Polyimide laminating body and manufacturing method thereof

A polyimide layer, polyimide technology, applied in the direction of chemical instruments and methods, lamination, layered products, etc., can solve the problems of no record, opaque polyimide film, etc., to ensure operability , high heat resistance effect

Inactive Publication Date: 2014-03-26
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] It should be noted that Patent Documents 2 and 3 describe inventions related to methods for producing polyimide films, which show that polyimide layers are coated on the polyimide layers of metal foils each having a predetermined polyimide layer. Amic acid solution, a method of peeling off heat-treated and imidized polyimide to produce a polyimide film with suppressed appearance defects such as wrinkles and cracks, but the polyimide film shown here It is opaque, and there is no description of using it as a resin substrate in a state where polyimide is laminated

Method used

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  • Polyimide laminating body and manufacturing method thereof
  • Polyimide laminating body and manufacturing method thereof
  • Polyimide laminating body and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0092] First, the abbreviations of raw material monomers and solvents in synthesizing polyimide, and the measurement methods and conditions of various physical properties in Examples are shown below.

[0093] [abbreviation]

[0094] DMAc: N,N-Dimethylacetamide

[0095] PDA: 1,4-phenylenediamine

[0096] TFMB: 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl

[0097] DADMB: 4,4′-Diamino-2,2′-dimethylbiphenyl

[0098] 1,3-BAB: 1,3-bis(4-aminophenoxy)benzene

[0099] BPDA: 3,3′,4,4′-biphenyltetracarboxylic dianhydride

[0100] 6FDA: 2,2′-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride

[0101] PMDA: pyromellitic dianhydride

[0102] 〔Surface roughness(Ra)〕

[0103] Surface observation was performed in tapping mode using an atomic force microscope (AFM) "Multi Mode 8" manufactured by Bruker Corporation. Field observations of 10 μm square were performed four times, and their average value was obtained. Surface roughness (Ra) means arithmetic mean roughness (JIS B0601-199...

Synthetic example 1

[0114] Synthesis example 1 (polyimide A)

[0115] Under nitrogen flow, 8.00 g of PDA was dissolved in the solvent DMAc in a 300 ml separable flask while stirring. Next, 22.00 g of this solution BPDA was added. Thereafter, the solution was continuously stirred at room temperature for 5 hours to carry out a polymerization reaction, which was maintained throughout the day and night. It was confirmed that a viscous polyamic acid solution was obtained, and polyamic acid A with a high degree of polymerization was produced.

Synthetic example 2（

[0116] Synthesis Example 2 (Polyimide B)

[0117] Under a nitrogen stream, 19.11 g of DADMB and 2.92 g of 1,3-BAB were dissolved in the solvent DMAc in a 300 ml separable flask while stirring. Next, 5.79 g of BPDA and 17.17 g of PMDA were added to this solution. Thereafter, the solution was continuously stirred at room temperature for 5 hours to carry out a polymerization reaction, which was maintained throughout the day and night. It was confirmed that a viscous polyamic acid solution was obtained, and polyamic acid B with a high degree of polymerization was produced.

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Abstract

The invention provides a polyimide laminating body and a manufacturing method thereof. According to the invention, polyimide films that are transparent and are good in size stability can be separated from a supporting substrate easily. The polyimide laminating body capable of support substrate is arranged on the back side of the polyimide layer. The transmissivity of the polyimide layer in a predetermined wavelength area is higher than 70 percents. The surfaces of the support substrate in interfaces can be formed by heat-resisting polyimide whose glass transition temperature is higher than 300 DEG C and the surface coarse degree Ra is lower than 100nm. The adhesion strength of the support substrate and the polyimide layer is 1N/m-500N/m and polyimide layer can be separated from the support substrate. Besides, the manufacturing method for the polyimide laminating body utilizes roller-to-roller technique for conveying long strip support substrate and coats resin solution of polyamide acid, so that the substrate can be imided, so that a predetermined polyimide layer can be formed.

Description

technical field [0001] This invention relates to a polyimide laminated body and its manufacturing method. Specifically, It is related with the polyimide laminated body which laminated|stacked the polyimide layer which has transparency on a support base material, and its manufacturing method. Background technique [0002] Display devices such as liquid crystal display devices and organic EL display devices are used in various display applications such as large displays such as televisions and small displays such as mobile phones, personal computers, and smartphones. Among them, taking an organic EL display device as an example, on the basis of forming a thin-film transistor (hereinafter, TFT) on a glass substrate, electrodes, light-emitting layers, and electrodes are sequentially stacked, and finally sealed with another glass substrate, multilayer thin film, etc. production. [0003] Here, by replacing the glass substrate with a resin substrate, thinner and lighter weight an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/06B32B27/28C08G73/10B32B37/02
CPCB32B27/06B32B27/281B32B37/02B32B2307/306C08G73/10B32B27/08C08G73/1067C09J7/25C09J7/29
Inventor 须藤芳树高吉若菜平石克文冈崎奈津子
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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