Production technique of half-hole PCB

A technology of PCB board and manufacturing process, which is applied in the direction of printed circuit manufacturing, electrical connection formation of printed components, and sequence of processing steps. Avoid the pull-off effect

Inactive Publication Date: 2017-05-31
JIANGSU BOMIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing conventional method of making half-hole plates is as follows: material cutting->inner layer circuit making inner layer circuit making->pressing->drilling round holes->outer conductive film making->copper plating...

Method used

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  • Production technique of half-hole PCB
  • Production technique of half-hole PCB
  • Production technique of half-hole PCB

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Embodiment Construction

[0023] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0024] Please refer to figure 1 As shown, in a specific embodiment, the implementation steps of the manufacturing process of the half-hole PCB board provided by the invention are as follows:

[0025] S1. Material cutting: select a substrate with a thickness of 1mm and a size of 615×690mm, and the upper and lower surfaces of the material-cut substrate are covered with a copper layer with a thickness of 1 / 3OZ;

[0026] S2. Fabrication of the inner layer circuit: fabricate the inner layer circuit on the cut-out substrate to obtain a circuit board;

[0027] S3. Lamination: laminate the upper and lower sides of the circuit board with prepreg and copper foil respectively, and then perform lamination to obtain a multi-layer PCB board; ...

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Abstract

The invention discloses a production technique of a half-hole PCB. The production technique comprises the following steps: material cutting by cutting a basal plate whose upper and lower surfaces are covered in copper layers; inner circuit manufacturing by manufacturing an inner circuit on the cut basal plate to get a circuit board; lamination by covering the upper and lower surfaces of the circuit board with a prepreg and copper foil, and conducting lamination to get a multilayer circuit board; round hole drilling by drilling round holes in scheduled positions for formation of half holes on the surface or the edges of the PCB; outer conducting film manufacturing by manufacturing macromolecular conducting films on the upper and lower surfaces of the PCB by a macromolecular conductive polymerization technique; half hole milling by milling the round holes into half holes; copperizing by electrically copperizing the half holes on the PCB; and outer layer photoetching and etching by performing photoetching and etching on the upper and lower surfaces of the PCB. The manufacturing of the half holes is finished before the outer layer photoetching and etching, so as to avoid the situation where hole-wall copper is pulled out when the half holes are being formed, and increase the yield rate of the products.

Description

technical field [0001] The invention relates to a manufacturing process of a PCB board, in particular to a manufacturing process of a half hole of a PCB board. Background technique [0002] PCB board is the abbreviation of printed circuit board. A via hole is a hole on a multilayer PCB board that is only used for conductive interconnection between layers, and is generally no longer used for plug-in soldering of component feet. This type of hole is plated with a layer of copper in the hole through the "copper sinking" process to conduct electricity. This type of through hole includes "full through hole" that runs through the entire board, "blind hole" that only connects to the board surface but does not penetrate completely, and "buried through hole" that is not connected to the board surface but buried inside the board. "Wait. Such complex partial through-holes are manufactured by sequential pressing. [0003] As a kind of conduction hole, the half hole not only retains ...

Claims

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Application Information

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IPC IPC(8): H05K3/42
CPCH05K3/429H05K2201/095H05K2203/14
Inventor 黄继茂刘万杰
Owner JIANGSU BOMIN ELECTRONICS
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