This utility model relates to the field of electronic tag technology and discloses a flexible electronic tag, including a flexible substrate, a conductive circuit layer, a
chip mounting area, a protective layer, and an identification information carrying structure. The conductive circuit layer is disposed on top of the flexible substrate and is used to form an
electrical connection with the
chip. The protective layer covers the outside of the conductive circuit layer. The identification information carrying structure is disposed at one end of the flexible substrate. The flexible substrate is made of PET, PI, or
polyolefin materials and has bendability. The conductive circuit layer is disposed on top of the flexible substrate by
hot pressing and is made of
silver paste or
copper paste. In this utility model, by setting the conductive circuit layer and the
chip mounting area on the flexible substrate, the chip and circuit are integrated and packaged, resulting in a compact structure and strong adaptability. The flexible substrate is made of materials such as PET and PI, which have good flexibility; the conductive circuit is hot-pressed to improve durability; and the protective layer enhances environmental adaptability and extends service life.