Mica tape, high in ventilation performance and with little glue, suitable for pure epoxy VPI insulating resin and preparation method thereof

A technology of less glue mica tape and insulating resin, used in mica, insulators, inorganic insulators, etc., can solve the problem of extending the shelf life of pure epoxy VPI insulating resin, to ensure storage stability, improve electrical performance, and ensure long-term storage. stable effect

Active Publication Date: 2013-12-11
SUZHOU JUFENG ELECTRICAL INSULATION SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But whether it can be based on this method to endow the mica tape with other functions (such as having super long storage stability, fully curing the pure epoxy VPI insulating resin without curing agent, prolonging the pure ring without affecting the high air permeability performance of the mica tape) Oxygen VPI insulating resin pot life and other functions) are unpredictable

Method used

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  • Mica tape, high in ventilation performance and with little glue, suitable for pure epoxy VPI insulating resin and preparation method thereof
  • Mica tape, high in ventilation performance and with little glue, suitable for pure epoxy VPI insulating resin and preparation method thereof
  • Mica tape, high in ventilation performance and with little glue, suitable for pure epoxy VPI insulating resin and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0046] The present embodiment provides a kind of highly gas-permeable little glue mica tape that is applicable to pure epoxy VPI insulating resin, and its structure is as follows figure 1 shown. In this mica tape, the powder adhesive is carboxyl-terminated polyester resin (the number average molecular weight Mn is 20000, and the acid value is 85mg KOH / g); the mica paper layer A is non-calcined large-scale muscovite paper with a thickness of 0.11mm, which is breathable The sex is 172s / 100cm 3 , the mass per unit area is 181g / m 2 ;The reinforcing material layer C is electrical grade non-alkali glass fiber cloth, the thickness is 0.032mm, and the mass per unit area is 23.1g / m 2 . Latent epoxy curing accelerator D is zinc naphthenate.

[0047] The preparation method of the highly air-permeable less-adhesive mica tape is as follows:

[0048] (1) Carboxyl-terminated polyester resin was pulverized at 0°C at low temperature and sieved to obtain a powder adhesive with a particle s...

Embodiment 2

[0056] The present embodiment provides a kind of highly gas-permeable little glue mica tape that is applicable to pure epoxy VPI insulating resin, and its structure is as follows figure 1 shown. In the mica tape, the powder adhesive is composed of carboxyl-terminated polyester resin (number average molecular weight Mn is 30000, acid value is 75mg KOH / g) and Nadic acid anhydride with an anhydride equivalent of 170 in a weight ratio of 1:1; the mica paper layer A It is non-calcined large-scale muscovite paper with a thickness of 0.11mm and an air permeability of 165s / 100cm 3 , the mass per unit area is 178g / m 2 ;The reinforcing material layer C is electrical grade non-alkali glass fiber cloth, the thickness is 0.035mm, and the mass per unit area is 28.3g / m 2 . The latent epoxy curing accelerator D is composed of zinc naphthenate and chromium acetylacetonate in a weight ratio of 2:1.

[0057] The preparation method of the highly air-permeable less-adhesive mica tape is as fol...

Embodiment 3

[0066] The present embodiment provides a kind of highly gas-permeable little glue mica tape that is applicable to pure epoxy VPI insulating resin, and its structure is as follows figure 1 shown. In the mica tape, the powder adhesive is composed of carboxyl-terminated polyester resin (number average molecular weight Mn is 28000, acid value is 58 mg KOH / g) and trimellitic anhydride with an acid value of 870 and a melting point of 167 °C in a weight ratio of 1:1; mica Paper layer A is non-calcined large scale muscovite paper with a thickness of 0.10mm and an air permeability of 155s / 100cm 3 , the mass per unit area is 162g / m 2 ; The reinforcing material layer C is an electrical grade non-alkali glass fiber cloth with a thickness of 0.032mm and a mass per unit area of ​​23.3g / m2. The latent epoxy curing accelerator D is composed of zinc neodecanoate and aluminum acetylacetonate in a weight ratio of 1:1.

[0067] The preparation method of the highly air-permeable less-adhesive m...

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Abstract

The invention relates to mica tape, high in ventilation performance and with little glue, suitable for pure epoxy VPI insulating resin and a preparation method thereof. The mica tape comprises a mica paper layer, a reinforcing material layer, and an adhesive agent layer. The adhesive agent layer is composed of powder adhesion agents distributed, in a point shape, on the interface of the mica paper layer and the interface of the reinforcing layer. A large number of pore channels exist between powder adhesion agents distributed in the point shape. The powder adhesion agents are epoxy hardeners. The mica tape high in ventilation performance and with little glue further comprises latent epoxy curing accelerators distributed in the mica paper layer, the reinforcing material layer and the pore channels. No chemical reaction of the epoxy hardeners and the latent epoxy curing accelerators occurs under 110 DEG C, and the the epoxy hardeners and the latent epoxy curing accelerators can not dissolve and enter the pure epoxy VPI insulating resin in the VPI dipping paint process. The mica tape with little glue expands the utilization range of the epoxy resin as electric insulting materials, greatly reduces the requirements of the epoxy VPI insulation resin for dipping paint equipment and technologies, reduces energy consumption, and saves utilization cost.

Description

technical field [0001] The invention belongs to the technical field of glue-less vacuum pressure impregnation (VPI) insulation treatment, and in particular relates to a highly air-permeable glue-less mica tape suitable for pure epoxy VPI insulating resin and a preparation method thereof. Background technique [0002] At present, there are mainly two insulation treatment processes for large high-voltage motors, vacuum pressure impregnation (VPI) with less glue and molding with more glue. In the 1970s, multinational corporations such as Westinghouse Electric proposed the theory of less glue in motor insulation, and began to use the new VPI insulation process with less glue mica tape as the main insulation material to produce high-voltage motors. Because the less glue VPI main insulation increases the mica content, on the one hand, it can greatly reduce the insulation thickness, and at the same time, it also improves the performance of the motor's withstand voltage, corona resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B3/04H01B19/02C08G59/40C08G59/42
Inventor 徐伟红王文夏宇郭胜智陶纯初
Owner SUZHOU JUFENG ELECTRICAL INSULATION SYST
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