The invention relates to the field of dehumidifying equipment, in particular to a condensation dehumidifying device based on a
semiconductor chilling plate. The condensation dehumidifying device basedon the
semiconductor chilling plate comprises a shell, a main board
control circuit arranged in the shell, a fan, heat dissipation fins, the
semiconductor chilling plate, cooling fins, a water receiving groove, a
sponge mat and hydrophilic material coatings, wherein an air suction opening of the fan, the heat dissipation fins, the semiconductor chilling plate and the cooling fins are arranged inthe shell in a sequential attaching manner, the fan and the semiconductor chilling plate are connected with the main board
control circuit, an air inlet is formed in the position, corresponding to theair suction opening of the fan, of the shell, and an air outlet is formed in the position, corresponding to the air blowing direction of the fan, of the shell; the water receiving groove is arrangedin the position to which water drops coagulated on the cooling fins drop, and a water outlet of the water receiving groove extends to the exterior of the shell; the
sponge mat is arranged between theheat dissipation fins and the cooling fins; and the hydrophilic material coatings are arranged on the surfaces of the cooling fins. According to the condensation dehumidifying device, condensation dehumidifying is achieved through the
temperature difference generated by the semiconductor chilling plate, meanwhile, by additionally arranging rapid water condensation and water discharging, the dehumidifying speed is higher, and the dry environment can be kept longer.