Thick film circuit chip stainless steel base material cooling unit system applied to heating
A thick-film circuit and heat dissipation unit technology, which is applied in the field of thick-film circuit chip stainless steel substrate heat dissipation unit system, can solve the problems of waste of power resources, shortage of supply, tight urban power supply, etc., and achieve simple structure, strong practicability, and heat dissipation power density scattered effect
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[0018] like figure 1 and combine figure 2 As shown, a thick-film circuit chip stainless steel substrate cooling unit system for heating, including stainless steel 2 and thick-film circuit chip 1, the back-film circuit chip 1 is sintered on the stainless steel 2, and the back-film circuit chip 1 It includes a back film circuit and a control chip, the back film circuit is connected with the control chip, and the film thickness of the back film circuit is greater than 10um.
[0019] Further, the thick film circuit includes a single chip microcomputer U0, a first resistor R1, a second resistor R2, a third resistor R3, a first capacitor C1, a second capacitor C, a first transistor Q1, and a second transistor Q2 , the third triode Q3, the first diode D1, the second diode D2, the third diode D3 and the fourth diode D4, the first pins of the single-chip microcomputer U0 are respectively connected to the first One end of the capacitor C1, one end of the first diode C1, and the emitt...
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