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Method for ameliorating lateral erosion of flexible hollowed-out circuit board

A circuit board and side erosion technology, which is applied in the processing field of flexible hollow circuit boards, can solve the problems of circuit boards being unqualified, unable to be reused, and reduce production efficiency, so as to reduce the occurrence of unqualified products, improve side erosion, and improve The effect of production efficiency

Inactive Publication Date: 2015-03-25
ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Circuit boards with side erosion are substandard products and cannot be reused, which greatly reduces production efficiency and increases production costs
In actual production, the existing process cannot avoid the occurrence of side erosion, and there is an urgent need for a method that can solve side erosion

Method used

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  • Method for ameliorating lateral erosion of flexible hollowed-out circuit board
  • Method for ameliorating lateral erosion of flexible hollowed-out circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] As shown in the attached figure, it is a method for improving the side erosion of flexible hollow circuit boards. The circuit board first performs the processes of cutting, drilling, and covering film as required, and then prints a wet film on the window opening: according to the circuit board window opening According to the situation of the area, make the corresponding screen printing screen, align the prepared screen printing screen with the circuit board, so that the window of the circuit board is covered, and then print with a wet film. The wet film mentioned here is an anti-etching ink. . After the window opening of the circuit board is completely covered by the anti-etching ink, let it stand for 10 minutes, and then bake at a temperature of 75° C. for 15 minutes to dry the anti-etching ink and evenly cover the window opening of the circuit board.

[0015] In the ensuing etching process, since the window of the circuit board is evenly covered by the anti-etching in...

Embodiment 2

[0017] The difference from Example 1 is that after the window opening of the circuit board is completely covered by the anti-etching ink, it is left to stand for 10 minutes, and then baked at a temperature of 80° C. for 10 minutes.

Embodiment 3

[0019] The difference from Example 1 is that after the window opening of the circuit board is completely covered by the anti-etching ink, it is left to stand for 10 minutes, and then baked at a temperature of 78° C. for 13 minutes.

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PUM

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Abstract

The invention discloses a method for ameliorating lateral erosion of a flexible hollowed-out circuit board. A wet film printing procedure is added before a conventional dry film pressing procedure, and the wet film printing procedure includes the following steps that (a) a silk screen printing plate needed for the circuit board is manufactured; (b) the silk screen printing plate is aligned with the circuit board; (c) a wet film is fed for printing, so that the windowed position of the circuit board is covered with the wet film; (d) standing is conducted; (e) the circuit board covered with the wet film is placed in an oven to be baked. The method has the advantages of thoroughly ameliorating lateral erosion of the flexible hollowed-out circuit board, improving production efficiency, reducing the probability of unqualified products and effectively lowering production cost.

Description

technical field [0001] The invention relates to a processing method of a flexible hollow circuit board, in particular to a method for improving side erosion of a flexible hollow circuit board. Background technique [0002] With the increasing development of electronic devices, more and more electronic devices use flexible hollow circuit boards in order to realize functions such as bending and rotation. At present, during the production process of the flexible hollow circuit board, after the cover film is pasted, when the dry film is pressed, if the attached figure 1 As shown, due to the height difference at the window opening of the cover film, the dry film cannot completely fill the height difference at the window opening. In the subsequent etching process, the unfilled area will be etched, which is commonly referred to as side etching. Phenomenon. [0003] Circuit boards with side erosion are substandard products and cannot be reused, which greatly reduces production eff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/0017H05K2203/14
Inventor 王俊涛
Owner ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD
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