Thick film circuit chip aluminum alloy substrate heat dissipation unit system applied to heating

A thick-film circuit and heat dissipation unit technology, which is applied in the field of thick-film circuit chip aluminum alloy substrate heat dissipation unit system, can solve the problems of waste of power resources, shortage of supply, tight urban power supply, etc., and achieve dispersion of heat dissipation power density, simple structure, and strong The effect of practicality

Inactive Publication Date: 2017-03-08
冀嘉道
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high power consumption of electric heating equipment, the power resources are also obtained by burning coal, gas and fuel oil. They are not born out of thin air and belong to secondary energy. Once the electricity consumption of electric heating and electric heating users exceeds the upper limit, the tiered electricity price will be very expensive
Moreover, the widespread use of electric heating in winter will also cause a shortage of urban power supply, with distinct peak and trough power consumption, a waste of power resources and a phenomenon in which demand exceeds supply.

Method used

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  • Thick film circuit chip aluminum alloy substrate heat dissipation unit system applied to heating
  • Thick film circuit chip aluminum alloy substrate heat dissipation unit system applied to heating

Examples

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Embodiment example 1

[0018] Such as figure 1 and combine figure 2 As shown, a thick-film circuit chip aluminum alloy substrate cooling unit system for heating, including an aluminum alloy 2 and a thick-film circuit chip 1, the back-film circuit chip 1 is sintered on the aluminum alloy 2, and the back-film The circuit chip 1 includes a rear membrane circuit and a control chip, the rear membrane circuit is connected to the control chip, and the film thickness of the rear membrane circuit is greater than 10um.

[0019] Further, the thick film circuit includes a single chip microcomputer U0, a bridge diode D0, a fuse FS, a first capacitor C1, a second capacitor C2, a third capacitor C3, a first resistor R1, a second resistor R2, and a third resistor R3 , the fourth resistor R4, the first transistor Q1 and the second transistor Q2, the second terminal pin of the single-chip microcomputer U0 is connected to one end of the fourth resistor R4 and the emission of the second transistor Q2 respectively. T...

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Abstract

The invention discloses a thick film circuit chip aluminum alloy substrate heat dissipation unit system applied to heating. The system comprises an aluminum alloy and a thick film circuit chip; the thick film circuit chip is sintered on the aluminum alloy, and includes a thick film circuit and a control chip; the thick film circuit is connected with the control chip; and the film thickness of the thick film circuit is larger than 10 microns. The system has the following beneficial effects: the system adopts the thick film circuit; the electric energy is almost directly converted to the heat energy; the heat can be conducted quickly; the heat is released to each indoor space instantly, so that the indoor water molecule components are not broken, and reasonable temperature and humidity are kept indoors to realize constant-temperature heating; and the system is simple in structure and higher in practicability.

Description

technical field [0001] The invention relates to the field of heating and heating, in particular to a thick-film circuit chip aluminum alloy substrate cooling unit system for heating. Background technique [0002] In recent years, the problem of air pollution has become more and more serious, and smog has occurred frequently. As a large developing country, my country will still face the serious situation of increasing air pollution for a long time to come. With the continuous increase of energy demand, the pollution problem caused by the smoke emission caused by coal and oil heating and heating has become increasingly prominent. The quality of life continues to improve, the living environment continues to improve, the requirements for quality of life continue to increase, and air pollution is becoming more and more serious. The development of clean, efficient, energy-saving, and cost-effective environmental protection heating and heating equipment and technology is to fundam...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24D13/00F24D19/10
CPCF24D13/00F24D19/1096
Inventor 翼嘉道
Owner 冀嘉道
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