Thick film circuit chip aluminum alloy substrate heat dissipation unit system applied to heating
A thick-film circuit and heat dissipation unit technology, which is applied in the field of thick-film circuit chip aluminum alloy substrate heat dissipation unit system, can solve the problems of waste of power resources, shortage of supply, tight urban power supply, etc., and achieve dispersion of heat dissipation power density, simple structure, and strong The effect of practicality
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[0018] Such as figure 1 and combine figure 2 As shown, a thick-film circuit chip aluminum alloy substrate cooling unit system for heating, including an aluminum alloy 2 and a thick-film circuit chip 1, the back-film circuit chip 1 is sintered on the aluminum alloy 2, and the back-film The circuit chip 1 includes a rear membrane circuit and a control chip, the rear membrane circuit is connected to the control chip, and the film thickness of the rear membrane circuit is greater than 10um.
[0019] Further, the thick film circuit includes a single chip microcomputer U0, a bridge diode D0, a fuse FS, a first capacitor C1, a second capacitor C2, a third capacitor C3, a first resistor R1, a second resistor R2, and a third resistor R3 , the fourth resistor R4, the first transistor Q1 and the second transistor Q2, the second terminal pin of the single-chip microcomputer U0 is connected to one end of the fourth resistor R4 and the emission of the second transistor Q2 respectively. T...
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