Manufacturing method for resin plug hole in PCB

A production method and technology of resin plugging holes, which are applied in the direction of printed circuit manufacturing, processing step sequence, electrical components, etc., can solve the problems of shortening the process flow, affecting the production accuracy of the subsequent process, and board expansion and contraction, so as to shorten the production process and ensure The effect of manufacturing precision and simplifying the production process
CN104540320AActive Publication Date: 2015-04-22JIANGMEN SUNTAK CIRCUIT TECH
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
JIANGMEN SUNTAK CIRCUIT TECH
Publication Date
2015-04-22

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Abstract

The invention relates to the technical field of PCB manufacturing, in particular to a manufacturing method for a resin plug hole in a PCB. The technological process is adjusted, a metallized buried hole is filled with resin after an inner layer circuit is manufactured in an inner layer board, the inner layer board is stilled rather than baked to solidify the resin after the hole is filled with the resin, and meanwhile the resin protruding out of the surface of the inner layer board is removed through a thin film in an adhering mode, so that the step of grinding the board through an abrasive belt is omitted, and the occurrence that the manufacturing precision of subsequent working procedures is affected by expanding and shrinking, caused by board grinding of the abrasive belt, of the inner layer board is avoided. By adjusting the manufacturing technology, the manufacturing precision of the PCB is guaranteed, the manufacturing flow is shortened, the production technology is simplified, and the production cost is reduced.
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Description

technical field

[0001] The invention relates to the technical field of PCB manufacturing, in particular to a method for manufacturing a resin plug hole in a PCB. Background technique

[0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, referred to as printed board, is one of the important components of the electronics industry, is the support of electronic components, and the carrier of electrical connections. In PCB, it is usually necessary to design buried holes, and in PCB production, it is necessary to fill the buried holes with resin for subsequent pressing and other processes. The production process of the existing technology is usually: material cutting→inner layer core board drilling→inner layer copper sinking→inner layer full board electroplating→resin plug hole and baking board curing→abrasive belt grinding board→inner layer circuit→inner layer etching →Inner layer AOI→browning→pressing→post process. In the existing production process,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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