Ceramic glass base material heat radiation unit system with thick film circuit chip for heat supply

A thick-film circuit and glass-ceramic technology, which is applied in the field of heat-dissipating unit systems for thick-film circuit chips and glass-ceramic substrates, can solve problems such as waste of power resources, short supply, and shortage of urban power supply, and achieve simple structure, strong practicability, The effect of heat dissipation power density dispersion

Inactive Publication Date: 2017-03-08
冀嘉道
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high power consumption of electric heating equipment, the power resources are also obtained by burning coal, gas and fuel oil. They are not born out of thin air and belong to secondary energy. Once the electricity consumption of electric heating and electric heating users exceeds the

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ceramic glass base material heat radiation unit system with thick film circuit chip for heat supply
  • Ceramic glass base material heat radiation unit system with thick film circuit chip for heat supply

Examples

Experimental program
Comparison scheme
Effect test

Embodiment example 1

[0018] Such as figure 1 and combine figure 2 As shown, a thick-film circuit chip glass-ceramic substrate cooling unit system for heating, including a first glass layer 1, a second glass layer 3 and a thick-film circuit chip 2, the rear film circuit chip 2 clamps Between the first glass layer 1 and the second glass layer 3, both of the first glass layer 1 and the second glass layer 3 are tempered glass, and the rear film circuit chip 2 includes a rear film circuit and a control chip, the The rear film circuit is connected to the control chip, the film thickness of the rear film circuit is greater than 10um, and the rear film circuit chips 2 are sintered on the first glass layer 1 and the second glass layer 3 respectively.

[0019] Further, the rear membrane circuit includes a first triode Q1, a second triode Q2, a third triode Q3, a fourth triode Q4, a fifth triode Q5, a sixth triode Q6, The first capacitor C1, the second capacitor C2, the third capacitor C3, the first resis...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Film thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a ceramic glass base material heat radiation unit system with a thick film circuit chip for heat supply. The system comprises a first glass layer, a second glass layer and the thick film circuit chip, wherein the thick film circuit chip is clamped between the first glass layer and the second glass layer. The first glass layer and the second glass layer are made of tempered glass. The thick film circuit chip comprises a thick film circuit and a control chip, wherein the thick film circuit is connected to the control chip, and the film thickness of thick film circuit is greater than 10 micrometers. The system has the beneficial effects that nearly all the electric energy is directly converted into the heat energy by adopting the thick film circuit, heat conduction can be carried out fast, the heat can be released to all indoor space, components of indoor water molecules can be prevented from being destroyed, reasonable temperature and humidity can be maintained indoors, constant-temperature heat supply can be realized, the structure is simple and the practicability is high.

Description

technical field [0001] The invention relates to the field of heating and heating, in particular to a thick-film circuit chip glass-ceramic substrate heat dissipation unit system for heating. Background technique [0002] In recent years, the problem of air pollution has become more and more serious, and smog has occurred frequently. As a large developing country, my country will still face the serious situation of increasing air pollution for a long time to come. With the continuous increase of energy demand, the pollution problem caused by the smoke emission caused by coal and oil heating and heating has become increasingly prominent. The quality of life continues to improve, the living environment continues to improve, the requirements for quality of life continue to increase, and air pollution is becoming more and more serious. The development of clean, efficient, energy-saving, and cost-effective environmental protection heating and heating equipment and technology is t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): F24D13/02F24D19/10H05B3/00
CPCF24D13/02F24D19/1096H05B3/0019H05B2203/035Y02B30/00
Inventor 翼嘉道
Owner 冀嘉道
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap