage film layer, a metal foil layer, an anisotropic conductive adhesive layer and a protective release film layer; the metal foil layer is provided with meshes according to the impedance requirement design of the product and is arranged between the insulated coverage film layer and the anisotropic conductive adhesive layer; the surface of the anisotropic conductive adhesive layer is covered by the protective release film. The invention has the advantages that the ultra-thin layer of metal foil with a certain mesh dimension which is completely connected together is provided; the metal foil layer and the insulated layer have extremely high peeling strength, can durably bear heat impact and can be used for the multi-time pressing process of a soft / hard combination board; meanwhile, the thickness of a dielectric layer can be reduced and the aim of controlling the impedance can be achieved. Furthermore, the cost is low, the bending performance is excellent and the processing is easy.
Owner:GUANGZHOU FANGBANG ELECTRONICS
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