Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

37results about How to "Reasonable humidity" patented technology

Air-cooled refrigerator and humidifying and freshness keeping method

The invention discloses an air-cooled refrigerator. The air-cooled refrigerator is provided with a box which comprises a shell and a liner; the liner is arranged in the shell, and the space between the liner and the shell is filled with a heat preserving layer; and the liner is sequentially provided with a cold storage chamber, a temperature changing chamber and a freezing chamber from top to bottom. On the interior of the rear side of the freezing chamber, the heat preserving layer is provided with a cold air cavity for containing an evaporator and a draught fan. The cold air cavity is communicated with the freezing chamber through a first air feeding air duct which is located on an air outlet of the inner wall of the freezing chamber, and a freezing air door is arranged. The cold air cavity is communicated with the temperature changing chamber through a second air feeding air duct which is located on an air outlet of the inner wall of the temperature changing chamber, and a temperature changing air door is arranged. The cold air cavity is communicated with the cold storage chamber through a third air feeding air duct which is located on an air outlet of the inner wall of the cold storage chamber, and a cold storage air door is arranged. The invention further discloses a humidifying and freshness keeping method. The air-cooled refrigerator is reasonable in structure, accurate in humidity control and high in practicability, water in the air-cooled refrigerator is kept conserved, and frosting is effectively prevented.
Owner:AUCMA

Heat dissipation unit system of ceramic substrate of thick-film circuit chip applied to heat supply

The invention discloses a heat dissipation unit system of a ceramic substrate of a thick-film circuit chip applied to heat supply. The heat dissipation unit system comprises the ceramic substrate and the thick-film circuit chip, wherein the thick-film circuit chip is sintered on the ceramic substrate by employing a vacuum evaporation or magnetron sputtering method, the ceramic substrate adopts aluminum oxide ceramic having a heat dissipation function or rare-earth ceramic having a far infrared function, the thick-film circuit chip comprises a thick-film circuit and a control chip, the thick-film circuit is connected with the control chip, and the film thickness of the thick-film circuit is larger than 10 micrometers. The heat dissipation unit system has the beneficial effects that the thick-film circuit is adopted, almost all electrical energy is directly converted to heat energy, heat conduction can be rapidly performed, heat is instantly released to all spaces in a room, the water molecule composition in the room is not damaged, reasonable temperature and humidity in the room can also be maintained, constant-temperature heat supply is achieved, and the heat dissipation unit system is simple in structure and has high practicality.
Owner:冀嘉道
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products