Heat dissipation unit system of ceramic substrate of thick-film circuit chip applied to heat supply

A technology based on ceramic substrates and thick film circuits. It is applied in the direction of electric heating devices, electrical components, and ohmic resistance heating. It can solve the problems of wasting power resources, shortage of supply, and tight power supply in cities. It achieves dispersed heat dissipation power density, simple structure, and strong The effect of practicality

Inactive Publication Date: 2017-03-08
冀嘉道
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high power consumption of electric heating equipment, the power resources are also obtained by burning coal, gas and fuel oil. They are not born out of thin air and belong to secondary energy. Once the electricity consumption of electric heating and electric heating users exceeds the upper limit, the tiered electricity price will be very expensive
Moreover, the widespread use of electric heating in winter will also cause a shortage of urban power supply, with distinct peak and trough power consumption, a waste of power resources and a phenomenon in which demand exceeds supply.

Method used

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  • Heat dissipation unit system of ceramic substrate of thick-film circuit chip applied to heat supply
  • Heat dissipation unit system of ceramic substrate of thick-film circuit chip applied to heat supply
  • Heat dissipation unit system of ceramic substrate of thick-film circuit chip applied to heat supply

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Embodiment Construction

[0018] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.

[0019] Such as figure 1 and combine figure 2 and image 3 As shown, a thick-film circuit chip ceramic substrate cooling unit system for heating includes a ceramic substrate 1 and a thick-film circuit chip 2, and the back-film circuit chip 1 is sintered on the substrate by vacuum evaporation or magnetron sputtering. On the ceramic substrate 2, the ceramic substrate 1 adopts alumina ceramics with heat dissipation function or rare earth ceramics with far-infrared function, and the rear membrane circuit chip 2 includes a rear membrane circuit and a control chip. The control chip is connected, the thickness of the film circuit is greater than 10um, and the rare earth ceramic is made of beryllium oxide ceramic material.

[0020] Further, the rear film...

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Abstract

The invention discloses a heat dissipation unit system of a ceramic substrate of a thick-film circuit chip applied to heat supply. The heat dissipation unit system comprises the ceramic substrate and the thick-film circuit chip, wherein the thick-film circuit chip is sintered on the ceramic substrate by employing a vacuum evaporation or magnetron sputtering method, the ceramic substrate adopts aluminum oxide ceramic having a heat dissipation function or rare-earth ceramic having a far infrared function, the thick-film circuit chip comprises a thick-film circuit and a control chip, the thick-film circuit is connected with the control chip, and the film thickness of the thick-film circuit is larger than 10 micrometers. The heat dissipation unit system has the beneficial effects that the thick-film circuit is adopted, almost all electrical energy is directly converted to heat energy, heat conduction can be rapidly performed, heat is instantly released to all spaces in a room, the water molecule composition in the room is not damaged, reasonable temperature and humidity in the room can also be maintained, constant-temperature heat supply is achieved, and the heat dissipation unit system is simple in structure and has high practicality.

Description

technical field [0001] The invention relates to the field of heating and heating, in particular to a thick-film circuit chip ceramic substrate cooling unit system for heating. Background technique [0002] In recent years, the problem of air pollution has become more and more serious, and smog has occurred frequently. As a large developing country, my country will still face the serious situation of increasing air pollution for a long time to come. With the continuous increase of energy demand, the pollution problem caused by the smoke emission caused by coal and oil heating and heating has become increasingly prominent. The quality of life continues to improve, the living environment continues to improve, the requirements for quality of life continue to increase, and air pollution is becoming more and more serious. The development of clean, efficient, energy-saving, and cost-effective environmental protection heating and heating equipment and technology is to fundamentally...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/22H05B3/02H05B1/02
CPCH05B3/22H05B1/0277H05B3/0019H05B3/02H05B2203/013H05B2203/022H05B2203/035
Inventor 翼嘉道
Owner 冀嘉道
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